H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/10/2011	CN101656234B Advanced quad flat non-leaded package structure and manufacturing method thereof
08/10/2011	CN101626016B Wafer treating method
08/10/2011	CN101601133B Partially patterned lead frames and methods of making and using the same in semiconductor packaging
08/10/2011	CN101577288B Solid-state image pickup device and electronic apparatus
08/10/2011	CN101546752B Semiconductor device
08/10/2011	CN101499429B Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package
08/10/2011	CN101442109B Organic electroluminescent device and down-lead structure, mask plate, drive chip thereof
08/10/2011	CN101432870B Semiconductor device with double-sided electrode structure and its manufacturing method
08/10/2011	CN101421920B Method for improving heat dissipation in encapsulated electronic components
08/10/2011	CN101337652B Packaging of contact surface of sensor element and packaging method thereof
08/10/2011	CN101295689B Semiconductor device and package including the same
08/10/2011	CN101218670B Semiconductor device and method for manufacturing same
08/10/2011	CN101211902B 半导体装置 Semiconductor device
08/10/2011	CN101136396B Power electronic packing member including two pieces of substrate with multiple semiconductor chips and electronic elements
08/10/2011	CN101136395B Power electronic packing member including two pieces of substrate with multiple electronic elements
08/09/2011	US7995352 Printed circuit board
08/09/2011	US7994647 Method of reducing memory card edge roughness by edge coating
08/09/2011	US7994646 Semiconductor device
08/09/2011	US7994645 Integrated circuit package system with wire-in-film isolation barrier
08/09/2011	US7994644 Package stacking through rotation
08/09/2011	US7994643 Stack package, a method of manufacturing the stack package, and a digital device having the stack package
08/09/2011	US7994642 Semiconductor device which includes contact plug and embedded interconnection connected to contact plug
08/09/2011	US7994640 Nanoparticle cap layer
08/09/2011	US7994639 Microelectronic structure including dual damascene structure and high contrast alignment mark
08/09/2011	US7994638 Semiconductor chip and semiconductor device
08/09/2011	US7994637 High-frequency semiconductor device
08/09/2011	US7994636 Flip chip interconnection structure
08/09/2011	US7994635 Power semiconductor module
08/09/2011	US7994634 Semiconductor element and semiconductor element fabrication method
08/09/2011	US7994633 Substrate for electrical device
08/09/2011	US7994632 Interdigitated conductive lead frame or laminate lead frame for GaN die
08/09/2011	US7994631 Substrate for an integrated circuit package and a method of forming a substrate
08/09/2011	US7994630 Power transistor package with integrated bus bar
08/09/2011	US7994629 Leadless integrated circuit packaging system and method of manufacture thereof
08/09/2011	US7994628 Package structure of photoelectronic device and fabricating method thereof
08/09/2011	US7994627 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same
08/09/2011	US7994626 Multi-layer semiconductor package with vertical connectors and method of manufacture thereof
08/09/2011	US7994625 Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof
08/09/2011	US7994624 Integrated circuit package system with adhesive segment spacer
08/09/2011	US7994623 Semiconductor device with offset stacked integrated circuits
08/09/2011	US7994622 Microelectronic packages having cavities for receiving microelectric elements
08/09/2011	US7994621 Stacked semiconductor package
08/09/2011	US7994620 Stacked semiconductor device
08/09/2011	US7994619 Bridge stack integrated circuit package system
08/09/2011	US7994618 Sensor module and method for manufacturing same
08/09/2011	US7994617 Semiconductor device
08/09/2011	US7994616 Multilayered lead frame for a semiconductor light-emitting device
08/09/2011	US7994615 Direct contact leadless package for high current devices
08/09/2011	US7994613 Semiconductor device and method for manufacturing the same
08/09/2011	US7994608 Magnetically alignable integrated circuit device
08/09/2011	US7994607 Semiconductor device and manufacturing method thereof
08/09/2011	US7994604 Using floating fill metal to reduce power use for proximity communication
08/09/2011	US7994589 Semiconductor device and method for fabricating the same
08/09/2011	US7994578 ESD protection for bipolar-CMOS-DMOS integrated circuit devices
08/09/2011	US7994576 Metal gate transistor and resistor and method for fabricating the same
08/09/2011	US7994571 Semiconductor device
08/09/2011	US7994567 Semiconductor device and a method of manufacturing the same
08/09/2011	US7994554 CMOS image sensor and manufacturing method thereof
08/09/2011	US7994545 Methods, structures, and designs for self-aligning local interconnects used in integrated circuits
08/09/2011	US7994544 Semiconductor device having a fuse element
08/09/2011	US7994501 Method and apparatus for electronically aligning capacitively coupled mini-bars
08/09/2011	US7994437 Semiconductor device capable of switching operation modes
08/09/2011	US7994428 Electronic carrier board
08/09/2011	US7994048 Method of manufacturing a through electrode
08/09/2011	US7994047 Integrated circuit contact system
08/09/2011	US7994044 Semiconductor chip with contoured solder structure opening
08/09/2011	US7993980 Lead frame, electronic component including the lead frame, and manufacturing method thereof
08/09/2011	US7993979 Leadless package system having external contacts
08/09/2011	US7993978 Method of manufacturing a semiconductor device and molding die
08/09/2011	US7993969 Method for producing a module with components stacked one above another
08/09/2011	US7993946 Thin film transistor panel and manufacturing method thereof
08/09/2011	US7992958 Method for the printing of homogeneous electronic material with a multi-ejector print head
08/05/2011	DE202011000830U1 Konvektionswärmeübertrager Convection heat
08/04/2011	WO2011094539A1 Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co fired ceramic materials and devices made therefrom
08/04/2011	WO2011094319A2 Microfabricated pillar fins for thermal management
08/04/2011	WO2011093956A2 Protruding tsv tips for enhanced heat dissipation for ic devices
08/04/2011	WO2011093955A2 Dual carrier for joining ic die or wafers to tsv wafers
08/04/2011	WO2011093934A1 Method for improving plating on non-concuctive substrates
08/04/2011	WO2011093474A1 Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof
08/04/2011	WO2011093456A1 Piezoelectric vibration device and process for producing same
08/04/2011	WO2011093445A1 Etching liquid for a copper/titanium multilayer thin film
08/04/2011	WO2011093373A1 Complex and semiconductor device using the same, semiconductor module and method for fabricating the same
08/04/2011	WO2011093219A1 Curable epoxy resin composition
08/04/2011	WO2011093182A1 Heat dissipation sheet and method for producing heat dissipation sheet
08/04/2011	WO2011093038A1 Semiconductor device
08/04/2011	WO2011092947A1 One-pack epoxy resin composition, and use thereof
08/04/2011	WO2011092322A1 Heat exchanger, notably for a power semiconductor
08/04/2011	WO2011092048A1 Reliability enhancement of metal thermal interface
08/04/2011	WO2011056306A3 Microelectronic package and method of manufacturing same
08/04/2011	WO2011046809A3 Ic package with non-uniform dielectric layer thickness
08/04/2011	US20110189849 Semiconductor device with a barrier film
08/04/2011	US20110188206 Thermal interface
08/04/2011	US20110187302 Semiconductor device
08/04/2011	US20110187008 Semiconductor device and method of manufacturing semiconducter device
08/04/2011	US20110187007 Edge connect wafer level stacking
08/04/2011	US20110187006 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
08/04/2011	US20110187005 Semiconductor Device and Method of Forming Cavity Adjacent to Sensitive Region of Semiconductor Die Using Wafer-Level Underfill Material
08/04/2011	US20110187004 Semiconductor devices including an interconnection pattern and methods of fabricating the same
08/04/2011	US20110187002 Semiconductor device and its manufacture method
08/04/2011	US20110187001 Semiconductor device including process monitoring pattern and methods of fabricating the same

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