| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/08/2011 | US20110215478 Semiconductor element-embedded wiring substrate |
| 09/08/2011 | US20110215477 Integrated circuits including air gaps around interconnect structures, and fabrication methods thereof |
| 09/08/2011 | US20110215476 Method for fabricating circuit component |
| 09/08/2011 | US20110215475 Multi-surface ic packaging structures |
| 09/08/2011 | US20110215474 Integrated circuit structure and method for manufacturing the same |
| 09/08/2011 | US20110215473 Semiconductor device and method for manufacturing same |
| 09/08/2011 | US20110215472 Through Silicon via Bridge Interconnect |
| 09/08/2011 | US20110215470 Dummy Wafers in 3DIC Package Assemblies |
| 09/08/2011 | US20110215469 Method for forming a double embossing structure |
| 09/08/2011 | US20110215468 Bump-on-Lead Flip Chip Interconnection |
| 09/08/2011 | US20110215467 Metal post chip connecting device and method free to use soldering material |
| 09/08/2011 | US20110215466 Flip chip package maintaining alignment during soldering |
| 09/08/2011 | US20110215465 Multi-chip integrated circuit |
| 09/08/2011 | US20110215463 Compressive ring structure for flip chip packaging |
| 09/08/2011 | US20110215462 Semiconductor device and manufacturing method thereof |
| 09/08/2011 | US20110215461 Method for manufacturing a semiconductor device and a semiconductor device |
| 09/08/2011 | US20110215460 Stacked semiconductor chips |
| 09/08/2011 | US20110215459 Interconnect and test assembly including an interconnect |
| 09/08/2011 | US20110215458 Semiconductor Device and Method of Forming Package-on-Package Structure Electrically Interconnected Through TSV in WLCSP |
| 09/08/2011 | US20110215457 Dummy TSV to Improve Process Uniformity and Heat Dissipation |
| 09/08/2011 | US20110215456 Thin package system with external terminals and method of manufacture thereof |
| 09/08/2011 | US20110215455 Semiconductor device capable of switching operation mode and operation mode setting method therefor |
| 09/08/2011 | US20110215454 Col package having small chip hidden between leads |
| 09/08/2011 | US20110215452 Semiconductor package, substrate, electronic component, and method of mounting semiconductor package |
| 09/08/2011 | US20110215450 Integrated circuit packaging system with encapsulation and method of manufacture thereof |
| 09/08/2011 | US20110215449 Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead Package |
| 09/08/2011 | US20110215448 Integrated circuit package system with package stacking and method of manufacture thereof |
| 09/08/2011 | US20110215447 Semiconductor chip with seal ring and sacrificial corner pattern |
| 09/08/2011 | US20110215446 Chip package and method for fabricating the same |
| 09/08/2011 | US20110215444 Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages |
| 09/08/2011 | US20110215443 Multichip semiconductor device, chip therefor and method of formation thereof |
| 09/08/2011 | US20110215442 Alignment of wafers for 3d integration |
| 09/08/2011 | US20110215438 Stacked Semiconductor Package Having Discrete Components |
| 09/08/2011 | US20110215429 Manufacturing method of electronic device package, electronic device package, and oscillator |
| 09/08/2011 | US20110215410 I/O and Power ESD Protection Circuits By Enhancing Substrate-Bias in Deep-Submicron CMOS Process |
| 09/08/2011 | US20110215404 Method and Apparatus of Forming ESD Protection Device |
| 09/08/2011 | US20110215392 Semiconductor Devices and Methods of Manufacturing the Same |
| 09/08/2011 | US20110215391 Semiconductor device and method of manufacturing the same |
| 09/08/2011 | US20110215368 Light-emitting diode with wire-piercing lead frame |
| 09/08/2011 | US20110215343 Semiconductor device and optical pickup device |
| 09/08/2011 | US20110215321 Polysilicon resistor and e-fuse for integration with metal gate and high-k dielectric |
| 09/08/2011 | US20110215213 Device for Supporting Photovoltaic Cell Panels, Support System and Installed Assembly |
| 09/08/2011 | DE112007000381B4 Quasi-radiale Wärmesenke mit rechteckigem Formfaktor und einheitlicher Rippenlänge, Verfahren zu deren Herstellung und System mit einer solchen Quasi-radial heat sink having a rectangular form factor and uniform fin length, to processes for their preparation and system with such a |
