H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2011
08/31/2011	CN102169872A Power module of integrated inductor
08/31/2011	CN102169871A Structure and manufacturing method of antistatic circuit
08/31/2011	CN102169870A Semiconductor device and penetrating electrode testing method
08/31/2011	CN102169869A Reliability testing structure and method for detecting crystal orientation correlation of MOS (Metal Oxide Semiconductor) components
08/31/2011	CN102169868A On-chip integrated inductor
08/31/2011	CN102169867A Lead frame
08/31/2011	CN102169866A Semiconductor device and method of manufacturing a semiconductor device
08/31/2011	CN102169865A Semiconductor integrated circuit and method for manufacturing the same
08/31/2011	CN102169864A Lead frame sheet
08/31/2011	CN102169863A Window ball grid array semiconductor packages
08/31/2011	CN102169862A Fairlead structure for Bipolar circuit and manufacturing method thereof
08/31/2011	CN102169861A Semiconductor structure with passive component structure and manufacture method thereof
08/31/2011	CN102169860A Semiconductor structure with passive component structure and manufacturing method thereof
08/31/2011	CN102169859A Thyristor converter valve tower for high voltage direct current transmission
08/31/2011	CN102169858A Semiconductor power module, converter and method of manufacturing a cooling jacket
08/31/2011	CN102169857A Flexible heat pipe structure and manufacturing method thereof
08/31/2011	CN102169856A 散热结构体 Heat dissipation structure
08/31/2011	CN102169855A Interconnection structure and its design method
08/31/2011	CN102169845A Multi-layer mixed synchronization bonding structure and method for three-dimensional packaging
08/31/2011	CN102169844A Method for manufacturing semiconductor device, particle, and semiconductor device
08/31/2011	CN102169842A Techniques and configurations for recessed semiconductor substrates
08/31/2011	CN102169841A Recessed semiconductor substrate and associated technique
08/31/2011	CN102169838A Manufacturing method of carbon nano-tube micro-channel cooler system
08/31/2011	CN102169550A Card device
08/31/2011	CN102169263A Array substrate, substrate module and display panel
08/31/2011	CN102167924A Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
08/31/2011	CN102167905A Polyimide resin composition for semiconductor devices, method of forming film in semiconductor devices using the same and semiconductor devices
08/31/2011	CN101814480B Chip package structure and packaging method thereof
08/31/2011	CN101755334B 半导体器件 Semiconductor devices
08/31/2011	CN101667597B Vertical double-diffused MOS transistor testing structure
08/31/2011	CN101663751B Semiconductor device
08/31/2011	CN101647075B Thin film resistors with current density enhancing layer (cdel)
08/31/2011	CN101641005B Radiating device
08/31/2011	CN101641003B Radiating device
08/31/2011	CN101635292B Contact pad for measuring electrical thickness of gate dielectric layer and measurement structure thereof
08/31/2011	CN101621013B Method for producing an organic light-emitting device
08/31/2011	CN101616564B Heat sink buckle and heat sink combination using heat sink buckle
08/31/2011	CN101573022B Heat-dissipation structure in closed box body and machining method thereof
08/31/2011	CN101573016B Heat radiating device and fastener
08/31/2011	CN101542715B 半导体装置 Semiconductor device
08/31/2011	CN101506969B Semiconductor device member, liquid for forming semiconductor device member, method for manufacturing semiconductor device member, and liquid for forming semiconductor device member using the method, phosphor composition, semiconductor light-emission device, lighting device and image display device
08/31/2011	CN101504499B Data cable lead wire section structure of TFT-LCD and method for producing the same
08/31/2011	CN101497774B Semiconductor chip liquid encapsulation material
08/31/2011	CN101471338B Semiconductor capacitance structure
08/31/2011	CN101437362B Electronic device mounting device, method, and printing circuit board assembly
08/31/2011	CN101414587B Semiconductor device and method for providing cooling device on the surface thereof
