| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/04/2011 | US20110187000 Integrated Circuits Having TSVS Including Metal Gettering Dielectric Liners |
| 08/04/2011 | US20110186999 Semiconductor device and method for manufacturing the same |
| 08/04/2011 | US20110186998 Recessed semiconductor substrates |
| 08/04/2011 | US20110186997 Board on chip package substrate and manufacturing method thereof |
| 08/04/2011 | US20110186996 Multi-chip semiconductor device |
| 08/04/2011 | US20110186995 Solder bump interconnect |
| 08/04/2011 | US20110186994 Integrated circuit packaging system having dual sided connection and method of manufacture thereof |
| 08/04/2011 | US20110186993 Semiconductor module and portable apparatus provided with semiconductor module |
| 08/04/2011 | US20110186992 Recessed semiconductor substrates and associated techniques |
| 08/04/2011 | US20110186991 Package substrate and method of fabricating the same |
| 08/04/2011 | US20110186990 Protruding tsv tips for enhanced heat dissipation for ic devices |
| 08/04/2011 | US20110186989 Semiconductor Device and Bump Formation Process |
| 08/04/2011 | US20110186988 Multi-Direction Design for Bump Pad Structures |
| 08/04/2011 | US20110186987 Stress buffer structures in a mounting structure of a semiconductor device and methods of manufacturing the same |
| 08/04/2011 | US20110186986 T-Shaped Post for Semiconductor Devices |
| 08/04/2011 | US20110186985 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same |
| 08/04/2011 | US20110186984 Substrate processing apparatus and method of manufacturing semiconductor device |
| 08/04/2011 | US20110186983 Package for housing semiconductor element and semiconductor device using the same |
| 08/04/2011 | US20110186982 Surface mount diode and method of fabricating the same |
| 08/04/2011 | US20110186981 Semiconductor device and method of manufacturing the same |
| 08/04/2011 | US20110186980 Wireless Element With Antenna Formed On A Thin Film Substrate For Embedding into Semiconductor packages |
| 08/04/2011 | US20110186979 Semiconductor package and high-frequency semiconductor device |
| 08/04/2011 | US20110186978 Stack package |
| 08/04/2011 | US20110186976 Method of manufacturing a semiconductor device |
| 08/04/2011 | US20110186975 Semiconductor package and manufacturing method thereof |
| 08/04/2011 | US20110186974 High frequency flip chip package structure of polymer substrate |
| 08/04/2011 | US20110186973 Semiconductor Device and Method of Forming Air Gap Adjacent to Stress Sensitive Region of the Die |
| 08/04/2011 | US20110186970 Method for manufacturing a semiconductor device |
| 08/04/2011 | US20110186967 Component Stacking Using Pre-Formed Adhesive Films |
| 08/04/2011 | US20110186964 Methods of forming integrated circuit devices |
| 08/04/2011 | US20110186963 Electrically programmable fuse and fabrication method |
| 08/04/2011 | US20110186962 Semiconductor device and method of manufacturing the same |
| 08/04/2011 | US20110186961 Semiconductor ic having electrical fuse capable of preventing thermal diffusion |
| 08/04/2011 | US20110186960 Techniques and configurations for recessed semiconductor substrates |
| 08/04/2011 | US20110186930 Ring power gating with distributed currents using non-linear c4 contact placements |
| 08/04/2011 | US20110186898 Semiconductor package structure |
| 08/04/2011 | US20110186843 Manufacturing method of thin film and metal line for display using the same, thin film transistor array panel, and method for manufacturing the same |
| 08/04/2011 | US20110186839 Method and System for Hermetically Sealing Packages for Optics |
| 08/04/2011 | US20110186838 Circuit architecture for the parallel supplying during an electric or electromagnetic testing of a plurality of electronic devices integrated on a semiconductor wafer |
| 08/04/2011 | US20110186799 Non-volatile memory cell containing nanodots and method of making thereof |
| 08/04/2011 | US20110186797 Memory cell that includes a sidewall collar for pillar isolation and methods of forming the same |
| 08/04/2011 | US20110186555 System for semiconductor structure processing using multiple laser beam spots |
| 08/04/2011 | DE102011003307A1 Halbleiterleistungsmodul, Inverter/Konverter mit demselben und Verfahren zur Herstellung eines Kühlmantels für das Halbleiterleistungsmodul The semiconductor power module, the inverter / converter with the same and method of manufacturing a cooling jacket for the semiconductor power module |
| 08/04/2011 | DE102011002419A1 Befestigungsanordnung für eine Wärmesenke Mounting arrangement for a heat sink |
| 08/04/2011 | DE102011000374A1 Waterproof structure for semiconductor package installed in car generator, has radiation element that is arranged opposite to surface area of heat sink with power element and provided with projection fitted into recess of heat sink |
| 08/04/2011 | DE102010017600A1 Diamant-SOI mit dünner Siliziumnitridschicht Diamond SOI thin silicon nitride |
| 08/04/2011 | DE102010017518A1 Halbleitermodul und Motorvorrichtung mit integriertem elektronischen Schaltkreis mit demselben Semiconductor module and motor assembly with integrated electronic circuit with the same |
| 08/04/2011 | DE102010006393A1 Vorrichtung und Verfahren zur Inertgasaushärtung für Leiterrahmen- oder Substratstreifen Apparatus and method for Inertgasaushärtung for lead frame or substrate strip |
| 08/04/2011 | DE102010006132A1 Miniaturisiertes elektrisches Bauelement mit einem MEMS und einem ASIC Miniaturized electrical component with a MEMS and an ASIC |
| 08/04/2011 | DE102010001568A1 Elektronisches Bauteil für hohe Temperaturen Electronic component for high temperatures |
| 08/04/2011 | DE102010001565A1 Leistungsmodul mit einer Schaltungsanordnung, elektrische/elektronische Schaltungsanordnung, Verfahren zur Herstellung eines Leistungsmoduls Power module having a circuit arrangement, electric / electronic circuit device, method for manufacturing a power module |
| 08/04/2011 | DE102010001505A1 Bonding wire protecting device, has bonding sites provided on circuitry carrier e.g. circuit board, and plug connector, where bend protection units are provided on regions of bonding wire |
| 08/04/2011 | DE102010001473A1 Vorrichtung zum Herstellen von mit einer Kunststoffmasse umspritzten Bauteilen und umspritztes Bauteil Apparatus for producing molded with a plastic material components and overmolded component |
| 08/04/2011 | CA2788729A1 Heat exchanger, notably for a power semiconductor |
| 08/03/2011 | EP2352168A1 Electronic component package and electronic component package manufacturing method |
| 08/03/2011 | EP2351166A1 Method for connecting two parts mechanically and electrically at the same time |
| 08/03/2011 | EP2351082A2 Metal-insulator-metal capacitors |
| 08/03/2011 | EP2351078A1 Shielding for integrated capacitors |
| 08/03/2011 | EP2351077A1 Through-substrate via and redistribution layer with metal paste |
| 08/03/2011 | EP2351076A2 Method and apparatus for wafer bonding with enhanced wafer mating |
| 08/03/2011 | EP2351074A1 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods |
| 08/03/2011 | EP2351071A2 Methods for forming a conductive material, methods for selectively forming a conductive material, methods for forming platinum, and methods for forming conductive structures |
| 08/03/2011 | EP2350928A1 Method for producing an rfid transponder product, and rfid transponder product produced using the method |
| 08/03/2011 | EP2350891A1 Automation of the zero-pole identification methods for the stability analysis of microwave active circuits |
| 08/03/2011 | EP2350173A1 Method for producing silicone moulded bodies from light-curable silicone mixtures |
| 08/03/2011 | EP2349915A1 Electrical contact configuration of micro-electromechanical component and fabrication method |
| 08/03/2011 | EP2088214B1 Copper alloy plate for electrical and electronic components |
| 08/03/2011 | EP1810332B1 Nanotube-based circuit connection approach |
| 08/03/2011 | EP1077486B1 Semiconductor device |
| 08/03/2011 | CN201918910U 双层叠片式贴片型整流全桥 Double laminated patch full bridge rectifier |
| 08/03/2011 | CN201918386U 抗辐照eeprom存储阵列隔离结构 Anti-radiation eeprom storage arrays isolation structure |
| 08/03/2011 | CN201918384U 以pcb为封装基板的闪存集成电路 Flash memory integrated circuit package to the pcb board |
| 08/03/2011 | CN201918383U 铜引线框架 Copper leadframe |
| 08/03/2011 | CN201918382U 一种光伏接线盒的二极管固定装置 A photovoltaic diode junction box fixing device |
| 08/03/2011 | CN201918381U 一种半导体制冷系统用的散热风扇座 Cooling fan base with a semiconductor refrigeration system |
| 08/03/2011 | CN201918380U 易拆装的散热器扣具 Easy installation and removal of the heat sink clip |
| 08/03/2011 | CN201917914U 嵌入式加密芯片 Embedded encryption chip |
| 08/03/2011 | CN1832130B Semiconductor device and method of manufacturing the same |
| 08/03/2011 | CN102144292A Semiconductor device and method for manufacturing same |
| 08/03/2011 | CN102144291A Semiconductor substrate, package and device and manufacturing methods thereof |
| 08/03/2011 | CN102144290A Flip chip overmold package |
| 08/03/2011 | CN102144289A High-frequency circuit package, and sensor module |
| 08/03/2011 | CN102143986A Siloxane compound, curable resin composition, cured object obtained therefrom, and photosemiconductor element |
| 08/03/2011 | CN102143952A Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same |
| 08/03/2011 | CN102142856A 便携式电子装置 The portable electronic device |
| 08/03/2011 | CN102142464A Surface mount diode and method of fabricating the same |
| 08/03/2011 | CN102142450A A manufacturing method of a photoelectric conversion apparatus |
| 08/03/2011 | CN102142431A Integrated device and manufacturing method of integrated device |
| 08/03/2011 | CN102142430A Chip type high polymer electrostatic discharge protecting element and manufacturing method thereof |
| 08/03/2011 | CN102142429A Plasma induced damage (PID) detection structure and manufacture method thereof |
| 08/03/2011 | CN102142428A Ruthenium/wolfram hafnium nitride (Ru/WHfN) blocking layer against copper diffusion applied to copper interconnection and preparation method thereof |
| 08/03/2011 | CN102142427A Flat panel display device and method of manufacturing the same |
| 08/03/2011 | CN102142426A Semiconductor device and manufacturing method thereof |
| 08/03/2011 | CN102142425A 半导体器件 Semiconductor devices |
| 08/03/2011 | CN102142424A Semiconductor ic having electrical fuse capable of preventing thermal diffusion |
| 08/03/2011 | CN102142423A Circuit substrate and package of light emitting diode |
| 08/03/2011 | CN102142422A Bearing base of semiconductor component, electrical connection structures thereof and manufacturing method thereof |
| 08/03/2011 | CN102142421A Metal-column chip connecting structure and method without solders |
| 08/03/2011 | CN102142420A Interconnection structure |
| 08/03/2011 | CN102142419A Two-sided lead frame structure |