H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/30/2011	US8008754 Semiconductor package having an antenna with reduced area and method for fabricating the same
08/30/2011	US8008753 System and method to reduce shorting of radio frequency (RF) shielding
08/30/2011	US8008752 Component for an information display device
08/30/2011	US8008750 Crack stops for semiconductor devices
08/30/2011	US8008745 Latch circuits and operation circuits having scalable nonvolatile nanotube switches as electronic fuse replacement elements
08/30/2011	US8008729 Integrated circuit with a contact structure including a portion arranged in a cavity of a semiconductor structure
08/30/2011	US8008727 Semiconductor integrated circuit device including a pad and first mosfet
08/30/2011	US8008726 Trig modulation electrostatic discharge (ESD) protection devices
08/30/2011	US8008724 Structure and method to enhance both nFET and pFET performance using different kinds of stressed layers
08/30/2011	US8008700 Non-volatile memory cell with embedded antifuse
08/30/2011	US8008675 Package for mounting an optical element and a method of manufacturing the same
08/30/2011	US8008661 Insert module for a test handler
08/30/2011	US8008660 Display apparatus and electrophoretic display apparatus
08/30/2011	US8008659 Semiconductor integrated circuit device
08/30/2011	US8008410 Epoxy resin composition for encapsulating semiconductor and semiconductor device
08/30/2011	US8008191 Semiconductor device and method for manufacturing the same
08/30/2011	US8008134 Large substrate structural vias
08/30/2011	US8008131 Semiconductor chip package assembly method and apparatus for countering leadfinger deformation
08/30/2011	US8008130 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
08/30/2011	US8008129 Method of making semiconductor device packaged by sealing resin member
08/30/2011	US8008127 Method of fabricating an integrated circuit having a multi-layer structure with a seal ring
08/30/2011	US8008126 Castellation wafer level packaging of integrated circuit chips
08/30/2011	US8008121 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
08/30/2011	US8006747 Micro-chimney and thermosiphon die-level cooling
08/30/2011	US8006746 3-dimensional high performance heat sinks
08/26/2011	DE202011102898U1 Symmetrische Reihenschaltung von Ventilatoren Symmetrical series of ventilators
08/25/2011	WO2011102572A1 Heat sink sheet including an adhesive having good heat conductivity
08/25/2011	WO2011102547A1 Power semiconductor element
08/25/2011	WO2011102535A1 Ceramic substrate, electrical circuit module, and method for producing each
08/25/2011	WO2011102396A1 Al alloy film for display device
08/25/2011	WO2011102170A1 Thermally conductive pressure-sensitive adhesive composition, thermally conductive pressure-sensitive adhesive sheet, and electronic component
08/25/2011	WO2011102133A1 Component-embedded substrate
08/25/2011	WO2011102101A1 Stacked semiconductor device
08/25/2011	WO2011102100A1 Semiconductor device and stacked-type semiconductor device
08/25/2011	WO2011102096A1 High frequency module manufacturing method
08/25/2011	WO2011102095A1 Module manufacturing method
08/25/2011	WO2011102059A1 Metal laminate structure and production method for same
08/25/2011	WO2011102049A1 Acoustic wave device
08/25/2011	WO2011102040A1 Substrate for mounting element, and method for manufacturing the substrate
08/25/2011	WO2011101989A1 Thermally conductive sheet
08/25/2011	WO2011101393A1 SYSTEM AND METHOD FOR ELECTRICAL TESTING OF THROUGH SILICON VIAS (TSVs)
08/25/2011	WO2011101359A1 Method for manufacturing an electronic package
08/25/2011	WO2011101272A1 Device including electrical, electronic, electromechanical or electro-optical components having reduced sensitivity at a low dose rate
08/25/2011	WO2011101170A1 Method and assembly for producing a semiconductor module
08/25/2011	WO2011037373A3 Solar cell module and method of manufacturing the same
08/25/2011	WO2010119416A3 Foil and method for foil-based clip-and/or wire-bonding and resulting package
08/25/2011	US20110208467 Calibration standards and methods of their fabrication and use
08/25/2011	US20110207409 Electrostatic discharge circuit using inductor-triggered silicon-controlled rectifier
08/25/2011	US20110207288 Semiconductor device and a method of manufacturing the same and designing the same
08/25/2011	US20110205720 Integrated chip package structure using organic substrate and method of manufacturing the same
08/25/2011	US20110204915 Die testing using top surface test pads
08/25/2011	US20110204528 Postive-type photosensitive resin composition, method for producing resist pattern, and electronic component
08/25/2011	US20110204527 Wireless communication system
