Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2014
11/18/2014USRE45245 Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
11/18/2014US8891567 Heat sink for a pulsed high-power laser diode
11/18/2014US8891246 System-in-package using embedded-die coreless substrates, and processes of forming same
11/18/2014US8891245 Printed wiring board
11/18/2014US8891240 Apparatus and method for cooling a semiconductor device
11/18/2014US8891234 Electronic apparatus with heat dissipation module
11/18/2014US8890989 Solid-state imaging device and method of manufacturing the same
11/18/2014US8890638 Stub-tuned wirebond package
11/18/2014US8890607 Stacked chip system
11/18/2014US8890561 TCP-type semiconductor device and method of testing thereof
11/18/2014US8890560 Crack sensors for semiconductor devices
11/18/2014US8890551 Test key structure and method for measuring step height by such test key structure
11/18/2014US8890408 Method and apparatus for coupling an active display portion and substrate
11/18/2014US8890368 Systems and methods for power transfer based on resonance coupling of inductors
11/18/2014US8890339 Self-defining, low capacitance wire bond pad
11/18/2014US8890338 Method of identifying and/or programming an integrated circuit
11/18/2014US8890337 Column and stacking balls package fabrication method and structure
11/18/2014US8890336 Cylindrical bonding structure and method of manufacture
11/18/2014US8890335 Semiconductor device
11/18/2014US8890334 Semiconductor device, a mobile communication device, and a method for manufacturing a semiconductor device
11/18/2014US8890330 Semiconductor packages and electronic systems including the same
11/18/2014US8890329 Semiconductor device
11/18/2014US8890328 Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
11/18/2014US8890327 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
11/18/2014US8890326 Easily assembled chip assembly and chip assembling method
11/18/2014US8890325 Heterojunction structures of different substrates joined and methods of fabricating the same
11/18/2014US8890324 Semiconductor structure having a through substrate via (TSV) and method for forming
11/18/2014US8890322 Semiconductor apparatus and method of manufacturing semiconductor apparatus
11/18/2014US8890321 Method of semiconducotr integrated circuit fabrication
11/18/2014US8890320 Via arrangement and semiconductor device with the via arrangement
11/18/2014US8890319 Chip to package interface
11/18/2014US8890318 Middle of line structures
11/18/2014US8890316 Implementing decoupling devices inside a TSV DRAM stack
11/18/2014US8890315 Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure
11/18/2014US8890314 Package configurations for low EMI circuits
11/18/2014US8890313 Through-hole electronic device with double heat-sink
11/18/2014US8890312 Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use
11/18/2014US8890311 Power conversion device
11/18/2014US8890310 Power module package having excellent heat sink emission capability and method for manufacturing the same
11/18/2014US8890309 Circuit module and method of producing circuit module
11/18/2014US8890308 Integrated circuit package and method of forming the same
11/18/2014US8890306 Light-emitting diode
11/18/2014US8890305 Semiconductor device
11/18/2014US8890304 Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material
11/18/2014US8890303 Three-dimensional integrated circuit
11/18/2014US8890302 Hybrid package transmission line circuits
11/18/2014US8890301 Packaging and methods for packaging
11/18/2014US8890300 Discrete three-dimensional memory comprising off-die read/write-voltage generator
11/18/2014US8890299 Bonded semiconductor structures and methods of forming same
11/18/2014US8890298 Embedded package security tamper mesh
11/18/2014US8890296 Wafer level chip scale package
11/18/2014US8890294 Stack semiconductor package and manufacturing the same
11/18/2014US8890292 Method for manufacturing semiconductor device, and semiconductor substrate
11/18/2014US8890289 Semiconductor device and manufacturing method therefor
11/18/2014US8890288 MOM capacitor having local interconnect metal plates and related method
11/18/2014US8890287 Integrated nano-farad capacitors and method of formation
11/18/2014US8890286 Vertically integrated systems
11/18/2014US8890285 Vertically integrated systems
11/18/2014US8890284 Semiconductor device
11/18/2014US8890282 Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrate
11/18/2014US8890280 Trench-type semiconductor power devices
11/18/2014US8890276 Three-dimensional integrated structure capable of detecting a temperature rise
11/18/2014US8890274 Interconnect structure for CIS flip-chip bonding and methods for forming the same
11/18/2014US8890268 Chip package and fabrication method thereof
11/18/2014US8890265 Semiconductor device and microphone
11/18/2014US8890250 Electrostatic discharge protection structure
11/18/2014US8890249 Bulk FinFET ESD device
11/18/2014US8890248 Bi-directional ESD protection circuit
11/18/2014US8890237 Power semiconductor device
11/18/2014US8890228 Semiconductor device and method of manufacturing the same
11/18/2014US8890224 Semiconductor structures having a metal-insulator-metal capacitor structure
11/18/2014US8890217 Electronic device
11/18/2014US8890216 Methods and apparatus for measuring analytes using large scale FET arrays
11/18/2014US8890205 Semiconductor component and an operating method for a protective circuit against light attacks
11/18/2014US8890193 Semiconductor light emitting apparatus having stacked reflective dielectric films
11/18/2014US8890143 Method to optimize and reduce integrated circuit, package design, and verification cycle time
11/18/2014US8890139 Solution composition for passivation layer, thin film transistor array panel, and manufacturing method for thin film transistor array panel
11/18/2014US8890071 Method for assembling and hermetically sealing an encapsulating package
11/18/2014US8890002 Resin multilayer substrate and method for manufacturing the resin multilayer substrate
11/18/2014US8889811 Curable composition
11/18/2014US8889809 Cycloalkyl group-containing silicone resin composition and a method of using the same
11/18/2014US8889548 On-chip RF shields with backside redistribution lines
11/18/2014US8889546 Discontinuous/non-uniform metal cap structure and process for interconnect integration
11/18/2014US8889545 Method of manufacturing a semiconductor device
11/18/2014US8889544 Dielectric protection layer as a chemical-mechanical polishing stop layer
11/18/2014US8889511 Methods of manufacturing power semiconductor devices with trenched shielded split gate transistor
11/18/2014US8889506 Structure and method for interconnect spatial frequency doubling using selective ridges
11/18/2014US8889491 Method of forming electronic fuse line with modified cap
11/18/2014US8889489 Metal injection molded heat dissipation device
11/18/2014US8889488 Method for manufacturing semiconductor package
11/18/2014US8889485 Methods for surface attachment of flipped active componenets
11/18/2014US8889484 Apparatus and method for a component package
11/18/2014US8889483 Method of manufacturing semiconductor device including filling gap between substrates with mold resin
11/18/2014US8889482 Methods to fabricate integrated circuits by assembling components
11/18/2014US8889481 Semiconductor device and method for manufacturing the same
11/18/2014US8889458 Method of converting power using a power semiconductor module
11/18/2014US8889445 Method for manufacturing semiconductor optical device and semiconductor optical device
11/18/2014US8889441 Method for manufacturing wafer-bonded semiconductor device
11/18/2014US8889440 Light emitting diode optical emitter with transparent electrical connectors
11/18/2014US8888504 Multilevel interconnection system
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