| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/07/2011 | CN101809177B Copper alloy plate material for electric and electronic components |
| 09/07/2011 | CN101777524B Chip packaging structure and conducting wire framework |
| 09/07/2011 | CN101771031B Photoelectric element-packaging structure with electrostatic protection function |
| 09/07/2011 | CN101752348B Electrostatic discharging protection device and protection method thereof |
| 09/07/2011 | CN101707204B Organic electroluminescent device and electronic device provided with same |
| 09/07/2011 | CN101690424B Electronic module and method for producing an electronic module |
| 09/07/2011 | CN101632174B Encapsulated metal resistor |
| 09/07/2011 | CN101615610B Organic light emitting diode display and method of manufacturing the same |
| 09/07/2011 | CN101604690B Semiconductor device having a power cutoff transistor |
| 09/07/2011 | CN101556941B Heat radiation structure of surface mounting high-power element |
| 09/07/2011 | CN101553918B Semiconductor structure and method of assembly |
| 09/07/2011 | CN101546760B Inverse parallel double diode |
| 09/07/2011 | CN101494219B High-power LED aluminum substrate integrated module |
| 09/07/2011 | CN101483166B Conductive wire rack with downset spoiler connecting structure and semi-conductor encapsulation construction |
| 09/07/2011 | CN101452922B Light emitting unit |
| 09/07/2011 | CN101431062B Carrier band substrate for smart card and semiconductor module for smart card |
| 09/07/2011 | CN101419960B Method for eliminating alternate word line bridging |
| 09/07/2011 | CN101346056B Method and system for cooling heat-generating devices |
| 09/07/2011 | CN101330080B High on-stage voltage right-handed LED integrated chip and manufacturing method thereof |
| 09/07/2011 | CN101329999B Semiconductor substrate and method for manufacturing the same |
| 09/07/2011 | CN101308812B Method of fabricating semiconductor device having self-aligned contact plug and related device |
| 09/07/2011 | CN101303498B Liquid crystal display device |
| 09/07/2011 | CN101266981B Semiconductor memory device |
| 09/07/2011 | CN101257002B Insulating film |
| 09/07/2011 | CN101211826B Semiconductor component and method of manufacture |
| 09/07/2011 | CN101155854B Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic compo |
| 09/07/2011 | CN101056900B Optical semiconductor sealing material |
| 09/06/2011 | US8015518 Structures for electrostatic discharge protection for bipolar semiconductor circuitry |
| 09/06/2011 | US8014150 Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling |
| 09/06/2011 | US8013947 Display device and manufacturing method of the same |
| 09/06/2011 | US8013526 Devices including, methods using, and compositions of reflowable getters |
| 09/06/2011 | US8013456 Molded beam for optoelectronic sensor chip substrate |
| 09/06/2011 | US8013455 Semiconductor device having pads |
| 09/06/2011 | US8013454 Wiring substrate and display device including the same |
| 09/06/2011 | US8013453 Leadless alignment of a semiconductor chip |
| 09/06/2011 | US8013452 Wire-bonded semiconductor component with reinforced inner connection metallization |
| 09/06/2011 | US8013451 Interconnect structure to reduce stress induced voiding effect |
| 09/06/2011 | US8013450 Semiconductor component with terminal contact surface |
| 09/06/2011 | US8013449 Post passivation interconnection schemes on top of the IC chips |
| 09/06/2011 | US8013448 Multiple selectable function integrated circuit module |
| 09/06/2011 | US8013446 Nitrogen-containing metal cap for interconnect structures |
| 09/06/2011 | US8013445 Low resistance high reliability contact via and metal line structure for semiconductor device |
| 09/06/2011 | US8013444 Solder joints with enhanced electromigration resistance |
| 09/06/2011 | US8013443 Electronic carrier board and package structure thereof |
| 09/06/2011 | US8013442 Semiconductor device and manufacturing method thereof |
| 09/06/2011 | US8013441 Power semiconductor device in lead frame employing connecting element with conductive film |
| 09/06/2011 | US8013440 Enhanced thermal dissipation ball grid array package |
| 09/06/2011 | US8013439 Injection molded metal stiffener for packaging applications |
| 09/06/2011 | US8013438 Semiconductor package with a stiffening member supporting a thermal heat spreader |
