H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/18/2011	WO2011075265A3 Apparatus and method for embedding components in small-form-factor, system-on-packages
08/18/2011	WO2011060002A3 Redistribution layer enhancement to improve reliability of wafer level packaging
08/18/2011	WO2011049963A3 Method of embedding material in a glass substrate
08/18/2011	WO2011049959A3 Methods and devices for manufacturing cantilever leads in a semiconductor package
08/18/2011	WO2011047067A3 Prismatic cell system with thermal management features
08/18/2011	US20110201200 Diodes, and Methods Of Forming Diodes
08/18/2011	US20110201178 Semiconductor device and process for fabricating the same
08/18/2011	US20110200145 Receiving device, information processing method, program, and semiconductor chip
08/18/2011	US20110199749 Led lead frame structure
08/18/2011	US20110199708 Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit
08/18/2011	US20110199569 Wiring board and liquid crystal display device
08/18/2011	US20110199473 Semiconductor apparatus and endoscope apparatus
08/18/2011	US20110199158 Semiconductor device
08/18/2011	US20110199116 Method for fabrication of a semiconductor device and structure
08/18/2011	US20110198762 Panelized packaging with transferred dielectric
08/18/2011	US20110198761 Methods for Multi-Wire Routing and Apparatus Implementing Same
08/18/2011	US20110198760 Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method
08/18/2011	US20110198759 Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
08/18/2011	US20110198758 Semiconductor device including contact plug and method of manufacturing the same
08/18/2011	US20110198757 Semiconductor structure having an air-gap region and a method of manufacturing the same
08/18/2011	US20110198756 Organometallic Precursors and Related Intermediates for Deposition Processes, Their Production and Methods of Use
08/18/2011	US20110198755 Solder alloy and semiconductor device
08/18/2011	US20110198754 Semiconductor device including porous layer covered by poreseal layer
08/18/2011	US20110198753 Improved wafer level chip scale packaging
08/18/2011	US20110198752 Lead frame ball grid array with traces under die
08/18/2011	US20110198751 Bond pad with multiple layer over pad metallization and method of formation
08/18/2011	US20110198750 Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device
08/18/2011	US20110198749 Semiconductor chip package and method of manufacturing the same
08/18/2011	US20110198748 Semiconductor device and method of fabricating same
08/18/2011	US20110198747 Conductive pillar structure for semiconductor substrate and method of manufacture
08/18/2011	US20110198745 Wafer-level packaged device having self-assembled resilient leads
08/18/2011	US20110198744 Land grid array package capable of decreasing a height difference between a land and a solder resist
08/18/2011	US20110198743 Method of Manufacturing a Semiconductor Device with a Carrier Having a Cavity and Semiconductor Device
08/18/2011	US20110198742 Semiconductor device and electronic device
08/18/2011	US20110198741 Integrated Circuit Package with Enlarged Die Paddle
08/18/2011	US20110198740 Semiconductor storage device and manufacturing method thereof
08/18/2011	US20110198739 Method for Manufacturing Semiconductor Device
08/18/2011	US20110198738 Method for manufacturing a microelectronic package comprising at least one microelectronic device
08/18/2011	US20110198737 Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
08/18/2011	US20110198735 Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
08/18/2011	US20110198732 Chip package and method for forming the same
08/18/2011	US20110198731 Apparatus and Method for Defining Laser Cleave Alignment
08/18/2011	US20110198723 Method of embedding passive component within via
08/18/2011	US20110198722 Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same
08/18/2011	US20110198721 Method for thinning a wafer
08/18/2011	US20110198719 Electronic device comprising a plurality of electronic components laid down on a substrate and associated infrared sensor
08/18/2011	US20110198702 Contact Formation Method, Semiconductor Device Manufacturing Method, and Semiconductor Device
08/18/2011	US20110198698 Bit line structure, semiconductor device and method of forming the same
08/18/2011	US20110198678 Electrostatic discharge protection circuit
08/18/2011	US20110198672 Three dimensional structure memory
08/18/2011	US20110198627 Organic Optoelectronic Device And A Method For Encapsulating Said Device
08/18/2011	US20110198589 Semiconductor chip
08/18/2011	US20110198570 Self assembled nano dots (sand) and non-self assembled nano-dots (nsand) device structures and fabrication methods thereof to create spacers for energy transfer
08/18/2011	US20110198498 Thermoelectric device and method of forming the same, temperature sensing sensor, and heat-source image sensor using the same
08/18/2011	US20110197944 Stackable flat-roof/ground framework for solar panels
08/18/2011	DE202011101830U1 Kühleinheit und deren Kühlmodul Cooling unit and the cooling module
08/18/2011	DE19983379B4 Temperaturregelung elektronischer Bauelemente unter Verwendung von Leistungsfolgerückkopplung Temperature control of electronic devices using power feedback sequence
08/18/2011	DE102011011538A1 Durch Wafer-Level-Packaging gefertigte Vorrichtung mit selbstmontierten elastischen Anschlusskontakten Manufactured by wafer-level packaging device with self-assembled elastic connection contacts
08/18/2011	DE102010064410A1 Halbleitervorrichtung mit Bootstrap-Schaltung A semiconductor device comprising bootstrap circuit
08/18/2011	DE102010001824A1 Zusammengepackte Vorrichtung und Herstellungsverfahren davon Packed together device and manufacturing method thereof
08/18/2011	DE102006019118B4 Bauelement mit optischer Markierung und Verfahren zur Herstellung Device with optical marker and methods for making
08/18/2011	DE102005001718B4 Integrierte Schaltkreisanordnung und Verfahren zum Herstellen einer elektrisch leitfähigen Verbindung in einer Verdrahtungsebene in einer integrierten Schaltkreisanordnung Integrated circuit arrangement and method for producing an electrically conductive connection in a wiring layer in an integrated circuit arrangement
08/18/2011	DE102004041904B4 Verfahren zur Einstellung eines Serienwiderstandes am Gate eines Leistungstransistors Method for setting a resistance in series to the gate of a power transistor
08/17/2011	EP2357875A1 Method for manufacturing an electronic box
08/17/2011	EP2357668A1 Package for housing a semiconductor element and semiconductor device using the same
08/17/2011	EP2357667A2 Radio frequency amplifier with effective decoupling
08/17/2011	EP2357666A2 III-nitride power device with solderable front metal
08/17/2011	EP2357665A2 Chip package and method for fabricating the same
08/17/2011	EP2357664A1 Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device
08/17/2011	EP2357629A1 Substrate for display panel, and display panel
08/17/2011	EP2357440A1 Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system
08/17/2011	EP2357215A1 Use of an adhesive composition, a circuit connecting material, a process for the production of a circuit member connection structure and a semiconductor device
08/17/2011	EP2357204A1 Composition
08/17/2011	EP2356894A1 Power converter module having a cooled busbar
08/17/2011	EP2356740A1 Method and system for amplifying a signal using a transformer matched transistor
08/17/2011	EP2356681A1 X-ray opaque coating
08/17/2011	EP2356680A2 Extremely stretchable electronics
08/17/2011	EP2356679A1 Integrated capacitor with interlinked lateral fins
08/17/2011	EP2356678A1 Inks and pastes for solar cell fabrication
08/17/2011	EP2356677A1 Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same
08/17/2011	EP1909321B1 Metal-ceramic composite substrate and method for manufacturing same
08/17/2011	EP1636842B1 Stackable semiconductor device and method of manufacturing the same
08/17/2011	EP1354349B1 Area efficient stacking of antifuses in semiconductor device
08/17/2011	EP1260125B1 Thermal management system
08/17/2011	EP1123565B1 Embedded capacitor multi-chip modules
08/17/2011	CN201937981U 方便重黏妥的复合导散热结构 Facilitate re-sticky heat conduction due composite structure
08/17/2011	CN201937484U Ultrathin surface-mount bridge rectifier
08/17/2011	CN201937444U 一种晶闸管换流阀阀模块 One kind of thyristor valve module
08/17/2011	CN201937124U 电连接器组件 The electrical connector assembly
08/17/2011	CN201936918U 一种金属铜箔积层板 One metal foil laminates
08/17/2011	CN201936880U 太阳电池阵列用二极管串并联保护组件 Solar arrays in parallel with the diode string protection components
08/17/2011	CN201936879U Chip stacking and packaging structure without outer pin
08/17/2011	CN201936878U Surface mount type polymer electrostatic discharge protective element
08/17/2011	CN201936877U Hsip引线框架 Hsip leadframe
08/17/2011	CN201936876U 一种分立器件的引线框架 A lead frame for a discrete device
08/17/2011	CN201936875U Double-sided graphic chip normal-mounting module packaging structure
08/17/2011	CN201936874U Double-sided graphics chip positive single packaging structure
08/17/2011	CN201936873U 热泵用电气元件散热器及使用该散热器的热泵系统 Heat radiator with the electrical components and the use of a heat pump system of the radiator
08/17/2011	CN201936872U 一种散热器用铝型材 Radiator with aluminum
08/17/2011	CN201936871U 一种散热装置 A heat sink device

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