| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/20/2011 | CN102130093A Wiring circuit structure and manufacturing method for semiconductor device using the structure |
| 07/20/2011 | CN102130092A Fuse device and preparation method thereof |
| 07/20/2011 | CN102130091A Composite through-hole interconnecting structure for integrated circuit chip and preparation method thereof |
| 07/20/2011 | CN102130090A Chip package and method for fabricating the same |
| 07/20/2011 | CN102130089A Chip package and method for fabricating the same |
| 07/20/2011 | CN102130088A Semiconductor packaging structure and making method thereof |
| 07/20/2011 | CN102130087A Three-dimensional integrated circuit metallic conductor rail and preparation method thereof |
| 07/20/2011 | CN102130086A Improvement structure of high heat-dispensing plate low-cost lead frame |
| 07/20/2011 | CN102130085A Semiconductor package with electrical connection structure and manufacturing method thereof |
| 07/20/2011 | CN102130084A Semiconductor chip assembly with a post/base heat spreader and a signal post |
| 07/20/2011 | CN102130083A Array-type fine-pitch connector |
| 07/20/2011 | CN102130082A Power semiconductor module |
| 07/20/2011 | CN102130081A Heat-radiating device and air current generating device thereof |
| 07/20/2011 | CN102130080A Heat radiation device |
| 07/20/2011 | CN102130079A Rapid heat conduction and heat dissipation device |
| 07/20/2011 | CN102130078A Heat-conducting insulated composite film and chip stacking structures |
| 07/20/2011 | CN102130077A Soaking plate with single layer of diamond particles and correlation method thereof |
| 07/20/2011 | CN102130076A Thermoelectric computer chip radiator |
| 07/20/2011 | CN102130075A Radial heat radiator |
| 07/20/2011 | CN102130074A Heat radiating member and circuit board with the same |
| 07/20/2011 | CN102130073A Advanced quad flat non-leaded package structure and manufacturing method thereof |
| 07/20/2011 | CN102130072A 承载板及其制法 Bearing plate Jiqizhifa |
| 07/20/2011 | CN102130071A Chip package and fabrication method thereof |
| 07/20/2011 | CN102130070A Power electronics substrate for direct substrate cooling |
| 07/20/2011 | CN102130069A Ag-base alloy lead wire for semiconductor packaging |
| 07/20/2011 | CN102130068A Alloy-type bonding wire with composite plating on surface |
| 07/20/2011 | CN102130067A Surface palladium-plated bonding brass wire |
| 07/20/2011 | CN102130066A Wafer-level chip scale package and method for fabricating and using the same |
| 07/20/2011 | CN102130046A Interfacial layers for electromigration resistance improvement in damascene interconnects |
| 07/20/2011 | CN102130041A Semiconductor device and semiconductor technique thereof |
| 07/20/2011 | CN102130027A 半导体器件 Semiconductor devices |
| 07/20/2011 | CN102130025A Wafer, processing method thereof and method for manufacturing semiconductor device |
| 07/20/2011 | CN102130021A Silicon carbide power module and packaging method thereof |
| 07/20/2011 | CN102130018A Chip radiation method, and related device and system |
| 07/20/2011 | CN102129977A High-resistance resistor and method for realizing same |
| 07/20/2011 | CN102129969A Method of forming an em protected semiconductor die |
| 07/20/2011 | CN102129966A Methods of forming a thermal conduction region in a semiconductor structure and structures resulting therefrom |
| 07/20/2011 | CN102129961A Manufacturing method of chip label |
| 07/20/2011 | CN102128552A Single-sided corrugated plate type pulsating heat pipe |
| 07/20/2011 | CN102127663A Gold bonding wire and preparation method thereof |
| 07/20/2011 | CN102127391A Radiation-proof composite material and preparation method thereof |
| 07/20/2011 | CN102127288A Flexible epoxy plastic package material |
| 07/20/2011 | CN101901789B Internal insulation type plastic semiconductor element and preparation method thereof |
| 07/20/2011 | CN101826503B Sinking pad and multi-bump pad lead frame structure and method for carving before plating |
| 07/20/2011 | CN101814443B Chip design method for multi-chip module of high-performance processor with optical interface |
| 07/20/2011 | CN101777556B Trench large-power MOS part and manufacturing method thereof |
| 07/20/2011 | CN101777504B System level packaging method of flip chip and attached passive element on support plate chip |
| 07/20/2011 | CN101771043B Complementary SCR structure triggered with assistance of Zener diode |
| 07/20/2011 | CN101728351B Layout of bonding pads |
