H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/11/2011	DE10046017B4 Halbleiter-Drucksensorvorrichtung mit von Schutzelement bedecktem Sensorchip Semiconductor pressure sensor device with covered by protective element sensor chip
08/10/2011	EP2355628A1 Mobile terminal
08/10/2011	EP2355343A2 Method of manufacturing package and method of manufacturing piezoelectric vibrator
08/10/2011	EP2355149A2 Assembly with high-performance semiconductor components and a liquid cooling device
08/10/2011	EP2355146A1 Integrated circuit package
08/10/2011	EP2355140A1 Substrate for mounting element and process for its production
08/10/2011	EP2355135A2 Integrated metal resistor and manufacturing method thereof
08/10/2011	EP2354746A1 Cooling member, and method and device for manufacturing same
08/10/2011	EP2354744A1 Cooling element
08/10/2011	EP2353722A1 Heat dissipation of power electronics for thermocyclers
08/10/2011	EP2352863A1 Enhancing thermal properties of carbon aluminum composites
08/10/2011	EP2352794A1 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
08/10/2011	EP1601739B1 Electronic device containing thermal interface material
08/10/2011	EP1378153B1 Electronic module including a cooling substrate and manufacturing method thereof
08/10/2011	EP1193755B1 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them
08/10/2011	CN201928573U 散热模块 Thermal Module
08/10/2011	CN201928572U 电子模块增强传热装置 Electronic modules enhance heat transfer device
08/10/2011	CN201928556U 电连接器组件 The electrical connector assembly
08/10/2011	CN201928208U 适用于电机软起动器的晶闸管散热器组件 Suitable for motor soft starter thyristors heat sink assembly
08/10/2011	CN201928195U 大功率汽车整流桥 High-power automotive rectifier bridge
08/10/2011	CN201927619U 用于光伏组件的接线盒 Junction box for photovoltaic modules
08/10/2011	CN201927613U 带压装座的药丸式二极管 Pressure mounted seat pills diode
08/10/2011	CN201927610U 一种大功率三极管 One kind of power transistor
08/10/2011	CN201927606U 一种带静电保护的发光二极管 A light-emitting diode with electrostatic protection
08/10/2011	CN201927602U 一种包含特殊功率端子的功率模块 Special power terminals comprising a power module
08/10/2011	CN201927601U Electronic component
08/10/2011	CN201927600U 具有内屏蔽的红外线接收头 Having an inner shield infrared receiver
08/10/2011	CN201927599U Module package structure for plating prior to etching of double-sided graphic flip chips
08/10/2011	CN201927598U 传热装置 Heat transfer device
08/10/2011	CN201927597U 一种实现固定在散热器上的晶体管功能绝缘的结构 A fixed on the radiator to achieve functional insulation transistor structure
08/10/2011	CN201927596U 散热器鳍片结构 Radiator fin structure
08/10/2011	CN201927595U 微型散热器 Miniature radiator
08/10/2011	CN201927594U 鳍片结构及其散热装置 Structure and heat sink fins
08/10/2011	CN201927593U 一种开关电源三极管 A switching power transistor
08/10/2011	CN201927592U 用于led照明装置的驱动电路封装结构 A circuit for driving a lighting device package structure led
08/10/2011	CN201927591U 陶瓷覆铜基板应力减荷结构 Ceramic copper substrate stress offloading structure
08/10/2011	CN201927366U Novel CPS (control power supply) line
08/10/2011	CN1967803B Display device and manufacturing method of the same
08/10/2011	CN1929159B Semiconductor illumination device
08/10/2011	CN1578419B Photographic elementsand producing and assembling method, camera and image reading unit
08/10/2011	CN102150484A Thermally conductive gel packs
08/10/2011	CN102150480A Halo-hydrocarbon polymer coating
08/10/2011	CN102150294A Contacting a device with a conductor
08/10/2011	CN102150266A Systems and methods for enabling ESD protection on 3-D stacked devices
08/10/2011	CN102150265A Method and apparatus for enhancing the triggering of an electrostatic discharge protection device
08/10/2011	CN102150264A Electronic component and method for the production thereof
08/10/2011	CN102150263A Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing same
08/10/2011	CN102150262A Mainboard assembly including a package overlying a die directly attached to the mainboard
08/10/2011	CN102150261A Semiconductor device and resin composition used in semiconductor device
08/10/2011	CN102150260A Semiconductor device and method for manufacturing same
08/10/2011	CN102150259A Semiconductor arrangement and method for producing a semiconductor arrangement
