| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/27/2011 | CN101086996B Thin film transistor array panel and method of manufacturing the same |
| 07/27/2011 | CN101026122B Semiconductor device assembly and methods of manufacturing the same |
| 07/27/2011 | CN101012330B Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same |
| 07/27/2011 | CN101005729B Interconnect assembly, transducer assembly and forming method and imaging system |
| 07/27/2011 | CN101005061B Overlay key, method of forming the overlay key and method of measuring overlay accuracy using the overlay key |
| 07/26/2011 | US7986529 Mounting apparatus for heat dissipating device |
| 07/26/2011 | US7986528 Cooling plate structure of cooling apparatus and transmitter with the cooling apparatus |
| 07/26/2011 | US7986521 Heat dissipation device and computer using same |
| 07/26/2011 | US7986289 Liquid crystal display device |
| 07/26/2011 | US7986212 Fuse |
| 07/26/2011 | US7986050 Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same |
| 07/26/2011 | US7986048 Package-on-package system with through vias and method of manufacture thereof |
| 07/26/2011 | US7986047 Wire bond interconnection |
| 07/26/2011 | US7986046 Semiconductor module and method of producing the same |
| 07/26/2011 | US7986045 Semiconductor device having an increased area of one of the opposing electrode parts for preventing generation of unconnected positions the electrodes on the bonded wafers |
| 07/26/2011 | US7986044 Signal transmission arrangement and method |
| 07/26/2011 | US7986043 Integrated circuit package on package system |
| 07/26/2011 | US7986042 Method for fabrication of a semiconductor device and structure |
| 07/26/2011 | US7986041 Semiconductor device |
| 07/26/2011 | US7986040 Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices |
| 07/26/2011 | US7986039 Wafer assembly comprising MEMS wafer with polymerized siloxane attachment surface |
| 07/26/2011 | US7986038 Electronic device and lid |
| 07/26/2011 | US7986037 Low noise semiconductor device |
| 07/26/2011 | US7986036 Power/ground network of integrated circuits and arrangement thereof |
| 07/26/2011 | US7986035 Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package |
| 07/26/2011 | US7986034 Power semiconductor module and method for producing the same |
| 07/26/2011 | US7986033 Three-dimensional multichip module |
| 07/26/2011 | US7986032 Semiconductor package system with substrate having different bondable heights at lead finger tips |
| 07/26/2011 | US7986031 Resin molding part and manufacturing method thereof |
| 07/26/2011 | US7986011 Electrostatic discharge protection device |
| 07/26/2011 | US7986010 High-voltage variable breakdown voltage (BV) diode for electrostatic discharge (ESD) applications |
| 07/26/2011 | US7985991 MOSFET package |
| 07/26/2011 | US7985989 Stacked bit line dual word line nonvolatile memory |
| 07/26/2011 | US7985988 Semiconductor device having circuit blocks in a single crystal layer, and bumps on certain blocks |
| 07/26/2011 | US7985973 Semiconductor light-emitting device and method of fabricating the same |
| 07/26/2011 | US7985930 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 07/26/2011 | US7985696 Method of manufacturing semiconductor device |
| 07/26/2011 | US7985691 Etching method, semiconductor and fabricating method for the same |
| 07/26/2011 | US7985663 Method for manufacturing a semiconductor device |
| 07/26/2011 | US7985627 Thermal intermediate apparatus, systems, and methods |
| 07/26/2011 | US7985626 Manufacturing tool for wafer level package and method of placing dies |
| 07/26/2011 | US7985625 Method of manufacturing a semiconductor device |
| 07/26/2011 | US7985624 Method of manufacturing semiconductor device having plural dicing steps |
| 07/26/2011 | US7985621 Method and apparatus for making semiconductor packages |
| 07/26/2011 | US7985620 Method of fabricating via first plus via last IC interconnect |
| 07/26/2011 | US7985614 Solid-state imaging device and method for manufacturing the same |
| 07/26/2011 | US7985449 Methods for depositing metal films onto diffusion barrier layers by CVD or ALD processes |
| 07/26/2011 | US7985328 Using cell voltage as a monitor for deposition coverage |
| 07/26/2011 | US7984754 Cooling element for heat dissipation in electronic components |
| 07/21/2011 | WO2011088384A2 Solder pillars in flip chip assembly |
