| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/27/2011 | EP1728287B1 Combination insulator and organic semiconductor formed from self-assembling block co-polymers |
| 07/27/2011 | EP1711958B1 Method for forming a capacitor with a locally increased dielectric constant and an interlayer dielectric with a low dielectric constant |
| 07/27/2011 | EP1700341B1 Wafer with optical control modules in ic fields |
| 07/27/2011 | EP1425364B1 Dry thermal interface material |
| 07/27/2011 | EP1339271B1 Substrate and production method therefor |
| 07/27/2011 | EP1163483B1 Thermally conductive material and method of using the same |
| 07/27/2011 | CN201910762U Control device for direct-current brushed motor |
| 07/27/2011 | CN201910420U Microelectronic unit and system |
| 07/27/2011 | CN201910419U Semiconductor packaging structure |
| 07/27/2011 | CN201910418U Radiating device for single-pipe IGBT (Insulated Gate Bipolar Translator) |
| 07/27/2011 | CN201910417U Thin metal substrate with high thermal conductivity |
| 07/27/2011 | CN201910416U Encapsulation structure for large-power chip and special chip thereof |
| 07/27/2011 | CN201910415U Conducting pad structure, chip packaging structure and driving component array substrate |
| 07/27/2011 | CN1988143B Semiconductor device and manufacturing method of the same |
| 07/27/2011 | CN1979877B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/27/2011 | CN1971939B Repairing pixel defect of display device |
| 07/27/2011 | CN1970623B 液状环氧树脂组成物 A liquid epoxy resin composition |
| 07/27/2011 | CN1938794B Embedded toroidal transformers in ceramic substrates |
| 07/27/2011 | CN1826671B Compact impedance transformation circuit |
| 07/27/2011 | CN102138215A Optical device and method for manufacturing same |
| 07/27/2011 | CN102138213A 半导体装置 Semiconductor device |
| 07/27/2011 | CN102138212A Semiconductor device, electronic apparatus using semiconductor device and method for manufacturing semiconductor device |
| 07/27/2011 | CN102138147A Surface sensor |
| 07/27/2011 | CN102138057A Heat exchanger and method of manufacturing same |
| 07/27/2011 | CN102138006A Cooling device |
| 07/27/2011 | CN102136479A Sram unit |
| 07/27/2011 | CN102136472A Semiconductor apparatus mould |
| 07/27/2011 | CN102136469A Power semiconductor module and method for operating a power semiconductor module |
| 07/27/2011 | CN102136468A Thyristor valve section and crimping method thereof |
| 07/27/2011 | CN102136467A Stacked package of semiconductor device |
| 07/27/2011 | CN102136466A Electrostatic discharge test structure and system of gate-driven MOSFET (metal oxide semiconductor field effect transistor) |
| 07/27/2011 | CN102136465A Open-circuit embedding-removing test structure for trimmer-capacitance MOS (metal oxide semiconductor) varactor and variable capacitance diode |
| 07/27/2011 | CN102136464A Packaging structure and lead frame thereof |
| 07/27/2011 | CN102136463A Semiconductor encapsulating structure |
| 07/27/2011 | CN102136462A General output and input unit as well as related device and method thereof |
| 07/27/2011 | CN102136461A Liquid cooling type radiator |
| 07/27/2011 | CN102136460A Thermal matching in semiconductor devices using heat distribution structures |
| 07/27/2011 | CN102136459A Packaging structure and manufacture method thereof |
| 07/27/2011 | CN102136458A Improved structure aimed at BOAC framework |
| 07/27/2011 | CN102136457A Semiconductor device and method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation |
| 07/27/2011 | CN102136451A Method for forming metal interconnection |
| 07/27/2011 | CN102136450A Method for forming metal interconnection |
| 07/27/2011 | CN102136434A Method of stacking flip-chip on wire-bonded chip |
| 07/27/2011 | CN102136327A Heat-conduction insulation spacer |
| 07/27/2011 | CN102134650A Preparation process of light electronic packaging material |
| 07/27/2011 | CN102134453A Heat resistant adhesive sheet used in the fabrication of substrateless semiconductor package |
| 07/27/2011 | CN102134452A Heat-resistant adhesive sheet for semiconductor device fabrication and adhesive used for the sheet |
| 07/27/2011 | CN102134451A Adhesive film for semiconductor, composite sheet, and method for producing semiconductor using the same |
| 07/27/2011 | CN101826495B Window-shaped semiconductor encapsulation structure |
