H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2011
09/01/2011	WO2011104996A1 Thermosetting resin composition, b-stage thermally conductive sheet, and power module
09/01/2011	WO2011104967A1 Electronic device
09/01/2011	WO2011104826A1 Semiconductor module manufacturing method, semiconductor module, and manufacturing device
09/01/2011	WO2011104784A1 Converter module, and method for producing same
09/01/2011	WO2011104779A1 Semiconductor integrated circuit device
09/01/2011	WO2011104777A1 Semiconductor device and production method thereof
09/01/2011	WO2011104361A1 Temperature-controlling system
09/01/2011	WO2011103752A1 Led lamp
09/01/2011	WO2011103720A1 Semiconductor package for mems device and method of manufacturing the same
09/01/2011	WO2011084362A3 Semiconductor chip device with solder diffusion protection
09/01/2011	US20110214100 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
09/01/2011	US20110213907 Semiconductor resistance element, semiconductor module including the same, and processor-based system including the semiconductor module
09/01/2011	US20110212618 Trench interconnect structure and formation method
09/01/2011	US20110212341 Lead frame sheet
09/01/2011	US20110210455 Die bond film, dicing die bond film, and semiconductor device
09/01/2011	US20110210454 Phase Separated Curable Compositions
09/01/2011	US20110210453 Method for designing electronic system
09/01/2011	US20110210452 Through-substrate via and redistribution layer with metal paste
09/01/2011	US20110210451 Methods of forming a metal pattern and semiconductor device structure
09/01/2011	US20110210450 Semiconductor device with hollow structure
09/01/2011	US20110210449 Interconnect structures incorporating air-gap spacers
09/01/2011	US20110210448 Interconnect Structures Incorporating Air-Gap Spacers
09/01/2011	US20110210447 Contact elements of semiconductor devices comprising a continuous transition to metal lines of a metallization layer
09/01/2011	US20110210446 Semiconductor die having a redistribution layer
09/01/2011	US20110210445 Semiconductor device having via connecting between interconnects
09/01/2011	US20110210444 3D Semiconductor Package Using An Interposer
09/01/2011	US20110210443 Semiconductor device having bucket-shaped under-bump metallization and method of forming same
09/01/2011	US20110210442 Semiconductor Package and Trace Substrate with Enhanced Routing Design Flexibility and Method of Manufacturing Thereof
09/01/2011	US20110210441 Chip package
09/01/2011	US20110210440 Stackable electronic package and method of fabricating same
09/01/2011	US20110210439 Semiconductor Package and Manufacturing Method Thereof
09/01/2011	US20110210438 Thermal Vias In An Integrated Circuit Package With An Embedded Die
09/01/2011	US20110210437 Integrated circuit packaging system with exposed conductor and method of manufacture thereof
09/01/2011	US20110210434 Semiconductor device and method of manufacturing a semiconductor device
09/01/2011	US20110210433 Semiconductor chip and film and tab package comprising the chip and film
09/01/2011	US20110210432 Semiconductor device and method of manufacturing the same
09/01/2011	US20110210431 Microwave circuit package
09/01/2011	US20110210430 Device with ground plane for high frequency signal transmission and method therefor
09/01/2011	US20110210429 Semiconductor Substrate, Package and Device and Manufacturing Methods Thereof
09/01/2011	US20110210428 Method for producing a semiconductor component, semiconductor component and intermediate product in the production thereof
09/01/2011	US20110210419 Multi-chip package with improved signal transmission
09/01/2011	US20110210407 Double-faced adhesive film and electronic component module using same
09/01/2011	US20110210343 Semiconductor wafer
09/01/2011	US20110210329 Apparatus and method for predetermined component placement to a target platform
09/01/2011	US20110209856 Cooling apparatus having low profile extrusion and method of manufacture therefor
09/01/2011	DE102011000328A1 Bauelemente für elektrostatische Entladung Components for electrostatic discharge
09/01/2011	DE102010063918A1 Geräuscharme Systemkühlung unter Verwendung gekoppelter Optimierung zwischen integrierten mikroporösen Absorbern und Rotoren Low noise cooling system using coupled optimization between integrated micro-porous absorbers and rotors
09/01/2011	DE102010002434A1 Temperiersystem Temperature control
09/01/2011	DE102010000951A1 Power semiconductor module for use on printed circuit board, has planar, structured metallization arranged on insulating substrate, where metallization has connected portion, and bonding wire bonded at bonding areas at connected portion
09/01/2011	DE102010000943A1 Leistungshalbleitermodul mit zwei miteinander verbundenen Gehäuseteilen und Verfahren zur Herstellung eines Leistungshalbleitermoduls mit zwei miteinander verbundenen Gehäuseteilen Power semiconductor module with two interconnected housing parts and method of manufacturing a power semiconductor module with two interconnected housing parts