| 07/20/2011 | CN101707201B Bottom guide pixel structure |
| 07/20/2011 | CN101673720B Window type semiconductor packaging structure capable of avoiding stripping in mold flow inlet |
| 07/20/2011 | CN101661941B TFT-LCD array substrate structure and preparation method thereof |
| 07/20/2011 | CN101652857B Cooling body |
| 07/20/2011 | CN101640194B Semiconductor device and method of designing the same |
| 07/20/2011 | CN101632173B Electronic passive device |
| 07/20/2011 | CN101595558B Method for manufacturing semiconductor device, optical pickup module and semiconductor device |
| 07/20/2011 | CN101587907B Production method of low junction capacitance overvoltage protection thyristor apparatus chip |
| 07/20/2011 | CN101572285B Light-emitting device packageing and method for fabricating the same |
| 07/20/2011 | CN101567367B Semiconductor device |
| 07/20/2011 | CN101529606B Thermoelectric element and thermoelectric module |
| 07/20/2011 | CN101499458B Test structure and method for detecting disc trap and corrosion caused by CMP |
| 07/20/2011 | CN101494206B Thyristor group valve acaleph matched main tube and manufacturing technology |
| 07/20/2011 | CN101488489B Conductive line structure and the method of forming the same |
| 07/20/2011 | CN101484990B Semiconductor module and semiconductor module manufacturing method |
| 07/20/2011 | CN101467249B Array package and its manufacture method |
| 07/20/2011 | CN101452914B Electrostatic prevention protection device construction having silicon controlled rectifier triggering current |
| 07/20/2011 | CN101442062B Electronic assembly for image sensor device |
| 07/20/2011 | CN101431879B Heat pipe intensified electronic device radiator |
| 07/20/2011 | CN101429323B Encapsulating epoxy resin composition, and electronic parts device using the same |
| 07/20/2011 | CN101409315B Upside-down mounting LED chip |
| 07/20/2011 | CN101364576B Radiator for semi-conductor electronic device |
| 07/20/2011 | CN101359657B Multi-die dc-dc boost power converter with efficient packaging |
| 07/20/2011 | CN101335255B Integrated circuit construction |
| 07/20/2011 | CN101281897B Matrix type structure for testing integrality of gate oxic horizon |
| 07/20/2011 | CN101246863B Conductive structure for semiconductor integrated circuit and method for forming the same |
| 07/20/2011 | CN101236971B Thin film transistor substrate and display device therefor |
| 07/20/2011 | CN101228624B Dry etchback of interconnect contacts |
| 07/20/2011 | CN101211903B RF module package structure and its forming method |
| 07/20/2011 | CN101211878B Interconnection structure and its forming method |
| 07/20/2011 | CN101174609B Semiconductor integrated circuit and method of manufacturing the same |
| 07/20/2011 | CN101166792B Curable silicone composition and electronic components |
| 07/20/2011 | CN101123268B Display device and manufacturing method thereof |
| 07/20/2011 | CN101071804B Semiconductor system |
| 07/19/2011 | US7984409 Structures incorporating interconnect structures with improved electromigration resistance |
| 07/19/2011 | US7984390 Data processing method in semiconductor device, program of the same, and manufacturing method of semiconductor device |
| 07/19/2011 | US7983044 Electrical apparatus, cooling system therefor, and electric vehicle |
| 07/19/2011 | US7983042 Thermal management system and method for thin membrane type antennas |
| 07/19/2011 | US7983040 Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
| 07/19/2011 | US7982574 Integrated transformer |
| 07/19/2011 | US7982460 Magnetic sensor module |
| 07/19/2011 | US7982322 Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same |
| 07/19/2011 | US7982321 Apparatus and method for preventing configurable system-on-a-chip integrated circuits from beginning I/O limited |
| 07/19/2011 | US7982320 Arrangement for solder bump formation on wafers |
| 07/19/2011 | US7982319 Semiconductor device with improved resin configuration |
| 07/19/2011 | US7982318 Device including contact structure and method of forming the same |
| 07/19/2011 | US7982317 Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module |
| 07/19/2011 | US7982316 Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereof |
| 07/19/2011 | US7982315 Semiconductor structure and method of making the same |
| 07/19/2011 | US7982314 Semiconductor integrated circuit device |
| 07/19/2011 | US7982313 Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability |