| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/02/2011 | US7989313 Method and apparatus for creating RFID devices |
| 08/02/2011 | US7989306 Method of forming alternating regions of Si and SiGe or SiGeC on a buried oxide layer on a substrate |
| 08/02/2011 | US7989268 Small form factor molded memory card and a method thereof |
| 08/02/2011 | US7989080 Method and apparatus for providing hermetic electrical feedthrough |
| 08/02/2011 | US7989048 Flexible base for manufacturing flexible printed circuit boards |
| 08/02/2011 | US7988803 Device and method for joining substrates |
| 08/02/2011 | US7988794 Semiconductor device and method |
| 08/02/2011 | US7988758 High thermal conductivity metal matrix composites |
| 08/02/2011 | US7988744 Method of producing capacitor structure in a semiconductor device |
| 08/02/2011 | DE202011100008U1 Befestigung einer Kühlvorrichtung Fixing a cooling device |
| 07/28/2011 | WO2011091394A1 Metal based electronic component package and the method of manufacturing the same |
| 07/28/2011 | WO2011090912A2 Integrated void fill for through silicon via |
| 07/28/2011 | WO2011090574A2 Semiconductor package and method |
| 07/28/2011 | WO2011090572A2 A method to form lateral pad on edge of wafer |
| 07/28/2011 | WO2011090570A2 Semiconductor package with embedded die and its methods of fabrication |
| 07/28/2011 | WO2011090568A2 Recessed and embedded die coreless package |
| 07/28/2011 | WO2011090533A1 Method and apparatus for enhancing connectability in led array using metal traces |
| 07/28/2011 | WO2011090364A2 Curable composition |
| 07/28/2011 | WO2011090362A2 Silicone resin |
| 07/28/2011 | WO2011090361A2 Curable composition |
| 07/28/2011 | WO2011090164A1 Semiconductor module manufacturing method |
| 07/28/2011 | WO2011090152A1 Semiconductor device and method of manufacturing same |
| 07/28/2011 | WO2011089922A1 Polyimide resin composition, adhesive agent and laminate each comprising same, and device |
| 07/28/2011 | WO2011089767A1 Circuit board, display device, and process for production of circuit board |
| 07/28/2011 | WO2011089721A1 Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column |
| 07/28/2011 | WO2011089677A1 Manufacturing method for semiconductor device |
| 07/28/2011 | WO2011089664A1 Film for forming semiconductor protection film, and semiconductor device |
| 07/28/2011 | WO2011089179A1 Electronic device, in particular for protection against electrostatic discharges, and method for protecting a component against electrostatic discharges |
| 07/28/2011 | WO2011089178A2 Integrated dram memory device |
| 07/28/2011 | WO2011089066A1 Sensor having damping |
| 07/28/2011 | WO2011089009A1 Method for the application of a conformal nanocoating by means of a low pressure plasma process |
| 07/28/2011 | WO2011088987A1 Improving the evenness by means of cutouts on the embossing points |
| 07/28/2011 | US20110183514 Stable electroless fine pitch interconnect plating |
| 07/28/2011 | US20110182324 Operating temperature measurement for an mos power component, and mos component for carrying out the method |
| 07/28/2011 | US20110180943 Thin Film Wafer Level Package |
| 07/28/2011 | US20110180942 Interconnection structure |
| 07/28/2011 | US20110180941 Three-dimensional semiconductor device and method for fabricating the same |
| 07/28/2011 | US20110180940 Interconnection structure and its design method |
| 07/28/2011 | US20110180939 Method of manufacturing semiconductor device and semiconductor device |
| 07/28/2011 | US20110180938 Electronic device and method of manufacturing the same |
| 07/28/2011 | US20110180937 Stacked package of semiconductor device |
| 07/28/2011 | US20110180936 Semiconductor device structures and electronic devices including same hybrid conductive vias |
| 07/28/2011 | US20110180935 Integrated circuit packaging system with conductive pillars and method of manufacture thereof |
| 07/28/2011 | US20110180934 Semiconductor device |
| 07/28/2011 | US20110180933 Semiconductor module and semiconductor module manufacturing method |
| 07/28/2011 | US20110180932 Method of manufacturing layered chip package |
| 07/28/2011 | US20110180931 Robust high aspect ratio semiconductor device |
| 07/28/2011 | US20110180930 Wiring board, manufacturing method of the wiring board, and semiconductor package |
| 07/28/2011 | US20110180928 Etched recess package on package system |
| 07/28/2011 | US20110180927 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 07/28/2011 | US20110180926 Microelectromechanical Systems Embedded in a Substrate |
| 07/28/2011 | US20110180925 Microfabricated Pillar Fins For Thermal Management |
| 07/28/2011 | US20110180924 Mems module package |
| 07/28/2011 | US20110180923 Reliability enhancement of metal thermal interface |
| 07/28/2011 | US20110180922 Semiconductor chip, seal-ring structure and manufacturing process thereof |
| 07/28/2011 | US20110180921 Integrated circuit package |
