H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/17/2011	CN102154574A Alloy wire for connecting semiconductor components
08/17/2011	CN102153964A Adhesive composition, circuit connecting material and connecting structure of circuit member
08/17/2011	CN102153961A Film for flip chip type semiconductor back surface
08/17/2011	CN102153960A Film for flip chip type semiconductor back surface
08/17/2011	CN102153957A Adhesive film, and connection structure and connecting method for circuit member
08/17/2011	CN102153956A Thermosetting adhesive film, adhesive film with dicing film, and manufacturing method of semiconductor apparatus using the thermosetting adhesive film or the adhesive film with dicing film
08/17/2011	CN101853852B Groove MOS (Metal Oxide Semiconductor) device integrating Schottky diodes in unit cell and manufacture method
08/17/2011	CN101840906B High Q-value chip integrated inductor
08/17/2011	CN101789414B Ultrathin semiconductor chip packaging structure and manufacturing process thereof
08/17/2011	CN101777542B Chip packaging structure and packaging method
08/17/2011	CN101752277B System-in-a-package method and structure thereof
08/17/2011	CN101740421B Wafer and manufacturing method, system-level package structure and package method thereof
08/17/2011	CN101730441B Method for combining heat pipes with fixed seat and structure thereof
08/17/2011	CN101714532B Package and fabricating method thereof
08/17/2011	CN101677098B 集成电路装置 The integrated circuit device
08/17/2011	CN101673789B Light emitting diode package substrate structure, manufacturing method thereof and packaging structure thereof
08/17/2011	CN101667567B Electromagnetism interference isolation device
08/17/2011	CN101646328B Cooling device and cooling method
08/17/2011	CN101626009B Substrate panel
08/17/2011	CN101621035B Amorphous silicon MONOS or MAS memory cell structure with OTP function
08/17/2011	CN101601129B Mounting board and electronic device
08/17/2011	CN101593748B Cascade connected thyristor valve section in jacking connection
08/17/2011	CN101582437B Magnetic memory device
08/17/2011	CN101567334B Method to fabricate an ESD resistant tunneling magnetoresistive read transducer
08/17/2011	CN101553909B Sealing material and mounting method using the sealing material
08/17/2011	CN101546735B Packaging structure of bug-hole downwards wafer and manufacturing method thereof
08/17/2011	CN101442067B Image sensor and fabricating method thereof
08/17/2011	CN101431090B Image sensor and method for manufacturing the same
08/17/2011	CN101409998B Novel air-cooled radiator
08/17/2011	CN101403492B Radiating module with fins embedded in ring shape
08/17/2011	CN101359670B Active driving TFT matrix construction and manufacturing method thereof
08/17/2011	CN101345235B Production method of LED chip with electrostatic protection function
08/17/2011	CN101330817B Radiator and method for manufacturing fin component thereof
08/17/2011	CN101312227B Heat dissipation method and apparatus for LED
08/17/2011	CN101312180B Superposed marker and method for forming same as well as uses
08/17/2011	CN101308825B Integrated circuit construction
08/17/2011	CN101281872B Wiring substrate and wiring substrate manufacturing method
08/17/2011	CN101268119B Resin composition, varnish, resin film and semiconductor device
08/17/2011	CN101208797B Liquid cooling system of electrical device
08/17/2011	CN101187735B Display device and flat display device
08/17/2011	CN101140945B Organic light emitting display device and its manufacture method
08/17/2011	CN101110555B Power converter
08/17/2011	CN101082414B Luminous diode lighting apparatus with high power and high heat sinking efficiency
08/17/2011	CN101002319B Methods and apparatuses for providing stacked-die devices
08/16/2011	US8000826 Predicting IC manufacturing yield by considering both systematic and random intra-die process variations
08/16/2011	US8000518 Methods, objects and apparatus employing machine readable data
08/16/2011	US8000107 Carrier with embedded component and method for fabricating the same
08/16/2011	US8000099 Power supply cooling system
08/16/2011	US7999401 Semiconductor device and method of manufacturing same
