| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/19/2011 | US7982312 Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning |
| 07/19/2011 | US7982311 Solder limiting layer for integrated circuit die copper bumps |
| 07/19/2011 | US7982310 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus |
| 07/19/2011 | US7982309 includes a substrate including an active area and a gas phase deposited packaging material encapsulating the active area |
| 07/19/2011 | US7982308 Light-emitting diode packaging structure and light-emitting diode module |
| 07/19/2011 | US7982307 Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate |
| 07/19/2011 | US7982306 Stackable semiconductor package |
| 07/19/2011 | US7982305 Integrated circuit package including a three-dimensional fan-out / fan-in signal routing |
| 07/19/2011 | US7982304 Chip package structure |
| 07/19/2011 | US7982303 Semiconductor device and communication method |
| 07/19/2011 | US7982302 Power semiconductor module with control functionality and integrated transformer |
| 07/19/2011 | US7982301 Semiconductor device |
| 07/19/2011 | US7982300 Stackable layer containing ball grid array package |
| 07/19/2011 | US7982299 Power semiconductor module |
| 07/19/2011 | US7982298 Package in package semiconductor device |
| 07/19/2011 | US7982297 Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same |
| 07/19/2011 | US7982296 Methods and devices for fabricating and assembling printable semiconductor elements |
| 07/19/2011 | US7982295 Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device |
| 07/19/2011 | US7982294 Semiconductor die with mask programmable interface selection |
| 07/19/2011 | US7982293 Multi-chip package including die paddle with steps |
| 07/19/2011 | US7982292 Semiconductor device |
| 07/19/2011 | US7982291 Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
| 07/19/2011 | US7982290 Contact spring application to semiconductor devices |
| 07/19/2011 | US7982285 Antifuse structure having an integrated heating element |
| 07/19/2011 | US7982279 Method of manufacturing stacked-type semiconductor device |
| 07/19/2011 | US7982271 Semiconductor device |
| 07/19/2011 | US7982265 Trenched shield gate power semiconductor devices and methods of manufacture |
| 07/19/2011 | US7982263 Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrate |
| 07/19/2011 | US7982245 Circuit with fuse/anti-fuse transistor with selectively damaged gate insulating layer |
| 07/19/2011 | US7982235 Light emitting device, package and lead frame |
| 07/19/2011 | US7981977 Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler |
| 07/19/2011 | US7981807 Manufacturing method of semiconductor device with smoothing |
| 07/19/2011 | US7981792 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 07/19/2011 | US7981769 Solid-state imaging device and method for manufacturing the same |
| 07/19/2011 | US7981761 Method of manufacturing semiconductor device having MIM capacitor |
| 07/19/2011 | US7981732 Programming of laser fuse |
| 07/19/2011 | US7981731 Method of forming a high impedance antifuse |
| 07/19/2011 | US7981730 Integrated conformal shielding method and process using redistributed chip packaging |
| 07/19/2011 | US7981698 Removal of integrated circuits from packages |
| 07/19/2011 | US7981574 Reticle, and method of laying out wirings and vias |
| 07/19/2011 | US7981245 Forming plated through hole; surface roughness facilitates deposition of conductive metal; shrinkage inhibition |
| 07/14/2011 | WO2011085260A2 Electronic devices and components for high efficiency power circuits |
| 07/14/2011 | WO2011084706A2 Apparatus and method for controlling semiconductor die warpage |
| 07/14/2011 | WO2011084235A2 Glass core substrate for integrated circuit devices and methods of making the same |
| 07/14/2011 | WO2011084216A2 Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
| 07/14/2011 | WO2011084203A1 Method and apparatus for removing heat from electronic devices using synthetic jets |
| 07/14/2011 | WO2011083753A1 Electronic component |
| 07/14/2011 | WO2011083703A1 Led module device and method for manufacturing same |
| 07/14/2011 | WO2011083652A1 Actinic-radiation curable composition and uses thereof |
| 07/14/2011 | WO2011083578A1 Semiconductor module |