| 07/28/2011 | US20110180920 Co-axial restraint for connectors within flip-chip packages |
| 07/28/2011 | US20110180919 Multi-tiered integrated circuit package |
| 07/28/2011 | US20110180918 Arrangement Comprising at Least One Power Semiconductor Module and a Transport Packaging |
| 07/28/2011 | US20110180917 Microelectronic assembly with an embedded waveguide adapter and method for forming the same |
| 07/28/2011 | US20110180916 Multi-chip package having frame interposer |
| 07/28/2011 | US20110180915 Electronic device and method of manufacturing the same |
| 07/28/2011 | US20110180914 Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof |
| 07/28/2011 | US20110180897 Packaged semiconductor product and method for manufacture thereof |
| 07/28/2011 | US20110180879 Cmos transistor, semiconductor device including the transistor, and semiconductor module including the device |
| 07/28/2011 | US20110180877 Semiconductor device and a method of manufacturing the same |
| 07/28/2011 | US20110180874 Semiconductor device |
| 07/28/2011 | US20110180839 Nickel Tin Bonding System with Barrier Layer for Semiconductor Wafers and Devices |
| 07/28/2011 | US20110180822 Optoelectronic Component |
| 07/28/2011 | US20110180809 Semiconductor device module |
| 07/28/2011 | US20110180680 Solar module frames having water drain |
| 07/28/2011 | US20110180317 Electronic component package, method for producing the same and interposer |
| 07/28/2011 | US20110180240 Centrifugal blower and heat dissipation device incorporating the same |
| 07/28/2011 | DE112009000666T5 Verfahren zum Herstellen eines Elektronikkomponentenmoduls A method of manufacturing an electronic component module |
| 07/28/2011 | DE112004002266B4 Dielektrischer Film mit sehr geringer Dielektrizitätskonstante für Kupferverbindungen Dielectric film with a very low dielectric constant for copper compounds |
| 07/28/2011 | DE10350162B4 Halbleiterbauteil Semiconductor device |
| 07/28/2011 | DE10330047B4 Halbleitersensor für eine dynamische Größe Semiconductor sensor dynamic quantity |
| 07/28/2011 | DE10231638B4 Integrierte Schaltungsanordnung An integrated circuit device |
| 07/28/2011 | DE10228058B4 Hochfrequenzmodul RF module |
| 07/28/2011 | DE102011008457A1 Siliziumplättchen-Stapelpaket auf Waferebene Silicon wafer stack package at the wafer level |
| 07/28/2011 | DE102011003205A1 Halbleitervorrichtungsmodul Semiconductor device module |
| 07/28/2011 | DE102010042438A1 Sensoranordnung Sensor array |
| 07/28/2011 | DE102010005771A1 Verbesserung der Ebenheit durch Freischnitte an den Prägen Improve the flatness by free cuts on the embossing |
| 07/28/2011 | DE102010005715A1 Transistoranordnung als ESD-Schutzmaßnahme Transistor array for ESD protection measure |
| 07/28/2011 | DE102010001077A1 Method for manufacturing surface-mountable sensor chip e.g. differential pressure sensor chip, involves mounting sensor chip on film, by providing gel into recess of chip, where recess corresponds to aperture in film |
| 07/28/2011 | DE102010001073A1 Sensor e.g. absolute pressure sensor, for measurement of differential pressure, has sensor element whose upper and lower sides are separated in pressure-tight manner by membrane or film structure that is formed as deformed plastic film |
| 07/28/2011 | DE102005043271B4 Vorrichtung zur Messung der Temperatur in vertikal aufgebauten Halbleiterbauelementen bei laufendem Betrieb und kombinierte Teststruktur zur Erfassung der Zuverlässigkeit Device for measuring the temperature in vertically constructed semiconductor devices during operation and combined test structure for detecting the reliability |
| 07/28/2011 | DE102005030585B4 Halbleiterbauelement mit einem vertikalen Entkopplungskondensator und Verfahren zu seiner Herstellung A semiconductor device with a vertical decoupling capacitor and process for its preparation |
| 07/28/2011 | DE102005016439B4 Halbleiterbauelementpackung und Herstellungsverfahren Semiconductor device package and manufacturing method |
| 07/28/2011 | DE102005010013B4 Stromregler mit einem Transistor und einem Messwiderstand Current regulator having a transistor and a sensing resistor |
| 07/28/2011 | CA2786855A1 Method for the application of a conformal nanocoating by means of a low pressure plasma process |
| 07/27/2011 | EP2348572A1 Resin multilayer device and method for manufacturing same |
| 07/27/2011 | EP2348526A2 Substrate for electronic device, stack for electronic device, electronic device, and method for manufacturing the same |
| 07/27/2011 | EP2348525A1 Wiring forming method |
| 07/27/2011 | EP2347441A1 Electrostatic discharge (esd) shielding for stacked ics |
| 07/27/2011 | EP2347440A1 Millimetre-wave radio antenna module |
| 07/27/2011 | EP2347437A1 Integrated capacitor with array of crosses |
| 07/27/2011 | EP2347436A1 Integrated capacitor with alternating layered segments |
| 07/27/2011 | EP2347435A1 Integrated capacitor with grid plates |
| 07/27/2011 | EP1902467B1 Mmic having back-side multi-layer signal routing |