| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/25/2011 | US20110204357 Semiconductor device and penetrating electrode testing method |
| 08/25/2011 | US20110204356 Method for staining sample |
| 08/25/2011 | US20110203656 Nanoscale High-Aspect-Ratio Metallic Structure and Method of Manufacturing Same |
| 08/25/2011 | DE112009002197T5 Eingabe/Ausgabe-Architektur für montierte Prozessoren und Verfahren zur Verwendung derselben Input / output architecture for processors mounted and methods of using same |
| 08/25/2011 | DE102011004480A1 Stromsensoren und Verfahren Current sensors and methods |
| 08/25/2011 | DE102011000836A1 Bauelement mit einem eingekapselten Halbleiterchip und Herstellungsverfahren Component having an encapsulated semiconductor chip and manufacturing processes |
| 08/25/2011 | DE102010054613A1 Strömungsrohrvorrichtung Flow tube apparatus |
| 08/25/2011 | DE102010047646A1 Harz versiegelte elektronische Steuervorrichtung und Verfahren zur Herstellung derselben A resin sealed electronic control apparatus and method for producing same |
| 08/25/2011 | DE102010044499A1 Harz versiegelte elektronische Steuervorrichtung und Verfahren zur Herstellung derselben A resin sealed electronic control apparatus and method for producing same |
| 08/25/2011 | DE102010041714A1 Power semiconductor module, has base plate with hermetically sealed chamber for retaining cooling fluid, and circuit carrier with lower side firmly connected with base plate, where lower side is turned away from upper metallization |
| 08/25/2011 | DE102010038246A1 Oberflächenmontierbares drahtloses Package mit offenem Hohlraum für Hochleistungs-HF-Anwendungen Surface-mountable package with an open cavity for wireless high power RF applications |
| 08/25/2011 | DE102010037490A1 Halbleitervorrichtung mit Metallsilizidschicht und Verfahren zum Herstellen derselben A semiconductor device having metal silicide layer, and methods for manufacturing the same |
| 08/25/2011 | DE102010031009A1 Leistungsmodulanordnung mit versetzten Kühlkanälen Power module assembly with offset cooling channels |
| 08/25/2011 | DE102010008815A1 Überspannungsschutz für einen Halbleiterschalter Surge protection for a semiconductor switch |
| 08/25/2011 | DE102010008605A1 Optoelektronisches Bauteil The optoelectronic device |
| 08/25/2011 | DE102010002235A1 Kühlkörper für eine Lichtquelle Heat sink for a light source |
| 08/25/2011 | DE102010002227A1 Schutz von LEDs gegen Überhitzung und zu hohem Durchgangsstrom Protection of LEDs from overheating and excessive through current |
| 08/25/2011 | DE102010002140A1 Circuitry has carrier on which power component is received over coupling layer which is formed by mole dynamic mechanical analysis-solid state extrusion (DMA-SSE) portion, connected with the heat sink |
| 08/25/2011 | DE102008034148B4 Leistungshalbleitermodulsystem und Verfahren zur Herstellung einer Leistungshalbleiteranordnung Power semiconductor module system and method for manufacturing a power semiconductor arrangement |
| 08/25/2011 | DE102007061598B4 Trägeraufbau für einen Leistungsbaustein mit einer Bodenplatte und Verfahren zu dessen Herstellung Support structure for a power module having a base plate and process for its preparation |
| 08/25/2011 | DE102007057684B4 Verfahren und Teststruktur zur Überwachung von CMP-Prozessen in Metallisierungsschichten von Halbleiterbauelementen The method and test structure for monitoring of CMP processes in metallization of semiconductor components |
| 08/25/2011 | DE102007046451B4 Vorrichtung zur Detektion von Wärmestrahlung mit hoher Auflösung, Verfahren zum Herstellen und Verwendung der Vorrichtung A device for detection of thermal radiation with high resolution, methods of making and using the apparatus |
| 08/24/2011 | EP2361005A1 Circuit module |
| 08/24/2011 | EP2361000A1 Leadless chip package mounting method and carrier |
| 08/24/2011 | EP2360999A1 Structure of conductive holes of multilayer board and manufacturing method thereof |
| 08/24/2011 | EP2360726A2 Microwave circuit package |
| 08/24/2011 | EP2360725A2 Heat dissipation system with a spray cooling device |
| 08/24/2011 | EP2360724A1 Heat dissipation structure having combined cooling fins |
| 08/24/2011 | EP2360723A1 Semiconductor device with copper wirings |
| 08/24/2011 | EP2360661A1 Circuit substrate, display panel, and display device |
| 08/24/2011 | EP2360298A2 Method for depositing a semiconductor nanowire |
| 08/24/2011 | EP2360218A1 Bonding method, bonded structure, method for producing optical module, and optical module |
| 08/24/2011 | EP2359395A1 Methods for protecting a die surface with photocurable materials |
| 08/24/2011 | EP2250670B1 Method for the electrical connection of a component provided with protrusions comprising blocks with compensating effect |
| 08/24/2011 | EP2238620B1 Embedded constrainer discs for reliable stacked vias in electronic substrates |
| 08/24/2011 | EP1408544B1 Film thichness measuring monitor wafer |
| 08/24/2011 | EP1388988B1 Chip-scale coils and isolators based thereon |
| 08/24/2011 | EP1364416B1 Thermoelectric devices |
| 08/24/2011 | EP1240668B1 Method and apparatus for encoding information in an ic package |
| 08/24/2011 | CN201947526U 用于集成电路的厚铜线路板 Thick copper circuit board for integrated circuits |
| 08/24/2011 | CN201947157U 一种功率器件的单桥臂模块 A single-arm module power devices |