| 07/14/2011 | WO2011083368A1 Delamination resistant semiconductor devices |
| 07/14/2011 | WO2011083052A1 Thermal plug for use with a heat sink and method of assembling same |
| 07/14/2011 | WO2011082874A1 Tunnel junction via |
| 07/14/2011 | WO2011061695A3 Apparatus and method for processing a substrate |
| 07/14/2011 | WO2011028042A3 Packing material containing tungsten and integrated package |
| 07/14/2011 | US20110171828 Semiconductor device with a line and method of fabrication thereof |
| 07/14/2011 | US20110171825 Method of Fabricating Integrated Circuitry |
| 07/14/2011 | US20110171824 Semiconductor device and method for fabricating the same |
| 07/14/2011 | US20110171780 Semiconductor device and manufacturing method thereof |
| 07/14/2011 | US20110170328 Semiconductor memory device |
| 07/14/2011 | US20110169564 Integrated Circuit |
| 07/14/2011 | US20110169562 System on chip power management through package configuration |
| 07/14/2011 | US20110169175 Overlay mark |
| 07/14/2011 | US20110169174 Method for fabricating semiconductor device |
| 07/14/2011 | US20110169173 Wiring substrate for a semiconductor chip and semiconducotor package having the wiring substrate |
| 07/14/2011 | US20110169172 Semiconductor Device having dual damascene structure |
| 07/14/2011 | US20110169171 Dual Interconnection in Stacked Memory and Controller Module |
| 07/14/2011 | US20110169170 Semiconductor device |
| 07/14/2011 | US20110169169 Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas |
| 07/14/2011 | US20110169168 Through-silicon via formed with a post passivation interconnect structure |
| 07/14/2011 | US20110169167 Grid array connection device and method |
| 07/14/2011 | US20110169166 Semiconductor device sealed in a resin section and method for manufacturing the same |
| 07/14/2011 | US20110169165 Semiconductor device |
| 07/14/2011 | US20110169164 Wiring substrate, manufacturing method thereof, and semiconductor package |
| 07/14/2011 | US20110169163 Attaching passive components to a semiconductor package |
| 07/14/2011 | US20110169162 Integrated Circuit Module and Multichip Circuit Module Comprising an Integrated Circuit Module of This Type |
| 07/14/2011 | US20110169161 Semiconductor device |
| 07/14/2011 | US20110169160 Real time monitoring of indium bump reflow and oxide removal enabling optimization of indium bump morphology |
| 07/14/2011 | US20110169159 Chip package and fabrication method thereof |
| 07/14/2011 | US20110169158 Solder Pillars in Flip Chip Assembly |
| 07/14/2011 | US20110169157 Substrate and flip chip package with gradational pad pitches |
| 07/14/2011 | US20110169156 Semiconductor package and manufacturing method thereof and encapsulating method thereof |
| 07/14/2011 | US20110169155 Semiconductor apparatus with lid bonded on wiring board and method of manufacturing the same |
| 07/14/2011 | US20110169154 Microelectronic devices and methods for manufacturing microelectronic devices |
| 07/14/2011 | US20110169153 Lead frame substrate and method of manufacturing the same |
| 07/14/2011 | US20110169152 Semiconductor package |
| 07/14/2011 | US20110169151 Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof |
| 07/14/2011 | US20110169150 Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof |
| 07/14/2011 | US20110169149 Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof |
| 07/14/2011 | US20110169148 Tape wiring substrate and tape package using the same |
| 07/14/2011 | US20110169147 Chip package structure and package substrate |
| 07/14/2011 | US20110169146 Contactless communication medium |
| 07/14/2011 | US20110169145 Manufacturing method of lead frame substrate and semiconductor apparatus |
| 07/14/2011 | US20110169144 Die package including multiple dies and lead orientation |
| 07/14/2011 | US20110169143 Method for establishing and closing a trench of a semiconductor component |
| 07/14/2011 | US20110169142 Semiconductor device and method for manufacturing the same |
| 07/14/2011 | US20110169141 Insulating layers on different semiconductor materials |
| 07/14/2011 | US20110169140 Reclaiming usable integrated circuit chip area near through-silicon vias |
| 07/14/2011 | US20110169139 Chip package and fabrication method thereof |
| 07/14/2011 | US20110169133 Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate |