| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/14/2011 | US20110169130 Semiconductor device having high frequency wiring and dummy metal layer at multilayer wiring structure |
| 07/14/2011 | US20110169129 Anti-fuse device structure and electroplating circuit structure and method |
| 07/14/2011 | US20110169128 Semiconductor device and a method of manufacturing the same |
| 07/14/2011 | US20110169127 Structure for interconnect structure containing various capping materials for electrical fuse and other related applications |
| 07/14/2011 | US20110169122 Semiconductor device having backside redistribution layers and method for fabricating the same |
| 07/14/2011 | US20110169115 Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products |
| 07/14/2011 | US20110169022 Board module and method of manufacturing same |
| 07/14/2011 | US20110169003 Contact structure and semiconductor device |
| 07/14/2011 | US20110168999 Semiconductor wire grid, display apparatus having the same, and method of manufacturing the display apparatus |
| 07/14/2011 | US20110168995 Accurate Capacitance Measurement for Ultra Large Scale Integrated Circuits |
| 07/14/2011 | US20110168763 Nanotube modified solder thermal intermediate structure, systems, and methods |
| 07/14/2011 | DE102010061573A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same |
| 07/14/2011 | DE102010000035A1 Electronic assembly i.e. lamp, has electronic power elements soldered or welded with contacting surface at surface element, and connections soldered on or welded at assigned conductive strips or strip ends of printed circuit board |
| 07/14/2011 | DE102009014993B4 Verfahren zum elektrischen Kontaktieren eines elektronischen Bauelements Method for electrically contacting an electronic component |
| 07/14/2011 | DE102005048361B4 Verfahren zur lokalen Beschichtung von Halbleiterschaltungen und diskreten Bauelementen mit einer thermischen SiO2-Schicht, deren Oberflächen Gebiete mit nadelförmigen Strukturen in Nanometerdimensionen enthalten A method for local coating of semiconductor circuits and discrete components with a thermal SiO2 layer, the surfaces of which contain areas with acicular structures of nanometer dimensions |
| 07/14/2011 | DE102005007486B4 Halbleiterbauteil mit oberflächenmontierbarem Gehäuse, Montageanordnung und Verfahren zur Herstellung desselben Of the same semiconductor device with oberflächenmontierbarem housing, mounting arrangement and method for producing |
| 07/13/2011 | EP2343956A1 Copper paste and wiring board using the same |
| 07/13/2011 | EP2343802A1 Piezoelectric device and method for manufacturing same |
| 07/13/2011 | EP2343736A2 Heat sink and method for fixing heat sink |
| 07/13/2011 | EP2343735A1 Heating element temperature estimation apparatus |
| 07/13/2011 | EP2343734A1 Semiconductor device and method for manufacturing the same |
| 07/13/2011 | EP2343709A2 Nanotube films and articles |
| 07/13/2011 | EP2343332A1 Heat conducting sheet, manufacturing method thereof, and heat radiator that utilizes same |
| 07/13/2011 | EP2342958A2 Method for integrating an electronic component into a printed circuit board |
| 07/13/2011 | EP2342954A1 Electrical circuit configuration having overlapping capacitances |
| 07/13/2011 | EP2342805A1 Power tool |
| 07/13/2011 | EP2342754A1 Display device |
| 07/13/2011 | EP2342748A2 Low cost die-to-wafer alignment/bond for 3d ic stacking |
| 07/13/2011 | EP2342747A2 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate |
| 07/13/2011 | EP2342746A2 Double broken seal ring |
| 07/13/2011 | EP2342743A1 Discontinuous/non-uniform metal cap structure and process for interconnect integration |
| 07/13/2011 | EP2342160A2 Inertial sensor with dual cavity package and method of fabrication |
| 07/13/2011 | EP1514459B1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |
| 07/13/2011 | EP1387407B1 Semiconductor device and its manufacturing method |
| 07/13/2011 | CN201898453U Triphase full-bridge contravariant modular structure formed by integrating single-tube power tube |
| 07/13/2011 | CN201898447U Three-phase bridge rectifier module with U-shaped buffer electrode |
| 07/13/2011 | CN201898134U High-voltage fast-recovery rectifying silicon stack |
| 07/13/2011 | CN201898133U Combined positioning structure of heat radiator and heat source |
| 07/13/2011 | CN201898132U 18W lead frame |
| 07/13/2011 | CN201898131U High-power transistor base with stress-relief insulating ring |
| 07/13/2011 | CN201898130U Semiconductor chip packaging structure |
| 07/13/2011 | CN201898129U Inside and outside heat exchanging water-cooling system for explosion environment |
| 07/13/2011 | CN201898128U Automatic water replenishing system for water cooling system of high-voltage direct-current transmission valve bank |
| 07/13/2011 | CN201898127U Radiator |
| 07/13/2011 | CN201898126U Radiator |
| 07/13/2011 | CN201898125U Radiator with piled and staggered fins |
| 07/13/2011 | CN201898124U Heat-conducting double-sided rigid-flex substrate |