| 08/24/2011 | CN201946600U Vertical light-emitting diode |
| 08/24/2011 | CN201946590U 新型球栅阵列封装载板 The new ball grid array package substrate |
| 08/24/2011 | CN201946589U Improved lead frame |
| 08/24/2011 | CN201946588U 一种功率半导体器件的封装结构 A power semiconductor device package structure |
| 08/24/2011 | CN201946587U 板式热管传热元件 Plate heat pipe heat transfer element |
| 08/24/2011 | CN201946586U 记忆体用滑扣式散热结构及具有该结构的记忆体装置 Memory cooling structure with sliding button and have the memory device of the structure |
| 08/24/2011 | CN201946585U Packaging structure for semiconductor power device |
| 08/24/2011 | CN201946584U 一种半导体器件的加热装置 A heating device of a semiconductor device |
| 08/24/2011 | CN201946583U 一种玻璃钝化整流芯片 A glass passivated rectifier chips |
| 08/24/2011 | CN102165857A Electrically-conductive foam EMI shield |
| 08/24/2011 | CN102165851A Printed circuit board for harsh environments |
| 08/24/2011 | CN102165677A Power tool |
| 08/24/2011 | CN102165587A Method for fabricating a through interconnect on a semiconductor substrate |
| 08/24/2011 | CN102165586A Leadframe substrate and method for manufacturing same |
| 08/24/2011 | CN102165585A Leadframe substrate and method for manufacturing same, and semiconductor device |
| 08/24/2011 | CN102165584A Input/output architecture for mounted processors, and methods of using same |
| 08/24/2011 | CN102165583A Semiconductor device |
| 08/24/2011 | CN102165582A Leadframe substrate, method for manufacturing same, and semiconductor device |
| 08/24/2011 | CN102165581A Lead frame substrate manufacturing method and semiconductor device |
| 08/24/2011 | CN102165576A Semiconductor device and semiconductor device manufacturing method |
| 08/24/2011 | CN102165028A Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component |
| 08/24/2011 | CN102165011A Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device |
| 08/24/2011 | CN102164258A Circuit-substrate laminated module and electronic apparatus |
| 08/24/2011 | CN102163928A Special ultrahigh-power rectification power electronic device module for ultrasonic welding machine |
| 08/24/2011 | CN102163907A Voltage source inverter basic function unit based on total control device |
| 08/24/2011 | CN102163624A Thin film transistor structure, method of manufacturing the same, and electronic device |
| 08/24/2011 | CN102163604A Resistance correction circuit |
| 08/24/2011 | CN102163603A Packaging structure for system level fan-out wafer |
| 08/24/2011 | CN102163597A Diode series-parallel connection protection component for solar cell array |
| 08/24/2011 | CN102163596A Integrated circuit device and its forming method |
| 08/24/2011 | CN102163595A 堆叠半导体封装 Stacked semiconductor package |
| 08/24/2011 | CN102163594A Resin-sealed electronic control device and method of fabricating the same |
| 08/24/2011 | CN102163593A 集成电路芯片 IC chip |
| 08/24/2011 | CN102163592A Semiconductor structure having an air-gap region and a method of manufacturing the same |
| 08/24/2011 | CN102163591A Spherical grating array IC (integrated circuit) chip packaging part and production method thereof |
| 08/24/2011 | CN102163590A Three-dimensional multi-chip encapsulation module based on buried substrate and method |
| 08/24/2011 | CN102163589A Wafer-level packaged device having self-assembled resilient leads |
| 08/24/2011 | CN102163588A Conductive pillar structure for semiconductor substrate and method of manufacture |
| 08/24/2011 | CN102163587A Interconnecting aluminum tape for packaging integrated circuit |
| 08/24/2011 | CN102163586A 半导体装置 Semiconductor device |
| 08/24/2011 | CN102163585A 半导体装置 Semiconductor device |
| 08/24/2011 | CN102163584A Electronic device |
| 08/24/2011 | CN102163583A Method and equipment for heating semiconductor device |
| 08/24/2011 | CN102163582A Chip package |
| 08/24/2011 | CN102163581A Semiconductor module |
| 08/24/2011 | CN102163580A Thin encapsulation body and manufacturing method thereof |
| 08/24/2011 | CN102163579A Land grid array package capable of decreasing a height difference between a land and a solder resist |
| 08/24/2011 | CN102163578A Semiconductor device, chip-on-chip mounting structure, method of manufacturing the semiconductor device, and method of forming the chip-on-chip mounting structure |
| 08/24/2011 | CN102163577A Semiconductor device and method of manufacturing semiconducter device |
| 08/24/2011 | CN102163564A Bonded structure and manufacturing method for bonded structure |
| 08/24/2011 | CN102163563A Epoxy resin formulations for underfill applications |
| 08/24/2011 | CN102163561A Semiconductor device and method of forming tmv and tsv in wlcsp using same carrier |
| 08/24/2011 | CN102163560A Wireless communication device for remote authenticity verification of semiconductor chips, multi-chip modules and derivative products |
| 08/24/2011 | CN102163544A Package board carrying lath and mixing-preventing method thereof |
| 08/24/2011 | CN102162961A Array substrate |
| 08/24/2011 | CN102162744A Flow sensor, method for manufacturing flow sensor and flow sensor module |
| 08/24/2011 | CN102161873A Adhesive composition, circuit connecting material and connecting structure of circuit member |
| 08/24/2011 | CN102161869A Dicing tape-integrated film for semiconductor back surface |
| 08/24/2011 | CN102161866A Adhesive composition, circuit connecting material and connecting structure of circuit member |