H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/17/2011	CN201936870U 二极管安装固定结构 Diode mounting structure
08/17/2011	CN201936869U 一种厚膜电路装置 One kind of thick film circuit device
08/17/2011	CN201936868U 薄型散热覆晶封装构造 Thin Thermal flip chip package
08/17/2011	CN201936867U 薄型散热覆晶封装构造 Thin Thermal flip chip package
08/17/2011	CN201936866U Power semiconductor packaging structure
08/17/2011	CN201936634U CPS wire
08/17/2011	CN201934431U 压紧锁扣端子 Pressing the latch pin
08/17/2011	CN1977574B Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board
08/17/2011	CN1930680B Collective substrate
08/17/2011	CN1897270B Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate
08/17/2011	CN1873973B Envelope for luminous elements of semiconductor in large power
08/17/2011	CN1763933B Printing circuit board and circuit unit introduced to same
08/17/2011	CN1649262B Package for electronic component, electronic component
08/17/2011	CN102160285A Piezoelectric vibrating part
08/17/2011	CN102160184A Display device
08/17/2011	CN102160177A Method for manufacturing semiconductor device
08/17/2011	CN102160175A Impedance controlled electrical interconnection employing meta-materials
08/17/2011	CN102160174A Conductive emissions protection
08/17/2011	CN102160173A Low cost die-to-wafer alignment/bond for 3d ic stacking
08/17/2011	CN102160172A Electrical circuit component carrier
08/17/2011	CN102160171A Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
08/17/2011	CN102160170A Stacking quad pre-molded component packages, systems using same, and methods of making same
08/17/2011	CN102160151A Copper wiring surface protective liquid and method for manufacturing semiconductor circuit
08/17/2011	CN102160105A Display device and manufacturing method of the same
08/17/2011	CN102160104A Semiconductor device
08/17/2011	CN102159913A Cooling member, and method and device for manufacturing same
08/17/2011	CN102159357A Method of manufacturing heat transfer plate
08/17/2011	CN102159060A Heat spreader for emissive display device
08/17/2011	CN102159059A Thermal cavity type radiator
08/17/2011	CN102159058A Liquid-cooled radiation structure
08/17/2011	CN102158275A Photoreceiving device
08/17/2011	CN102158244A Integrally packaged radio-frequency front end system
08/17/2011	CN102158073A DC voltage conversion module, semiconductor module and method for manufacturing semiconductor module
08/17/2011	CN102157689A Neutron sensor with thin interconnect stack
08/17/2011	CN102157671A Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
08/17/2011	CN102157660A Semiconductor encapsulation structure
08/17/2011	CN102157566A Semiconductor device and method for manufacturing the same
08/17/2011	CN102157538A Imaging component
08/17/2011	CN102157524A 半导体集成电路 The semiconductor integrated circuit
08/17/2011	CN102157523A Standard cell and semiconductor device including the same
08/17/2011	CN102157522A Semiconductor device
08/17/2011	CN102157514A RF semiconductor device and fabrication method thereof
08/17/2011	CN102157513A Thin film surface mount components
08/17/2011	CN102157512A Chip package and manufacturing method thereof
08/17/2011	CN102157502A System-in-package structure
08/17/2011	CN102157501A 三维系统级封装结构 Three-dimensional system-level package structure
08/17/2011	CN102157500A 半导体封装 The semiconductor package
08/17/2011	CN102157499A Hybrid integrated circuit module based on low temperature co-fired ceramic technology and manufacturing method thereof
08/17/2011	CN102157498A Hybrid integrated circuit module and manufacturing method thereof
08/17/2011	CN102157497A Multi-layer stacked semiconductor device structure and forming method
08/17/2011	CN102157496A Contact hole test device and method for testing leakage current of grid by active area contact hole
08/17/2011	CN102157495A Semiconductor devices including an interconnection pattern and methods of fabricating the same
08/17/2011	CN102157494A Wiring assembly
08/17/2011	CN102157493A Metal plug and manufacturing method thereof
08/17/2011	CN102157492A Chip package
08/17/2011	CN102157491A Semiconductor structure and manufacturing method thereof
08/17/2011	CN102157490A Semiconductor device and method of increasing resistance value of electric fuse
08/17/2011	CN102157489A Semiconductor device and manufacturing method of semiconductor device
08/17/2011	CN102157488A Integrated laminated transformer based on two layers of metal
08/17/2011	CN102157487A Inductors and methods for integrated circuits
08/17/2011	CN102157486A Semiconductor circuit assembly
08/17/2011	CN102157485A Semiconductor packaging frame
08/17/2011	CN102157484A Lead frame and chip packaging body
08/17/2011	CN102157483A Chip package and method for fabricating the same
08/17/2011	CN102157482A Electronic system with a composite substrate
08/17/2011	CN102157481A Stress strain welding column for integrated circuit packaging
08/17/2011	CN102157480A Bridge rectifier
08/17/2011	CN102157479A Semiconductor device and a method of manufacturing the same
08/17/2011	CN102157478A Methods and apparatus for robust flip chip interconnections
08/17/2011	CN102157477A Method for manufacturing semiconductor device
08/17/2011	CN102157476A Semiconductor package with single sided substrate design and manufacturing methods thereof
08/17/2011	CN102157475A Electronic device and electronic apparatus
08/17/2011	CN102157474A Wafer level stack die package
08/17/2011	CN102157473A 半导体装置及其制造方法 Semiconductor device and manufacturing method
08/17/2011	CN102157472A Electronic device
08/17/2011	CN102157471A Dual-layer laminated patch rectifying full bridge
08/17/2011	CN102157470A Micro LHP radiating system for integrated electrofluid power pump
08/17/2011	CN102157469A Cooling system of silicon controlled rectifier
08/17/2011	CN102157468A High-power loop heat pipe radiator and manufacturing method thereof
08/17/2011	CN102157467A Cooling heat-dissipation system and cooling device thereof
08/17/2011	CN102157466A Attachment arrangement for a heat sink
08/17/2011	CN102157465A Semiconductor device and manufacturing method thereof
08/17/2011	CN102157464A Power module
08/17/2011	CN102157463A Flow tube apparatus
08/17/2011	CN102157462A Chip package and fabrication method thereof
08/17/2011	CN102157461A Method for manufacturing semiconductor encapsulation
08/17/2011	CN102157460A Power semiconductor module with interconnected package portions
08/17/2011	CN102157459A TSV (through silicon via) chip bonding structure
08/17/2011	CN102157458A Electronic component, semiconductor package and electronic device
08/17/2011	CN102157457A Pressure-contacted power semiconductor module with tape-like load connection elements
08/17/2011	CN102157453A Stack-type package structure and manufacturing method thereof
08/17/2011	CN102157450A Multiple silicide integration structure and method
08/17/2011	CN102157441A Method for manufacturing composite covering layer
08/17/2011	CN102157440A Method for producing a multifunctional dielectric layer on a substrate
08/17/2011	CN102157439A Ultra-low dielectric constant material film and preparation method thereof
08/17/2011	CN102157408A Through hole-interconnected wafer level MOSFET packaging structure and realization method
08/17/2011	CN102157397A Method of forming an em protected semiconductor die
08/17/2011	CN102157391A Semiconductor device and method of forming thin profile wlcsp with vertical interconnect over package footprint
08/17/2011	CN102156901A Paper including semiconductor device and manufacturing method of same
08/17/2011	CN102156387A Radiation-sensitive composition and cured film

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