08/31/2011	CN101389200B Miniature fluid cooling system and miniature fluid driving device
08/31/2011	CN101370372B Radiating device
08/31/2011	CN101330788B LED luminous element for integration bidirectional redundancy control apparatus
08/31/2011	CN101309574B Combination of cooling device
08/31/2011	CN101308841B Semiconductor light emitting diode
08/31/2011	CN101290940B Photoelectric conversion element comprising semiconductor and semiconductor device using the same
08/31/2011	CN101290917B Structure of welding mat
08/31/2011	CN101288168B 印刷线路板 Printed circuit boards
08/31/2011	CN101266991B Semiconductor device and method of manufacturing the same
08/31/2011	CN101262035B LED structure and its assembly method
08/31/2011	CN101252107B Semiconductor package structure and manufacturing method thereof
08/31/2011	CN101212885B Heat radiation module
08/31/2011	CN101208799B Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
08/31/2011	CN101138086B Copper bonding or superfine wire with improved bonding and corrosion properties
08/31/2011	CN101056524B Heat radiator
08/31/2011	CN101017809B Structure for forming dual-pole integrated circuit contact hole and contact hole making method
08/30/2011	USRE42653 Semiconductor package with heat dissipating structure
08/30/2011	US8010927 Structure for a stacked power clamp having a BigFET gate pull-up circuit
08/30/2011	US8010228 Process monitoring apparatus and method for monitoring process
08/30/2011	US8009428 Guiding apparatus
08/30/2011	US8009259 Liquid crystal display device, method for fabricating the same, and portable telephone using the same
08/30/2011	US8008789 Substrate for a display panel, and a display panel having the same
08/30/2011	US8008788 Semiconductor device and a method of manufacturing the same
08/30/2011	US8008787 Integrated circuit package system with delamination prevention structure
08/30/2011	US8008786 Dynamic pad size to reduce solder fatigue
08/30/2011	US8008785 Microelectronic assembly with joined bond elements having lowered inductance
08/30/2011	US8008784 Package including a lead frame, a chip and a sealant
08/30/2011	US8008783 Dicing tape and die attach adhesive with patterned backing
08/30/2011	US8008782 Semiconductor device
08/30/2011	US8008781 Apparatus and method for reducing pitch in an integrated circuit
08/30/2011	US8008779 Semiconductor device and semiconductor device manufacturing method
08/30/2011	US8008778 Semiconductor device
08/30/2011	US8008777 Method for manufacturing semiconductor device and the semiconductor device
08/30/2011	US8008776 Chip structure and process for forming the same
08/30/2011	US8008775 Post passivation interconnection structures
08/30/2011	US8008774 Multi-layer metal wiring of semiconductor device preventing mutual metal diffusion between metal wirings and method for forming the same
08/30/2011	US8008773 Semiconductor device and method for fabricating semiconductor device
08/30/2011	US8008772 Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
08/30/2011	US8008771 Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device
08/30/2011	US8008770 Integrated circuit package system with bump pad
08/30/2011	US8008769 Heat-dissipating semiconductor package structure and method for manufacturing the same
08/30/2011	US8008768 Semiconductor device having heat radiating configuration
08/30/2011	US8008767 Semiconductor device
08/30/2011	US8008766 Stacked semiconductor module
08/30/2011	US8008765 Semiconductor package having adhesive layer and method of manufacturing the same
08/30/2011	US8008764 Bridges for interconnecting interposers in multi-chip integrated circuits
08/30/2011	US8008763 Stacked electronic component and manufacturing method thereof
08/30/2011	US8008762 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
08/30/2011	US8008761 Optical semiconductor apparatus
08/30/2011	US8008760 Integrated semiconductor device
08/30/2011	US8008759 Pre-molded clip structure
08/30/2011	US8008758 Semiconductor device with increased I/O leadframe
08/30/2011	US8008757 Resinous hollow package and producing method thereof
08/30/2011	US8008756 Heat dissipating wiring board and method for manufacturing same

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