| 07/27/2011 | CN101807583B TFT-LCD (Thin Film Transistor Liquid Crystal Display) array substrate and manufacture method thereof |
| 07/27/2011 | CN101740582B Transistor array lower plate |
| 07/27/2011 | CN101694840B Power device integrated circuit |
| 07/27/2011 | CN101684924B LED lighting module and preparation method |
| 07/27/2011 | CN101681901B RF-coupled digital isolator |
| 07/27/2011 | CN101667620B White light-emitting diode (LED) |
| 07/27/2011 | CN101667545B Multi-chip stacked structure and manufacturing method thereof |
| 07/27/2011 | CN101661893B Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
| 07/27/2011 | CN101645453B Nonvolatile memory device and method of manufacturing the same |
| 07/27/2011 | CN101645435B Probing pad structure and manufacturing method thereof |
| 07/27/2011 | CN101645430B Chip cooling device |
| 07/27/2011 | CN101636837B Electronic device, electronic apparatus mounting electronic device, article mounting electronic device, and method for manufacturing electronic device |
| 07/27/2011 | CN101626030B Luminous element and repairing method thereof |
| 07/27/2011 | CN101621915B Heat dissipating device and bracket thereof |
| 07/27/2011 | CN101616568B Heat sink |
| 07/27/2011 | CN101611490B Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
| 07/27/2011 | CN101609830B Printed circuit board including electronic component embedded therein and method of manufacturing the same |
| 07/27/2011 | CN101608757B LED streetlight |
| 07/27/2011 | CN101604687B Semiconductor light emitting device |
| 07/27/2011 | CN101604675B Circuit board and method of manufacturing the same, and circuit device and method of manufacturing the same |
| 07/27/2011 | CN101599517B Light emitting diode (LED) packaging structure with electrostatic protection function and manufacturing method thereof |
| 07/27/2011 | CN101599446B Electronic device and method of manufacturing the same |
| 07/27/2011 | CN101587903B Electronic element packaging body and manufacturing method thereof |
| 07/27/2011 | CN101587868B Qfn semiconductor package and fabrication method thereof |
| 07/27/2011 | CN101582410B Semiconductor device having multilayer interconnection structure |
| 07/27/2011 | CN101550279B Composition of organic/inorganic dielectric hybrid material with electrostatic discharge protective characteristic |
| 07/27/2011 | CN101515765B Electronic device having piezoelectric pump |
| 07/27/2011 | CN101515563B Manufacturing method of capping layer |
| 07/27/2011 | CN101488544B Light emitting element and method for manufacturing the same |
| 07/27/2011 | CN101465368B Display device and method for production thereof |
| 07/27/2011 | CN101447466B Boiling enhanced heat exchange structure of chips and fabrication method thereof |
| 07/27/2011 | CN101413649B LED light fitting |
| 07/27/2011 | CN101384152B Heat radiating device |
| 07/27/2011 | CN101375646B Passive impedance equalization of high speed serial links |
| 07/27/2011 | CN101360411B Heat Radiating device |
| 07/27/2011 | CN101339925B 半导体装置 Semiconductor device |
| 07/27/2011 | CN101319772B Bidirectional cooling LED apparatus |
| 07/27/2011 | CN101296597B Heat radiating device |
| 07/27/2011 | CN101290890B Circuit board with internally embedded conductive wire and manufacturing method therefor |
| 07/27/2011 | CN101287348B Heat sink assembly |
| 07/27/2011 | CN101278248B Semiconductor integrated circuit having current leakage reduction scheme |
| 07/27/2011 | CN101266960B Soldering structure and method using zn |
| 07/27/2011 | CN101246861B Package board |
| 07/27/2011 | CN101241868B Encapsulation technology for internal buried semiconductor component and its encapsulation structure |
| 07/27/2011 | CN101226928B Stack type chip packaging structure and manufacturing method thereof |
| 07/27/2011 | CN101223235B Epoxy resin composition for encapsulation and electronic part device |
| 07/27/2011 | CN101197363B Double-joint grounding circuit and power supply circuit, and IC chip with the same |
| 07/27/2011 | CN101193535B Heat pipe radiator |
| 07/27/2011 | CN101137280B High-power element heat radiator manufacturing method |
| 07/27/2011 | CN101128505B Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| 07/27/2011 | CN101119622B Radiating module and fan and housing |