08/25/2011	US20110204526 Methods of Determining X-Y Spatial Orientation of a Semiconductor Substrate Comprising an Integrated Circuit, Methods of Positioning a Semiconductor Substrate Comprising an Integrated Circuit, Methods of Processing a Semiconductor Substrate, and Semiconductor Devices
08/25/2011	US20110204525 Semiconductor device and fabrication method for the same
08/25/2011	US20110204524 Structures and methods of forming pre fabricated deep trench capacitors for soi substrates
08/25/2011	US20110204523 Method of fabricating dual damascene structures using a multilevel multiple exposure patterning scheme
08/25/2011	US20110204522 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
08/25/2011	US20110204521 Chip-scale semiconductor device package and method of manufacturing the same
08/25/2011	US20110204520 Metal electrode and semiconductor element using the same
08/25/2011	US20110204519 Semiconductor device and method of manufacturing the same
08/25/2011	US20110204518 Scalability with reduced contact resistance
08/25/2011	US20110204517 Semiconductor Device with Vias Having More Than One Material
08/25/2011	US20110204516 Single chip semiconductor coating structure and manufacturing method thereof
08/25/2011	US20110204515 Ic die including rdl capture pads with notch having bonding connectors or its ubm pad over the notch
08/25/2011	US20110204514 Package device and fabrication method thereof
08/25/2011	US20110204513 Device Including an Encapsulated Semiconductor Chip and Manufacturing Method Thereof
08/25/2011	US20110204512 Wirebondless Wafer Level Package with Plated Bumps and Interconnects
08/25/2011	US20110204511 System and Method for Improving Reliability of Integrated Circuit Packages
08/25/2011	US20110204510 Chip structure and method for fabricating the same
08/25/2011	US20110204509 Semiconductor Device and Method of Forming IPD in Fan-Out Level Chip Scale Package
08/25/2011	US20110204508 Semiconductor packaging system with an aligned interconnect and method of manufacture thereof
08/25/2011	US20110204507 Two-shelf interconnect
08/25/2011	US20110204506 Thermal Interface Material Design for Enhanced Thermal Performance and Improved Package Structural Integrity
08/25/2011	US20110204505 Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier
08/25/2011	US20110204504 Reducing Susceptibility to Electrostatic Discharge Damage during Die-To-Die Bonding for 3-D Packaged Integrated Circuits
08/25/2011	US20110204503 Microelectronic package assembly, method for disconnecting a microelectronic package
08/25/2011	US20110204502 Method of Manufacturing A Semiconductor Device
08/25/2011	US20110204501 Integrated circuit packaging system including non-leaded package
08/25/2011	US20110204499 Semiconductor device assemblies
08/25/2011	US20110204498 Lead frame and semiconductor package manufactured therewith
08/25/2011	US20110204497 Semiconductor integrated circuit and method for manufacturing the same
08/25/2011	US20110204496 Circuit module, electronic device including the same, and circuit module manufacturing method
08/25/2011	US20110204495 Device having wire bond and redistribution layer
08/25/2011	US20110204494 Integrated circuit packaging system with shield and method of manufacture thereof
08/25/2011	US20110204493 Shielding structure for transmission lines
08/25/2011	US20110204492 Microelectronic structure including a low K dielectric and a method of controlling carbon distribution in the structure
08/25/2011	US20110204491 Dielectric layer structure
08/25/2011	US20110204487 Semiconductor device and electronic apparatus
08/25/2011	US20110204486 Method of manufacturing a semiconductor integrated circuit device
08/25/2011	US20110204484 Sub-Wavelength Segmentation in Measurement Targets on Substrates
08/25/2011	US20110204470 Method, system, and apparatus for adjusting local and global pattern density of an integrated circuit design
08/25/2011	US20110204462 Method and apparatus providing an imager module with a permanent carrier
08/25/2011	US20110204456 Packaged device with acoustic transducer and amplifier
08/25/2011	US20110204453 Methods Of Forming Electrically Conductive Lines, Methods Of Forming An Electrically Conductive Buried Line And An Electrical Contact Thereto, Electrically Conductive Lines, And Integrated Circuitry Comprising A Line Of Recessed Access Devices
08/25/2011	US20110204419 Integrated circuits including multi-gate transistors locally interconnected by continuous fin structure and methods for the fabrication thereof
08/25/2011	US20110204408 High thermal performance packaging for optoelectronics devices
08/25/2011	US20110204386 Metal based electronic component package and the method of manufacturing the same
08/25/2011	US20110204359 Semiconductor device
08/25/2011	US20110204358 Semiconductor integrated circuit device, design method, design apparatus, and program

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