08/16/2011	US7999400 Semiconductor device with recessed registration marks partially covered and partially uncovered
08/16/2011	US7999399 Overlay vernier key and method for fabricating the same
08/16/2011	US7999398 Solid state device
08/16/2011	US7999397 Microelectronic packages and methods therefor
08/16/2011	US7999396 Adhesive tape and semiconductor package using the same
08/16/2011	US7999395 Pillar structure on bump pad
08/16/2011	US7999394 Void reduction in indium thermal interface material
08/16/2011	US7999393 Semiconductor device and manufacturing method thereof
08/16/2011	US7999392 Multilayer wiring structure, semiconductor device, pattern transfer mask and method for manufacturing multilayer wiring structure
08/16/2011	US7999390 Semiconductor integrated circuit
08/16/2011	US7999389 Via hole structure with a conductive layer formed therein
08/16/2011	US7999388 Preventing breakage of long metal signal conductors on semiconductor substrates
08/16/2011	US7999387 Semiconductor element connected to printed circuit board
08/16/2011	US7999385 Semiconductor device
08/16/2011	US7999384 Top layers of metal for high performance IC's
08/16/2011	US7999383 High speed, high density, low power die interconnect system
08/16/2011	US7999381 High performance sub-system design and assembly
08/16/2011	US7999380 Process for manufacturing substrate with bumps and substrate structure
08/16/2011	US7999379 Microelectronic assemblies having compliancy
08/16/2011	US7999378 Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
08/16/2011	US7999377 Method and structure for optimizing yield of 3-D chip manufacture
08/16/2011	US7999376 Semiconductor device and its manufacturing method
08/16/2011	US7999375 Electronic device with integrated micromechanical contacts and cooling system
08/16/2011	US7999374 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same
08/16/2011	US7999372 Organic light emitting display device and method of fabricating the same
08/16/2011	US7999371 Heat spreader package and method
08/16/2011	US7999370 Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same
08/16/2011	US7999369 Power electronic package having two substrates with multiple semiconductor chips and electronic components
08/16/2011	US7999368 Semiconductor package having ink-jet type dam and method of manufacturing the same
08/16/2011	US7999367 Stacked memory device
08/16/2011	US7999366 Micro-component packaging process and set of micro-components resulting from this process
08/16/2011	US7999365 Package for monolithic compound semiconductor (CSC) devices for DC to DC converters
08/16/2011	US7999364 Method and flip chip structure for power devices
08/16/2011	US7999363 Structure and method for self protection of power device
08/16/2011	US7999362 Method and apparatus for making semiconductor devices including a foil
08/16/2011	US7999361 Shielding structure for transmission lines
08/16/2011	US7999360 Underlayer for high performance magnetic tunneling junction MRAM
08/16/2011	US7999359 Semiconductor package with electromagnetic shield
08/16/2011	US7999358 Shielding device
08/16/2011	US7999356 Composition for film formation, insulating film, semiconductor device, and process for producing the semiconductor device
08/16/2011	US7999349 Front-rear contacts of electronics devices with induced defects to increase conductivity thereof
08/16/2011	US7999341 Display driver integrated circuit device, film, and module
08/16/2011	US7999328 Isolation trench having first and second trench areas of different widths
08/16/2011	US7999324 Semiconductor device including overcurrent protection element
08/16/2011	US7999284 Semiconductor device and optical device module having the same
08/16/2011	US7999281 Optical semiconductor device and method of manufacturing optical semiconductor device
08/16/2011	US7999276 Chip-type LED package and light emitting apparatus having the same
08/16/2011	US7999256 Semiconductor device
08/16/2011	US7999197 Dual sided electronic module
08/16/2011	US7999194 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
08/16/2011	US7998879 Insulation structure for high temperature conditions and manufacturing method thereof

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