| 07/21/2011 | WO2011088366A1 Passive coupler between package substrate and system board |
| 07/21/2011 | WO2011087798A1 Package assembly having a semiconductor substrate |
| 07/21/2011 | WO2011087633A1 Vertical photogate (vpg) pixel structure with nanowires |
| 07/21/2011 | WO2011087485A2 Microelectronic assembly with joined bond elements having lowered inductance |
| 07/21/2011 | WO2011087174A1 Heat conduction pad and manufacturing method thereof |
| 07/21/2011 | WO2011087119A1 Semiconductor device and method for manufacturing same |
| 07/21/2011 | WO2011087117A1 Heat sink |
| 07/21/2011 | WO2011087055A1 Silicon nitride substrate, circuit substrate and electronic device using same |
| 07/21/2011 | WO2011087028A1 Substrate with integrated fins and method of manufacturing substrate with integrated fins |
| 07/21/2011 | WO2011087027A1 Liquid-cooled integrated substrate and method for manufacturing liquid-cooled integrated substrate |
| 07/21/2011 | WO2011087008A1 Curable resin composition, substance resulting from curing said composition, and optical member |
| 07/21/2011 | WO2011086971A1 Method for manufacturing semiconductor device, and film forming apparatus |
| 07/21/2011 | WO2011086797A1 Method of manufacturing substrate with built-in capacitor |
| 07/21/2011 | WO2011086641A1 Power module production method, and power module produced thereby |
| 07/21/2011 | WO2011086613A1 Semiconductor device and method for fabricating same |
| 07/21/2011 | WO2011086612A1 Semiconductor device |
| 07/21/2011 | WO2011086550A2 Semiconductor structure with heat spreader and method of its manufacture |
| 07/21/2011 | WO2011025988A3 Architecture for gas cooled parallel microchannel array cooler |
| 07/21/2011 | US20110177688 Packaging board and manufacturing method therefor, semiconductor module and manufacturing method therefor, and portable device |
| 07/21/2011 | US20110177657 Semiconductor device |
| 07/21/2011 | US20110176339 Signal Transmission Arrangement |
| 07/21/2011 | US20110176276 Cte-matched heat pipe |
| 07/21/2011 | US20110175642 Signal isolators using micro-transformers |
| 07/21/2011 | US20110175639 Semiconductor device semiconductor device testing method, and data processing system |
| 07/21/2011 | US20110175242 Method of forming a semiconductor die |
| 07/21/2011 | US20110175241 Semiconductor device and manufacturing method thereof |
| 07/21/2011 | US20110175240 Chip module |
| 07/21/2011 | US20110175239 Semiconductor device and a method of manufacturing the same |
| 07/21/2011 | US20110175238 Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip |
| 07/21/2011 | US20110175237 Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus |
| 07/21/2011 | US20110175236 Chip package and method for fabricating the same |
| 07/21/2011 | US20110175235 Wiring substrate and semiconductor apparatus including the wiring substrate |
| 07/21/2011 | US20110175234 Semiconductor integrated circuit |
| 07/21/2011 | US20110175233 Semiconductor device and method for fabricating the same |
| 07/21/2011 | US20110175232 Semiconductor device |
| 07/21/2011 | US20110175230 Forming Compliant Contact Pads for Semiconductor Packages |
| 07/21/2011 | US20110175229 Semiconductor Device and Semiconductor Module Including the Same |
| 07/21/2011 | US20110175228 Molecular self-assembly in substrate processing |
| 07/21/2011 | US20110175227 Post passivation interconnection schemes on top of the ic chips |
| 07/21/2011 | US20110175226 Interconnect structure for integrated circuits having enhanced electromigration resistance |
| 07/21/2011 | US20110175225 Method of forming an em protected semiconductor die |
| 07/21/2011 | US20110175224 Bonded structure and manufacturing method for bonded structure |
| 07/21/2011 | US20110175223 Stacked Semiconductor Components Having Conductive Interconnects |
| 07/21/2011 | US20110175222 Semiconductor package |
| 07/21/2011 | US20110175221 Chip package and fabrication method thereof |
| 07/21/2011 | US20110175218 Package assembly having a semiconductor substrate |
| 07/21/2011 | US20110175217 Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture |
| 07/21/2011 | US20110175216 Integrated void fill for through silicon via |
| 07/21/2011 | US20110175215 3d chip stack having encapsulated chip-in-chip |
| 07/21/2011 | US20110175214 Power Semiconductor Module With Interconnected Package Portions |