| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/21/2011 | US20110175213 Semiconductor device and manufacturing method thereof |
| 07/21/2011 | US20110175212 Dual die semiconductor package |
| 07/21/2011 | US20110175211 Method And Structure To Reduce Soft Error Rate Susceptibility In Semiconductor Structures |
| 07/21/2011 | US20110175210 Emi shielding package structure and method for fabricating the same |
| 07/21/2011 | US20110175209 Method of forming an em protected semiconductor die |
| 07/21/2011 | US20110175207 Method for producing metal oxide layers |
| 07/21/2011 | US20110175195 Method for making high-performance rf integrated circuits |
| 07/21/2011 | US20110175193 Semiconductor device and semiconductor device manufacturing method |
| 07/21/2011 | US20110175192 Semiconductor device and method for fabricating the same |
| 07/21/2011 | US20110175179 Package structure having mems element |
| 07/21/2011 | US20110175144 Integrated Circuit Device Including Dynamic Array Section with Gate Level Having Linear Conductive Features on at Least Three Side-by-Side Lines and Uniform Line End Spacings |
| 07/21/2011 | US20110174947 Panel fastening system |
| 07/21/2011 | US20110174527 Element mounting board, semiconductor module, semiconductor device, method for fabricating the element mounting board, and method for fabricating semiconductor device |
| 07/21/2011 | US20110174353 Installation system for pv modules |
| 07/21/2011 | DE19502157B4 Trägerelement für einen IC-Baustein zum Einbau in Chipkarten A carrier element for an IC module for installation in smart card |
| 07/21/2011 | DE10335010B4 Interne Spannungsgeneratorschaltung Internal voltage generator circuit |
| 07/21/2011 | DE10333329B4 Leistungshalbleitermodul mit biegesteifer Grundplatte Power semiconductor module, rigid base plate |
| 07/21/2011 | DE10222670B4 Elektrische Vorrichtung, welche eine Mehrzahl von Metallkontaktstellen besitzt,auf die eine Metallverdrahtung gebondet ist, und ein Herstellungsverfahren davon Electrical device having a plurality of metal pads to which a metal wiring is bonded, and a manufacturing method thereof |
| 07/21/2011 | DE102011008562A1 Formation e.g. of quad no-lead frame integrated circuit package by forming solder coating on side surface of terminal of integrated circuit package while covering underside of terminal of package |
| 07/21/2011 | DE102010064378A1 Organische lichtemittierende Diodenanzeige Organic light emitting diode display |
| 07/21/2011 | DE102010060831A1 Bondmaterial mit exotherm reaktiven Heterostrukturen Bonding material with exothermic reactive heterostructures |
| 07/21/2011 | DE102010043839A1 Semiconductor device, has outer base whose upper section is arranged higher than upper section of inner base, where inner peripheral surface of outer base is in contact with outer peripheral surface of inner base |
| 07/21/2011 | DE102010001023A1 Sensorvorrichtung Sensor device |
| 07/21/2011 | DE102010000942A1 Verfahren zur Herstellung eines Gehäuseteils für ein Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls A process for producing a housing part for a power semiconductor module and method of producing a power semiconductor module |
| 07/21/2011 | DE102010000908A1 Power semiconductor module has external terminal guards that are screwed on regions of terminal tabs, so that external terminal guards are made to press contact the spring elements |
| 07/21/2011 | DE102009010196B4 Halbleiterbauelemente und Verfahren zu deren Herstellung Semiconductor devices and processes for their preparation |
| 07/20/2011 | EP2346093A2 Solar panel heat-dissipating device and related solar panel module |
| 07/20/2011 | EP2346067A2 Capacitance under a fringe capacitor of a radio frequency integrated circuit |
| 07/20/2011 | EP2345933A1 Positive photosensitive resin composition for spray coating and method for producing through electrode using same |
| 07/20/2011 | EP2345077A1 Analyte sensors, testing apparatus and manufacturing methods |
| 07/20/2011 | EP2345076A1 Surface-mountable apparatus |
| 07/20/2011 | EP2345075A1 Leadframe for electronic components |
| 07/20/2011 | EP2345074A1 Supporting body for a semiconductor component, semiconductor element and method for production of a supporting body |
| 07/20/2011 | EP2345073A1 Application of a self-assembled monolayer as an oxide inhibitor |
| 07/20/2011 | EP2345072A2 Combined diode, lead assembly incorporating an expansion joint |
| 07/20/2011 | EP2345070A1 High-yield method of exposing and contacting through-silicon vias |
| 07/20/2011 | EP1946369B1 Method of packaging semiconductor dies |
| 07/20/2011 | CN201904456U High-frequency and low-frequency mixing terminal unit |
| 07/20/2011 | CN201904375U High-power LED heat dissipation device |
| 07/20/2011 | CN201904343U Thin film transistor structure of organic light-emitting device pixel circuit |
| 07/20/2011 | CN201904337U Luminescent device with integrated circuit |
| 07/20/2011 | CN201904332U Power module applied to boost converter |
| 07/20/2011 | CN201904331U Module for power device sets |
| 07/20/2011 | CN201904330U Lead frame |
| 07/20/2011 | CN201904329U Lead frame |
| 07/20/2011 | CN201904328U Lead frame of integrated circuit |
| 07/20/2011 | CN201904327U Lead frame with selective brown oxidation layer |
| 07/20/2011 | CN201904326U Water passage pressure equalizing device for direct-current converter valve |
| 07/20/2011 | CN201904325U Fastening device and cooling device |
| 07/20/2011 | CN201904324U Radiator |
| 07/20/2011 | CN201904323U Heat homogenizing plate |
| 07/20/2011 | CN201904322U Cooling unit and packaging element integration device and cooling unit fixing structure thereof |
| 07/20/2011 | CN201904321U Heat dissipation fin module |
| 07/20/2011 | CN201904320U Mounting device for IGBT module and radiator |
| 07/20/2011 | CN201904319U Thermoelectric computer chip radiator |
| 07/20/2011 | CN201904318U Chip heat sink and chip cooling device with same |
| 07/20/2011 | CN201904317U Heat dissipation structure for MOS transistor of high-power inverter |
| 07/20/2011 | CN201904316U Commutation diode support |
| 07/20/2011 | CN201904315U Integrated circuit patch and mobile communication device comprising same |
| 07/20/2011 | CN1978122B High-temperature solder, high-temperature solder paste and power semiconductor device using same |
| 07/20/2011 | CN1957013B Resin composition for encapsulating semiconductor and semiconductor device |
| 07/20/2011 | CN1825572B Sheet for circuit substrates and sheet of a circuit substrate for displays |
| 07/20/2011 | CN102132638A Mitigation of whiskers in sn-films |
| 07/20/2011 | CN102132635A Collective ceramic substrate, manufacturing method for substrate, ceramic substrate, and ceramic circuit substrate |
| 07/20/2011 | CN102132489A Method for manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio watch |
| 07/20/2011 | CN102132409A Semiconductor device and method of manufacturing same |
| 07/20/2011 | CN102132406A Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability |
| 07/20/2011 | CN102132405A Methods and apparatus for integrated circuit having integrated energy storage device |
| 07/20/2011 | CN102132404A Semiconductor package and trace substrate with enhanced routing design flexibility and method of manufacturing thereof |
| 07/20/2011 | CN102132403A Molded ultra thin semiconductor die packages, systems using same, and methods of making same |
| 07/20/2011 | CN102132402A Thin foil semiconductor package |
| 07/20/2011 | CN102132401A Method for integrating heat transfer members, and led device |
| 07/20/2011 | CN102132400A Enhanced wire bond stability on reactive metal surfaces of a semiconductor device by encapsulation of the bond structure |
| 07/20/2011 | CN102132362A Inductor structure |
| 07/20/2011 | CN102131879A Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component |
| 07/20/2011 | CN102131874A Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device |
| 07/20/2011 | CN102131371A Heat-conducting device and electronic device using same |
| 07/20/2011 | CN102131366A Heat dissipating device and system |
| 07/20/2011 | CN102131353A Method of joining components, composite of components of an electrical circuit and electrical circuit |
| 07/20/2011 | CN102130571A Power supply package and device thereof |
| 07/20/2011 | CN102130182A Current regulation diode chip and manufacturing method thereof |
| 07/20/2011 | CN102130177A Transistors, methods of manufacturing a transistor, and electronic devices including a transistor |
| 07/20/2011 | CN102130175A 垂直式晶体管结构 Vertical transistor structure |
| 07/20/2011 | CN102130163A ESD (electrostatic discharge) high-voltage DMOS (diffused metal oxide semiconductor) device and manufacturing method thereof |
| 07/20/2011 | CN102130157A Semiconductor device with metal carrier and manufacturing method |
| 07/20/2011 | CN102130155A Silicon control rectifier structure and manufacturing method thereof |
| 07/20/2011 | CN102130154A Silicon-controlled rectifier structure and manufacturing method thereof |
| 07/20/2011 | CN102130150A Junction terminal structure of semiconductor device |
| 07/20/2011 | CN102130129A Layout structure of static random access memory (SRAM) and manufacturing method thereof |
| 07/20/2011 | CN102130121A Serial connection structure of polycrystalline silicon diodes |
| 07/20/2011 | CN102130118A Spiral inductor structure |
| 07/20/2011 | CN102130117A Spiral lamellar inductance structure and preparation method thereof |
| 07/20/2011 | CN102130116A Power module applied to booster convertor |
| 07/20/2011 | CN102130103A External storage device and method of manufacturing external storage device |
| 07/20/2011 | CN102130102A Electronic device and method of producing the same |
| 07/20/2011 | CN102130101A Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area |
| 07/20/2011 | CN102130098A Double-tube-core semiconductor package |
| 07/20/2011 | CN102130096A Test structure and test method for coupling capacitance of metal redundant fillers in integrated circuit |
| 07/20/2011 | CN102130095A Test pad structure and preparation method thereof, and wafer packaging structure and preparation method thereof |
| 07/20/2011 | CN102130094A 集成电路芯片 IC chip |