H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/16/2011	US7998857 Integrated circuit and process for fabricating thereof
08/16/2011	US7998856 Interconnects with a dielectric sealant layer
08/16/2011	US7998851 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same
08/16/2011	US7998826 Method of forming mark in IC-fabricating process
08/16/2011	US7998805 Component with sensitive component structures and method for the production thereof
08/16/2011	US7998797 Semiconductor device
08/16/2011	US7998795 Method of manufacturing a semiconductor device including plural semiconductor chips
08/16/2011	US7998792 Semiconductor device assemblies, electronic devices including the same and assembly methods
08/16/2011	US7998786 Method of manufacturing a TFT array panel
08/16/2011	US7997680 Method for the printing of homogeneous electronic material with a multi-ejector print head
08/16/2011	US7996989 Heat dissipating device with preselected designed interface for thermal interface materials
08/11/2011	WO2011097464A1 Surface preparation of die for improved bonding strength
08/11/2011	WO2011097400A2 Improved heat sink
08/11/2011	WO2011097348A1 Ring power gating with distributed c4 currents using non-linear c4 contact placements
08/11/2011	WO2011097165A2 Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
08/11/2011	WO2011097102A1 Bonded semiconductor structures and methods of forming same
08/11/2011	WO2011097089A2 Recessed semiconductor substrates
08/11/2011	WO2011097042A1 Methods and structures for forming integrated semiconductor structures
08/11/2011	WO2011096986A1 Moisture barrier potting compound
08/11/2011	WO2011096800A2 Semiconductor device with a variable integrated circuit chip bump pitch
08/11/2011	WO2011096542A1 Substrate for power module, and power module
08/11/2011	WO2011096512A1 Semiconductor light-emitting device, method for manufacturing semiconductor light-emitting device, and optical device
08/11/2011	WO2011096432A1 Heat sink material
08/11/2011	WO2011096362A1 Member for mounting semiconductor element, process for producing same, and semiconductor device
08/11/2011	WO2011096218A1 Heat radiation device and electronic equipment using the same
08/11/2011	WO2011096164A1 Semiconductor device
08/11/2011	WO2011096126A1 Substrate for mounting light-emitting element, and light-emitting device
08/11/2011	WO2011095919A1 Thermal management component for led lighting
08/11/2011	WO2011095681A1 Strengthened structural module and method of fabrication
08/11/2011	WO2011095406A1 Power module having a circuit assembly, electrical/electronic circuit assembly, method for producing a power module
08/11/2011	WO2011094941A1 Molding device for producing epoxy plastic-sealed pressed automobile rectifying diode
08/11/2011	WO2011071600A3 Thin foil for use in packaging integrated circuits
08/11/2011	WO2010112478A3 Pressure support for an electronic circuit
08/11/2011	US20110195530 Semiconductor device and a method of manufacturing the same
08/11/2011	US20110194254 Polymer matrices for polymer solder hybrid materials
08/11/2011	US20110194112 Semiconductor wafer alignment markers, and associated systems and methods
08/11/2011	US20110193244 Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device
08/11/2011	US20110193243 Unique Package Structure
08/11/2011	US20110193242 Chip-stacked semiconductor and manufacturing method thereof
08/11/2011	US20110193241 Chip package and method for forming the same
08/11/2011	US20110193240 Bonded structure with enhanced adhesion strength
08/11/2011	US20110193239 Semiconductor element and display device provided with the same
08/11/2011	US20110193238 Silicon wafer for semiconductor with powersupply system on the backside of wafer
08/11/2011	US20110193237 Method for making semiconductor package
08/11/2011	US20110193236 Semiconductor substrate, semiconductor device, and manufacturing methods thereof
08/11/2011	US20110193235 3DIC Architecture with Die Inside Interposer
08/11/2011	US20110193234 Methods for Double-Patterning-Compliant Standard Cell Design
08/11/2011	US20110193233 Interconnect pattern for transceiver package
08/11/2011	US20110193232 Conductive pillar structure for semiconductor substrate and method of manufacture
08/11/2011	US20110193231 Electronic device package and method for fabricating the same
08/11/2011	US20110193230 Formation of air gap with protection of metal lines
08/11/2011	US20110193229 Multi-Chip Package Having Semiconductor Chips Of Different Thicknesses From Each Other And Related Device
08/11/2011	US20110193228 Molded underfill flip chip package preventing warpage and void
08/11/2011	US20110193227 Methods and Apparatus for Robust Flip Chip Interconnections
08/11/2011	US20110193226 Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
08/11/2011	US20110193225 Electronic device package and fabrication method thereof
08/11/2011	US20110193224 Semiconductor device
08/11/2011	US20110193223 Semiconductor device, chip-on-chip mounting structure, method of manufacturing the semiconductor device, and method of forming the chip-on-chip mounting structure
08/11/2011	US20110193222 Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus
08/11/2011	US20110193221 3DIC Architecture with Interposer for Bonding Dies
08/11/2011	US20110193220 Pillar Structure having a Non-Planar Surface for Semiconductor Devices
08/11/2011	US20110193219 Semiconductor device and semiconductor assembly with lead-free solder
08/11/2011	US20110193218 Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture
08/11/2011	US20110193217 Manufacturing of a Device Including a Semiconductor Chip
08/11/2011	US20110193216 Package structure
08/11/2011	US20110193215 Semiconductor package
08/11/2011	US20110193214 Semiconductor package having improved heat spreading performance
08/11/2011	US20110193213 Stacked semiconductor package
08/11/2011	US20110193212 Systems and Methods Providing Arrangements of Vias
08/11/2011	US20110193211 Surface Preparation of Die for Improved Bonding Strength
08/11/2011	US20110193210 Image sensor package with trench insulator and fabrication method thereof
08/11/2011	US20110193209 Semiconductor package
08/11/2011	US20110193208 Semiconductor package of a flipped mosfet and its manufacturing method
08/11/2011	US20110193207 Lead frame for semiconductor die
08/11/2011	US20110193206 Stackable semiconductor package with embedded die in pre-molded carrier frame
08/11/2011	US20110193205 Semiconductor device packages having stacking functionality and including interposer
08/11/2011	US20110193204 Semiconductor device
08/11/2011	US20110193203 Semiconductor device and method of manufacturing the same
08/11/2011	US20110193200 Semiconductor wafer chip scale package test flow and dicing process
08/11/2011	US20110193199 Electromigration immune through-substrate vias
08/11/2011	US20110193198 Corner Stress Release Structure Design for Increasing Circuit Routing Areas
08/11/2011	US20110193197 Structure and method for making crack stop for 3d integrated circuits
08/11/2011	US20110193170 Electro-Static Discharge (ESD) Clamping Device
08/11/2011	US20110193136 Semiconductor device and method for manufacturing the same
08/11/2011	US20110193098 High voltage high package pressure semiconductor package
08/11/2011	US20110193097 Silicon carbide semiconductor
08/11/2011	US20110193085 Methods of Forming Structures with a Focused ION Beam for Use in Atomic Force Probing and Structures for Use in Atomic Force Probing
08/11/2011	US20110192637 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
08/11/2011	US20110192451 Metal substrate with insulation layer and method for manufacturing the same, semiconductor device and method for manufacturing the same, and solar cell and method for manufacturing the same
08/11/2011	DE10344637B4 Ableiter für Elektroden, Verfahren zur Herstellung von Elektrodenableitern und Verwendung eines Ableiters Arrester for electrodes, method for the production of electric Dena lead Tern and use of an arrester
08/11/2011	DE10221891C5 Leistungshalbleitervorrichtung Power semiconductor device
08/11/2011	DE102011000623A1 Halbleitervorrichtung mit einem Halbleitermodul, das von Wärmesenken mit vergrößerter thermischer Masse gekühlt wird A semiconductor device comprising a semiconductor module that is cooled by heat sink with increased thermal mass
08/11/2011	DE102011000530A1 Verfahren zur Herstellung einer Halbleiteranordnung A process for producing a semiconductor device
08/11/2011	DE102010007605A1 Electrical component e.g. surface acoustic wave filter, for use in portable apparatus, has intermediate film for overstretching lower chip, and upper chip arranged on film above lower chip, where chips are provided with electrical terminals
08/11/2011	DE102010007086A1 Anordnung mit Leistungshalbleiterbaugruppen und einer Flüssigkeitskühleinrichtung Arrangement with power semiconductor modules and a liquid cooling device
08/11/2011	DE102010006996A1 Method for manufacturing semiconductor component e.g. high voltage component, involves filling insulating material in narrow trench aperture, and forming electrical conductive guard material in spread trench aperture
08/11/2011	DE102010001788A1 Skalierbarer Aufbau für laterale Halbleiterbauelemente mit hoher Stromtragfähigkeit Scalable design for lateral semiconductor devices with high current carrying capacity
08/11/2011	DE102010001711A1 Halbleiter-Bauelement und entsprechendes Herstellungsverfahren Semiconductor device and manufacturing method thereof
08/11/2011	DE10152343B4 Verfahren zur Verkapselung eines elektrischen Bauelementes und verkapseltes Oberflächenwellenbauelement Method of encapsulating an electrical component and encapsulated surface acoustic wave device
08/11/2011	DE10066443B4 Halbleitervorrichtung mit Abstrahlungsbauteilen A semiconductor device having radiation components

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