08/10/2011	CN102150258A Signal delivery in stacked device
08/10/2011	CN102150257A Stacked device identification assignment
08/10/2011	CN102150256A Semiconductor device and semiconductor device manufacturing method
08/10/2011	CN102150246A Through electrode substrate, method for manufacturing the through electrode substrate, and semiconductor device using the through electrode substrate
08/10/2011	CN102150242A Liquid for protecting copper wiring surface and method for manufacturing semiconductor circuit element
08/10/2011	CN102149847A Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and LTCC devices made therefrom
08/10/2011	CN102149655A Manufacturing method of aluminum-diamond composite
08/10/2011	CN102149493A Aluminum-diamond composite and method for producing the same
08/10/2011	CN102148575A Rectifier wafer terminal structure
08/10/2011	CN102148562A Power conversion apparatus
08/10/2011	CN102148499A CDM (Charged Device Model) ESD (Electro-Static Discharge) protection circuit
08/10/2011	CN102148243A Electronic device for high temperature
08/10/2011	CN102148230A 影像感测模块及其封装方法 Image sensing module and packaging method
08/10/2011	CN102148222A Semiconductor structure and semiconductor packaging structure having proximity communication signal input ends
08/10/2011	CN102148221A Electronic component package and manufacturing method therefor
08/10/2011	CN102148220A Semiconductor device
08/10/2011	CN102148218A ESD (electrostatic discharge) protection circuit
08/10/2011	CN102148217A Interlayer insulating film and wiring structure, and process for producing the same
08/10/2011	CN102148216A Semiconductor structure for interconnection process and manufacturing method thereof
08/10/2011	CN102148215A Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method
08/10/2011	CN102148214A Methods for double-patterning-compliant standard cell design
08/10/2011	CN102148213A Lead frame of high-power chip package structure and manufacturing method thereof
08/10/2011	CN102148212A Lead frame of semiconductor chip
08/10/2011	CN102148211A Semiconductor assembly, semiconductor device and manufacturing method
08/10/2011	CN102148210A Semiconductor device and method for manufacturing the same
08/10/2011	CN102148209A Semiconductor component
08/10/2011	CN102148208A Heat sink module
08/10/2011	CN102148207A Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
08/10/2011	CN102148206A Semiconductor packaging structure and producing method thereof
08/10/2011	CN102148205A 集成电路结构 Integrated circuit structure
08/10/2011	CN102148204A Multi-direction design for bump pad structures
08/10/2011	CN102148203A Semiconductor chip and method for forming conductive pillar
08/10/2011	CN102148202A Chip package and method for forming the same
08/10/2011	CN102148201A Semiconductor element, packaging structure and forming method of semiconductor element
08/10/2011	CN102148192A Method for growing blocking layer and seed layer on surface of silicon through hole
08/10/2011	CN102148190A Method for manufacturing semiconductor interconnection structure
08/10/2011	CN102148188A Semiconductor device and fabricating method thereof
08/10/2011	CN102148186A Method for manufacturing semiconductor device
08/10/2011	CN102148185A Method for forming interconnection structure
08/10/2011	CN102148173A Attaching passive component to semiconductor package
08/10/2011	CN102148172A Semiconductor process, semiconductor component and package structure with semiconductor component
08/10/2011	CN102148169A Silicon carbide power module and packaging method thereof
08/10/2011	CN102148167A Method for manufacturing stackable packaging structure
08/10/2011	CN102146277A Silicone resin composition and a cured product thereof
08/10/2011	CN102146265A Dicing tape-integrated film for semiconductor back surface
08/10/2011	CN102145566A Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film
08/10/2011	CN101826470B Method for packaging high-radiation spherical array by using flip chip bonding
08/10/2011	CN101714827B Modularized vehicle rectifier bridge
08/10/2011	CN101697052B Active component array motherboard and manufacturing method thereof

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