| 09/06/2011 | US8013437 Package with heat transfer |
| 09/06/2011 | US8013436 Heat dissipation package structure and method for fabricating the same |
| 09/06/2011 | US8013435 Semiconductor module |
| 09/06/2011 | US8013433 Virtual wire assembly having hermetic feedthroughs |
| 09/06/2011 | US8013432 Package substrate, semiconductor package having the package substrate |
| 09/06/2011 | US8013430 Semiconductor device including DC-DC converter |
| 09/06/2011 | US8013429 Air cavity package with copper heat sink and ceramic window frame |
| 09/06/2011 | US8013428 Whisker-free lead frames |
| 09/06/2011 | US8013427 Wiring board and electrical signal transmission system |
| 09/06/2011 | US8013425 Scribe line structure for wafer dicing and method of making the same |
| 09/06/2011 | US8013423 Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device |
| 09/06/2011 | US8013422 Fuse corner pad for an integrated circuit |
| 09/06/2011 | US8013421 Semiconductor device |
| 09/06/2011 | US8013420 Electrical fuse device |
| 09/06/2011 | US8013419 Structure and method to form dual silicide e-fuse |
| 09/06/2011 | US8013397 Embedded stressed nitride liners for CMOS performance improvement |
| 09/06/2011 | US8013394 Integrated circuit having resistor between BEOL interconnect and FEOL structure and related method |
| 09/06/2011 | US8013393 Electrostatic discharge protection devices |
| 09/06/2011 | US8013391 Power semiconductor devices with trenched shielded split gate transistor and methods of manufacture |
| 09/06/2011 | US8013387 Power semiconductor devices with shield and gate contacts and methods of manufacture |
| 09/06/2011 | US8013371 Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with DCS (SiH2Cl2) interface seeding layer |
| 09/06/2011 | US8013364 Semiconductor devices and structures thereof |
| 09/06/2011 | US8013362 Semiconductor integrated circuit and multi-chip module |
| 09/06/2011 | US8013334 Bonding structure of circuit substrate for instant circuit inspecting |
| 09/06/2011 | US8013333 Semiconductor test pad structures |
| 09/06/2011 | US8013256 Printed wiring board |
| 09/06/2011 | US8013056 White heat-curable silicone resin composition, optoelectronic part case, and molding method |
| 09/06/2011 | US8012871 Semiconductor device and manufacturing method thereof |
| 09/06/2011 | US8012869 Bonded structure and bonding method |
| 09/06/2011 | US8012807 Method for producing chip packages, and chip package produced in this way |
| 09/06/2011 | US8012798 Method of fabricating stacked semiconductor chips |
| 09/06/2011 | US8012783 Semiconductor element and method for manufacturing same |
| 09/06/2011 | US8012586 Diamond like carbon coating of substrate housings |
| 09/06/2011 | US8011933 Substrate connecting connector and semiconductor device socket, cable connector, and board-to-board connector having substrate connecting connector |
| 09/06/2011 | US8011799 Thermal management of LED-based lighting systems |
| 09/06/2011 | US8011589 Wireless IC device and manufacturing method thereof |
| 09/06/2011 | US8011416 Apparatus, mold, and method for manufacturing metal-ceramic composite member |
| 09/02/2011 | DE202011000722U1 Dreifarben-LED-Modulstruktur Three-color LED module structure |
| 09/02/2011 | DE202011000677U1 Bodenloser Block-Kühlkörper Bottomless block heatsink |
| 09/01/2011 | WO2011106349A1 Semiconductor device with vias having more than one material |
| 09/01/2011 | WO2011105961A1 Method of stacking chips |
| 09/01/2011 | WO2011105800A2 Heat sink including a heat-dissipation fin capable of vibrating |
| 09/01/2011 | WO2011105598A1 Copper column and process for producing same |
| 09/01/2011 | WO2011105432A1 Electronic device |
| 09/01/2011 | WO2011105409A1 Mounting board and mounting structure thereof |
| 09/01/2011 | WO2011105364A1 Heat sink |
| 09/01/2011 | WO2011105282A1 Method for forming conductor traces and method for manufacturing semiconductor substrates |
| 09/01/2011 | WO2011105242A1 Semiconductor device and method for manufacturing same |
| 09/01/2011 | WO2011105192A1 Resin composition for sealing an optical semiconductor and optical semiconductor device using said resin composition |
| 09/01/2011 | WO2011105119A1 Plating bath, plating method, plated film and heat sink |
| 09/01/2011 | WO2011105056A1 Electronic device and method for manufacturing electronic device |