H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/24/2011	CN102161831A Prepreg, laminate, printed wiring board, and semiconductor device
08/24/2011	CN102161815A Epoxy resin composition and semiconductor device using thereof
08/24/2011	CN102161470A Method of enclosing a micromechnical element formed between a base layer and a metallization layer
08/24/2011	CN101831248B Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
08/24/2011	CN101794757B Substrate and chip package structure
08/24/2011	CN101777554B Electrostatic protection element of bidirectional silicon-controlled rectifier
08/24/2011	CN101771045B Complementary type SCR (Silicon Controlled Rectifier) structure by auxiliary triggering of PNP (positive-negative-positive) bipolar transistors
08/24/2011	CN101728379B Organic light-emitting diode display device and its manufacture method
08/24/2011	CN101642004B Method for fitting an electrical component to a contacting element and contacting element with an electrical component
08/24/2011	CN101636038B Printed circuit board ball grid array system having improved mechanical strength
08/24/2011	CN101615603B Mounting structure and mounting method
08/24/2011	CN101587867B Substrate for insulated gate bipolar type transistor module
08/24/2011	CN101577265B Test structure of breakdown voltage, analytic procedure applying same and wafer
08/24/2011	CN101483191B Semiconductor structures and forming method thereof
08/24/2011	CN101442869B Dynamic detection electrostatic protection circuit
08/24/2011	CN101421831B Apparatus for manufacturing semiconductor
08/24/2011	CN101399259B Circuit device and method of manufacturing the same
08/24/2011	CN101339939B Encapsulation construction and encapsulation method
08/24/2011	CN101303990B Manufacturing method of semiconductor module, semiconductor module and portable apparatus
08/24/2011	CN101266995B Image sensor and method for manufacturing the same
08/24/2011	CN101226979B Semiconductor light-emitting device
08/24/2011	CN101213076B Solder joints for copper metallization having reduced interfacial voids
08/24/2011	CN101207104B Flush type capacitance ultra-low inductance design
08/24/2011	CN101207103B Semiconductor encapsulated element and method of manufacture thereof
08/24/2011	CN101060763B Heat radiator
08/24/2011	CN101009247B Multilevel semiconductor device and method of manufacturing the same
08/23/2011	US8006205 Semiconductor device layout method, a computer program, and a semiconductor device manufacture method
08/23/2011	US8005557 Audio signal processing apparatus
08/23/2011	US8005556 Audio signal processing apparatus
08/23/2011	US8005555 Audio signal processing apparatus
08/23/2011	US8004848 Stack module, card including the stack module, and system including the stack module
08/23/2011	US8004812 Energy conditioning circuit arrangement for integrated circuit
08/23/2011	US8004411 Method for manufacturing radio frequency IC tag and antenna
08/23/2011	US8004098 Alignment key, method for fabricating the alignment key, and method for fabricating thin film transistor substrate using the alignment key
08/23/2011	US8004097 Carrier wafer having alignment keys and supporting a chip
08/23/2011	US8004096 Semiconductor device and a manufacturing method thereof
08/23/2011	US8004095 Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
08/23/2011	US8004093 Integrated circuit package stacking system
08/23/2011	US8004092 Semiconductor chip with post-passivation scheme formed over passivation layer
08/23/2011	US8004091 Semiconductor package, method of fabricating the same, and semiconductor package mold
08/23/2011	US8004090 Semiconductor device and method for manufacturing the same
08/23/2011	US8004089 Semiconductor device having wiring line and manufacturing method thereof
08/23/2011	US8004088 Post passivation interconnection schemes on top of IC chip
08/23/2011	US8004086 Semiconductor device
08/23/2011	US8004085 Semiconductor device and method of manufacturing semiconductor device
08/23/2011	US8004084 Semiconductor device and manufacturing method thereof
08/23/2011	US8004083 Integrated circuit chips with fine-line metal and over-passivation metal