09/01/2011	DE102009039247B4 Halbleiterkörper mit einer Anschlusszelle Semiconductor body having a connection cell
09/01/2011	DE102009006822B4 Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem Microstructure, to processes for their preparation, to apparatus for bonding a micro-structure and micro-system
09/01/2011	DE102009000490B4 Leistungshalbleitermodul und Verfahren zu dessen Herstellung The power semiconductor module and method for its production
08/2011
08/31/2011	EP2362719A1 High-density integrated circuit module structure
08/31/2011	EP2362450A2 Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and illumination system
08/31/2011	EP2362417A2 A semiconductor device having a suspended isolating interconnect
08/31/2011	EP2361440A1 Backside illuminated image sensor
08/31/2011	EP1987169B1 Method of manufacturng a gold alloy
08/31/2011	EP1981081B1 Cooling structure of power semiconductor element and inverter
08/31/2011	EP1595905B1 Process for producing high-purity epoxy resin and epoxy resin composition
08/31/2011	EP1022775B1 Method of fabrication of semiconductor device and mounting structure thereof
08/31/2011	DE202011005025U1 Modulares, mit einem Verbindungselement steckbares Wärmetauschersystem Modular, plug-in with a connecting element heat exchanger system
08/31/2011	CN201957376U 一种散热固定夹 A heat sink retention clip
08/31/2011	CN201956945U 应用于高压固态软起设备中的高压串联可控硅组阀的油浸自冷装置 Applied to the high-voltage solid-state high-voltage soft start device series thyristor valve group ONAN device
08/31/2011	CN201956917U 低热阻gbu整流全桥 Low thermal resistance gbu full bridge rectifier
08/31/2011	CN201956358U Axial rectifying diode
08/31/2011	CN201956352U Mosfet栅与源漏交叠电容的测试及校准结构 Mosfet gate and source-drain overlap capacitance of test and calibration structure
08/31/2011	CN201956345U GPP (glass passivation pellet) high-voltage diode
08/31/2011	CN201956344U 一种驱动裸片与贴片的兼容封装结构 A package structure compatible with the patch driver dies
08/31/2011	CN201956343U 表面金属化陶瓷基板 Metallized ceramic substrate surface
08/31/2011	CN201956342U 半导体封装用镀金导线架 The semiconductor package with gold-plated leadframe
08/31/2011	CN201956341U Lead framework structure of middle pin
08/31/2011	CN201956340U 易切断的引线框架结构 Easy to cut the lead frame
08/31/2011	CN201956339U 三端稳压器框架镀层结构 Three-terminal regulator framework layer structure
08/31/2011	CN201956338U Bonding wire wound on bobbin
08/31/2011	CN201956337U 一种离子风散热装置 An ionic air cooling device
08/31/2011	CN201955619U 半导体制造中光刻套刻图形的版图结构 Layout structure of semiconductor manufacturing lithography overlay graphics
08/31/2011	CN1933141B Contact structure having silicide layers, semiconductor device employing the same, and methods of fabricating the contact structure and semiconductor device
08/31/2011	CN102171925A Sealing member for piezoelectric oscillation device, and method for manufacturing the sealing member
08/31/2011	CN102171824A Electrostatic discharge (ESD) shielding for stacked ICs
08/31/2011	CN102171823A Analyte sensors, testing apparatus and manufacturing methods
08/31/2011	CN102171822A Anchor pin lead frame
08/31/2011	CN102171821A Waterproof structure for bonding pad, waterproof bonding pad and method for forming waterproof structure
08/31/2011	CN102171820A Lead frame and manufacturing method thereof
08/31/2011	CN102171819A Ceramic heat pipe with porous ceramic wick
08/31/2011	CN102171818A Heat radiation device of chip, electronic device and fixing method of radiator
08/31/2011	CN102171817A Power semiconductor device adaptive cooling assembly
08/31/2011	CN102171816A Wiring board, semiconductor device and method for manufacturing the same
08/31/2011	CN102171815A Semiconductor package and manufacturing method thereof
08/31/2011	CN102171814A Integrated circuit with double seal ring having gaps therein
08/31/2011	CN102170753A Circuit board pin structure
08/31/2011	CN102170220A Component connection structure of voltage source converter based on full-control device
08/31/2011	CN102170219A Power conversion apparatus
08/31/2011	CN102169898A Electronic device including a buried insulating layer and a vertical conductive structure extending therethrough and a process of forming the same
08/31/2011	CN102169879A Highly integrated wafer fan-out packaging structure
08/31/2011	CN102169877A Circuit module, electronic device including the same, and circuit module manufacturing method
08/31/2011	CN102169876A Resin-sealed electronic control device and method of fabricating the same
08/31/2011	CN102169875A Semiconductor device and producing method thereof
08/31/2011	CN102169874A Semiconductor integrated circuit
08/31/2011	CN102169873A Semiconductor packing structure applied to power switcher circuit

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