| 07/13/2011 | CN201898123U FBGA (fine-pitch ball grid array) packaging IC (integrated circuit) wafer protecting frame |
| 07/13/2011 | CN201898122U Large-power transistor seat with solid packaging steel ring |
| 07/13/2011 | CN201897976U Novel control power supply (CPS) wire |
| 07/13/2011 | CN1988113B Process for selective masking of iii-n layers and for the preparation of free-standing iii-n layers or of devices, and products obtained thereby |
| 07/13/2011 | CN1832151B Underlay with pattern and method of manufacturing the same, semiconductor device and method of manufacturing the same |
| 07/13/2011 | CN1593075B Electrically isolated module |
| 07/13/2011 | CN102124648A Piezoelectric device and method for manufacturing same |
| 07/13/2011 | CN102124564A Nonvolatile semiconductor storage device and manufacturing method therefor |
| 07/13/2011 | CN102124563A Substrate on which element is to be mounted, semiconductor module, semiconductor device, method for producing substrate on which element is to be mounted, method for manufacturing semiconductor device, and portable device |
| 07/13/2011 | CN102124561A ESD networks for solder bump integrated circuits |
| 07/13/2011 | CN102124560A Method for the manufacture of an electronic assembly |
| 07/13/2011 | CN102124559A Conformal adhesion promoter liner for metal interconnects |
| 07/13/2011 | CN102124558A Three dimensional semiconductor device, method of manufacturing the same and electrical cutoff method for using fuse pattern of the same |
| 07/13/2011 | CN102124551A Process for through silicon via filling |
| 07/13/2011 | CN102124383A Energy dissipating packages for high power operation of optical fiber components |
| 07/13/2011 | CN102122671A Rear through-hole interconnected wafer level MOSFET (metal oxide semiconductor field effect transistor) packaging structure and implementation method |
| 07/13/2011 | CN102122670A Groove-interconnected wafer level MOSFET encapsulation structure and implementation method |
| 07/13/2011 | CN102122657A Electrostatic discharge (ESD) protection structure of integrated circuit |
| 07/13/2011 | CN102122651A Semiconductor device and method for manufacturing the same |
| 07/13/2011 | CN102122650A Stacking structure of metal-contact window |
| 07/13/2011 | CN102122649A Display device and manufacturing method of the same |
| 07/13/2011 | CN102122648A Heat pipe radiator |
| 07/13/2011 | CN102122647A Carbon interface composite heat radiation structure |
| 07/13/2011 | CN102122646A Wafer packaging device and chip packaging unit |
| 07/13/2011 | CN102122637A Detection structure, detection method and method for forming detection structure |
| 07/13/2011 | CN102122633A Method for manufacturing contact hole |
| 07/13/2011 | CN102122624A Wafer packaging method |
| 07/13/2011 | CN102122622A Light-emitting diode module, substrate used for light-emitting diode module and manufacturing method thereof |
| 07/13/2011 | CN102122621A Method for tightly combining heat radiation fin with heat pipe |
| 07/13/2011 | CN102122611A Integrated circuit layout for improving matching of capacitors and layout method |
| 07/13/2011 | CN102122307A Method for recording version number of chip |
| 07/13/2011 | CN102121802A Plate-type pulsating heat pipe with double-side grooves |
| 07/13/2011 | CN102121077A Gold bonding wire and preparation method thereof |
| 07/13/2011 | CN102120295A Radiation component and manufacturing method thereof |
| 07/13/2011 | CN101685807B Heat radiating type semiconductor packaging element and manufacture method thereof |
| 07/13/2011 | CN101641785B Microcircuit package having ductile layer |
| 07/13/2011 | CN101620899B Hanging anchoring mechanism of series compensation platform water pipe insulator |
| 07/13/2011 | CN101578027B Electronic device and radiating unit thereof |
| 07/13/2011 | CN101546738B A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate |
| 07/13/2011 | CN101540301B Hermetic sealing apparatus and hermetic sealing method using frit |
| 07/13/2011 | CN101536184B Bond pad structure and method for producing same |
| 07/13/2011 | CN101521192B Package structure of light emitting diode and the packaging method thereof |
| 07/13/2011 | CN101488473B Method for making semiconductor structures implementing sacrificial material |
| 07/13/2011 | CN101478024B Silicon encapsulation unit for LED |
| 07/13/2011 | CN101471335B Light emitting module and method for manufacturing the same |
| 07/13/2011 | CN101471285B Semiconductor device and method for manufacturing the device |
| 07/13/2011 | CN101459160B Diode needle contact member for voltage stabilization |
| 07/13/2011 | CN101395708B 半导体装置 Semiconductor device |
| 07/13/2011 | CN101393871B Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 07/13/2011 | CN101364580B Package and semiconductor device |
| 07/13/2011 | CN101345220B Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
| 07/13/2011 | CN101261967B Enhanced encapsulation carrier board and its making method |
| 07/13/2011 | CN101252126B Semiconductor element |