08/23/2011	US8004081 Semiconductor chip package and printed circuit board having through interconnections
08/23/2011	US8004080 Edge mounted integrated circuits with heat sink
08/23/2011	US8004079 Chip package structure and manufacturing method thereof
08/23/2011	US8004078 Adhesive composition for semiconductor device
08/23/2011	US8004077 Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof
08/23/2011	US8004075 Semiconductor power module including epoxy resin coating
08/23/2011	US8004074 Semiconductor device and fabrication method
08/23/2011	US8004073 Integrated circuit packaging system with interposer and method of manufacture thereof
08/23/2011	US8004072 Packaging systems and methods
08/23/2011	US8004071 Semiconductor memory device
08/23/2011	US8004070 Wire-free chip module and method
08/23/2011	US8004069 Lead frame based semiconductor package and a method of manufacturing the same
08/23/2011	US8004068 Shielded multi-layer package structures
08/23/2011	US8004067 Semiconductor apparatus
08/23/2011	US8004066 Crack stop and moisture barrier
08/23/2011	US8004061 Conductive trace with reduced RF impedance resulting from the skin effect
08/23/2011	US8004059 eFuse containing SiGe stack
08/23/2011	US8004056 Solid-state imaging device and method for manufacturing the same
08/23/2011	US8004041 Semiconductor device for surge protection
08/23/2011	US8004033 High-density nonvolatile memory
08/23/2011	US8004022 Field effect transistor
08/23/2011	US8004014 Semiconductor integrated circuit device having metal interconnect regions placed symmetrically with respect to a cell boundary
08/23/2011	US8003984 Reticle for wafer test structure areas
08/23/2011	US8003983 Wafer for manufacturing image sensors, test key layout for defects inspection, and methods for manufacturing image sensors and for forming test key
08/23/2011	US8003900 Mesh sheet and housing for electronic devices
08/23/2011	US8003898 Seal structure
08/23/2011	US8003895 Electronic parts packaging structure and method of manufacturing the same
08/23/2011	US8003496 Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
08/23/2011	US8003488 Shallow trench isolation structure compatible with SOI embedded DRAM
08/23/2011	US8003448 Semiconductor package and method for producing the same
08/23/2011	US8003447 Multi-chip module for battery power control
08/23/2011	US8003445 Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof
08/23/2011	US8003443 Non-leaded integrated circuit package system with multiple ground sites
08/23/2011	US8003438 Circuit module and manufacturing method thereof
08/23/2011	US8003426 Method for manufacturing package structure of optical device
08/19/2011	DE202011005612U1 Wärmeaustauschvorrichtung Heat exchange device
08/18/2011	WO2011100451A1 Asymmetric front / back solder mask
08/18/2011	WO2011100351A1 Semiconductor die package structure
08/18/2011	WO2011100212A1 Methods of forming contact structures including alternating metal and silicon layers and related devices
08/18/2011	WO2011100207A2 Interconnect pattern for transceiver package
08/18/2011	WO2011100190A2 Interconnect pattern for high performance interfaces
08/18/2011	WO2011100021A2 Bond pad with multiple layer over pad metallization and method of formation
08/18/2011	WO2011099937A1 A stack arrangement
08/18/2011	WO2011099934A1 A method of forming a bonded structure
08/18/2011	WO2011099624A1 Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein
08/18/2011	WO2011099501A1 Curable composition, cured article, and use of curable composition
08/18/2011	WO2011099378A1 Spherical hydrotalcite compound and resin composition for electronic component encapsulation
08/18/2011	WO2011099356A1 Package component
08/18/2011	WO2011099095A1 Semiconductor device and method for producing same
08/18/2011	WO2011098679A1 Interconnection structure made of redirected carbon nanotubes
08/18/2011	WO2011098534A1 Scalable construction for lateral semiconductor components having high current-carrying capacity
08/18/2011	WO2011097732A1 Solar cell assembly with solder lug
08/18/2011	WO2011097676A1 Contact composition

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