H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/03/2011	CN102142418A Semiconductor structure and manufacturing method of semiconductor device
08/03/2011	CN102142417A Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
08/03/2011	CN102142416A Device mounting board, semiconductor module and portable apparatus
08/03/2011	CN102142415A Integrated circuit package with embedded components
08/03/2011	CN102142414A Device mounting board, semiconductor module and portable apparatus
08/03/2011	CN102142413A 半导体元件及其制法 Semiconductor element Jiqizhifa
08/03/2011	CN102142412A Input/output pad circuit having electrostatic discharge tolerance and comprising encircling well
08/03/2011	CN102142411A Chip packaging component of printed circuit board assembly (PCBA) and welding component
08/03/2011	CN102142410A Heat sink
08/03/2011	CN102142409A Non-direct bond copper isolated lateral wide band gap semiconductor device
08/03/2011	CN102142408A Packaging structure of inversed T-shaped locking hole heat-dissipation block of inner pin embedded chip
08/03/2011	CN102142407A Heat conducting pad
08/03/2011	CN102142406A Pressure-contacted high performance semiconductor module with hybrid pressure accumulator
08/03/2011	CN102142405A Semiconductor packaging structure and production method thereof
08/03/2011	CN102142404A Semiconductor device and communication method
08/03/2011	CN102142403A Packaging structure with electromagnetic shielding and manufacturing method thereof
08/03/2011	CN102142402A Flip-chip construction maintaining solder positioning
08/03/2011	CN102142401A Laminate electronic device
08/03/2011	CN102142398A Method of manufacturing semiconductor device
08/03/2011	CN102142394A Semiconductor device and method for manufacturing the same
08/03/2011	CN102142383A Method for detecting positions of wells
08/03/2011	CN102142382A Semiconductor technology, semiconductor assembly and packaging structure equipped therewith
08/03/2011	CN102142379A Substrate for electronic device, laminated body for electronic device, electronic device, and manufacturing method thereof
08/03/2011	CN102142371A Process for manufacturing photovoltaic bypass Schottky diode
08/03/2011	CN102142356A Process monitor and apparatus for producing semiconductor
08/03/2011	CN101847613B Water circulation heat radiation device of semiconductor chilling plate
08/03/2011	CN101834184B Substrate-triggered GGNMOS (Grounded-Grid N-Metal-Oxide-Semiconductor) tube
08/03/2011	CN101771044B Complementary SCR structure triggered with assistance of coupling capacitor
08/03/2011	CN101771040B Complementary-type SCR (Silicon Controlled Rectifier) structure triggered by diode string in an auxiliary way
08/03/2011	CN101681892B Polar hybrid grid array package
08/03/2011	CN101673688B Method of fabricating multi-layered substrate and the substrate thereof
08/03/2011	CN101646300B Printed wiring board and printed circuit board
08/03/2011	CN101635284B Wafer packaging structure
08/03/2011	CN101604689B 半导体集成电路 The semiconductor integrated circuit
08/03/2011	CN101604663B Well regions of semiconductor devices
08/03/2011	CN101578394B Plated material having metal thin film formed by electroless plating, and method for production thereof
08/03/2011	CN101578393B Plated material having metal thin film formed by electroless plating, and method for production thereof
08/03/2011	CN101471323B Multilayer printed wiring board
08/03/2011	CN101431319B Electronic component
08/03/2011	CN101431069B Power semiconductor module with temperature sensor
08/03/2011	CN101355091B Case for housing solid-state imaging element, manufacturing method thereof, and solid-state imaging device
08/03/2011	CN101330026B Electronic device and method of manufacturing the same
08/03/2011	CN101286500B Semiconductor module and mobile apparatus
08/03/2011	CN101281890B Semiconductor module in pressure contact design and method for production of the same
08/03/2011	CN101221974B Organic electro-luminescent display device
08/03/2011	CN101221935B Transparent conductive film and method for producing the same
08/03/2011	CN101170071B Semiconductor package and method of forming wire loop of semiconductor package
08/03/2011	CN101079078B Method of designing semiconductor device
08/03/2011	CN101071809B Power semiconductor device
08/03/2011	CN101027948B Electronics module and method for manufacturing the same
08/02/2011	US7990714 Heat dissipation device and fasteners thereof
08/02/2011	US7990712 Heat sink used in interface card
08/02/2011	US7990037 Carbon nanotube circuit component structure
08/02/2011	US7989968 Method and apparatus for measurement and control of photomask to substrate alignment
08/02/2011	US7989967 High-contrast laser mark on substrate surfaces
08/02/2011	US7989966 Mark structure for coarse wafer alignment and method for manufacturing such a mark structure
08/02/2011	US7989964 Semiconductor integrated circuit
08/02/2011	US7989963 Transistor circuit formation substrate
08/02/2011	US7989962 Bonding pad for preventing pad peeling
08/02/2011	US7989960 Semiconductor device
08/02/2011	US7989959 Method of forming stacked-die integrated circuit
08/02/2011	US7989958 Patterned contact
08/02/2011	US7989957 Self-aligned, integrated circuit contact
08/02/2011	US7989955 Semiconductor device, electronic device, and method of producing semiconductor device
08/02/2011	US7989954 Integrated circuit chips with fine-line metal and over-passivation metal
08/02/2011	US7989953 Flip chip power switch with under bump metallization stack
08/02/2011	US7989952 Semiconductor device
08/02/2011	US7989951 Die assemblies
08/02/2011	US7989950 Integrated circuit packaging system having a cavity
08/02/2011	US7989949 Heat extraction from packaged semiconductor chips, scalable with chip area
08/02/2011	US7989947 Semiconductor device and method of manufacturing the same
08/02/2011	US7989946 Multimode signaling on decoupled input/output and power channels
08/02/2011	US7989945 Spring connector for making electrical contact at semiconductor scales
08/02/2011	US7989944 Method for embedding a component in a base
08/02/2011	US7989943 Staircase shaped stacked semiconductor package
08/02/2011	US7989942 IC package with capacitors disposed on an interposal layer
08/02/2011	US7989941 Integrated circuit package system with support structure for die overhang
08/02/2011	US7989940 System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures
08/02/2011	US7989939 Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
08/02/2011	US7989938 Semiconductor device for fingerprint recognition
08/02/2011	US7989937 Package structure and manufacturing method thereof
08/02/2011	US7989936 Microelectronic device with integrated energy source
08/02/2011	US7989935 Semiconductor device
08/02/2011	US7989934 Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrier
08/02/2011	US7989933 Increased I/O leadframe and semiconductor device including same
08/02/2011	US7989932 Semiconductor device
08/02/2011	US7989931 Integrated circuit package system with under paddle leadfingers
08/02/2011	US7989929 Direct-connect signaling system
08/02/2011	US7989928 Semiconductor device packages with electromagnetic interference shielding
08/02/2011	US7989927 Silicon substrate for package
08/02/2011	US7989925 Method for forming a group III nitride material on a silicon substrate
08/02/2011	US7989905 MEMS device having a movable electrode
08/02/2011	US7989894 Fusion bonding process and structure for fabricating silicon-on-insulation (SOI) semiconductor devices
08/02/2011	US7989874 Nonvolatile memory device and method for manufacturing the same
08/02/2011	US7989850 Array substrate and method of fabricating the same
08/02/2011	US7989804 Test pattern structure
08/02/2011	US7989803 Manufacturing method for semiconductor chips and semiconductor wafer
08/02/2011	US7989362 Hafnium lanthanide oxynitride films
08/02/2011	US7989357 Method of patterning semiconductor structure and structure thereof
08/02/2011	US7989356 Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

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