| 09/08/2011 | DE112006003664B4 Herstellung eines QFN-Gehäuses für eine integrierte Schaltung und damit hergestelltes QFN-Gehäuse und Verwendung eines Leiterrahmens dabei Manufacturing a QFN package for an integrated circuit and thus made QFN package and use of a lead frame thereby |
| 09/08/2011 | DE102011012405A1 Vorrichtung und Verfahren für Schutz vor elektrostatischer Entladung Apparatus and method for protecting against electrostatic discharge |
| 09/07/2011 | EP2363883A1 Connecting pad producing method |
| 09/07/2011 | EP2363882A1 Heat-dissipating device for supplying cold airflow |
| 09/07/2011 | EP2363881A1 Heat-Dissipating Device for Supplying Cold Airflow |
| 09/07/2011 | CN201966440U 电连接器组件 The electrical connector assembly |
| 09/07/2011 | CN201966352U 电连接器组件 The electrical connector assembly |
| 09/07/2011 | CN201966207U 18排整体式引线框架 18 rows of monolithic leadframe |
| 09/07/2011 | CN201966206U 20排引线框架 20 row leadframe |
| 09/07/2011 | CN201966205U 鳍片与散热基座的成形结构 Forming the base of the structure and cooling fins |
| 09/07/2011 | CN201966204U 一种大功率半导体器件散热装置 A semiconductor device heat sink power |
| 09/07/2011 | CN201966203U 一种扣合式鳍片组 One kind of buckled fin group |
| 09/07/2011 | CN201966202U 一种变流器中igbt模块的散热装置 A cooling device in the converter becomes igbt module |
| 09/07/2011 | CN201966201U 一种高功率器件的冷却装置 A cooling device of high power devices |
| 09/07/2011 | CN201966200U 一种折叠式高散热体 A folding high heat sink |
| 09/07/2011 | CN201966199U 一种羽型高散热结构 One kind of feather-type high heat dissipation structure |
| 09/07/2011 | CN201966198U 支架型散热体复合结构 Stent-heat composite structure |
| 09/07/2011 | CN201966197U Packaging structure of semiconductor chip |
| 09/07/2011 | CN1823561B Packaging of semiconductor devices for incrased reliability |
| 09/07/2011 | CN102177582A Circuit for the parallel supplying of power during testing of a plurality of electronic devices integrated on a semiconductor wafer |
| 09/07/2011 | CN102177581A Leadframe for electronic components |
| 09/07/2011 | CN102177580A Flip chip semiconductor package with encapsulant retaining structure and strip |
| 09/07/2011 | CN102177579A Semiconductor device and method for manufacturing same |
| 09/07/2011 | CN102177575A Enhanced reliability for semiconductor devices using dielectric encasement |
| 09/07/2011 | CN102177273A Sputtering target for forming wiring film of flat panel display |
| 09/07/2011 | CN102176808A Laminated body, method of manufacturing susbtrate, substrate, and semiconductor device |
| 09/07/2011 | CN102176454A Semiconductor device |
| 09/07/2011 | CN102176452A High-density chip system-in-package structure |
| 09/07/2011 | CN102176450A High-density system in package (SIP) structure |
| 09/07/2011 | CN102176449A High-density system-in-package structure |
| 09/07/2011 | CN102176448A Fan-out system-in-package structure |
| 09/07/2011 | CN102176447A Three-dimensional high-density system in package (SIP) structure |
| 09/07/2011 | CN102176446A Three-dimensional high-integration level system-in-package structure |
| 09/07/2011 | CN102176445A Fan-out high-density packaging structure |
| 09/07/2011 | CN102176444A High integration level system in package (SIP) structure |
| 09/07/2011 | CN102176443A Structure and method for testing breakdown reliability of oxide layer |
| 09/07/2011 | CN102176442A Test structure and method for measuring HCI (hot carrier injection) reliability of MOS (metal oxide semiconductor) device |
| 09/07/2011 | CN102176441A Improved addressable test chip for physical failure analysis and manufacturing method thereof |
| 09/07/2011 | CN102176440A Improved addressable test chip arranged in scribing slot and manufacturing method thereof |
| 09/07/2011 | CN102176439A Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same |
| 09/07/2011 | CN102176438A Double-side packaging structure and wireless communication system applying the structure |
| 09/07/2011 | CN102176437A 半导体器件 Semiconductor devices |
| 09/07/2011 | CN102176436A Process for preparing high-performance Diamond/SiC electronic packaging material |
| 09/07/2011 | CN102176435A Flexible type base plate structure and manufacturing method thereof |
| 09/07/2011 | CN102176434A Airtight ceramic layer structure and manufacturing method thereof |
| 09/07/2011 | CN102176433A Semiconductor device having low dielectric insulating film and manufacturing method of the same |
| 09/07/2011 | CN102176432A Photodetector with digital three-dimensional package assembly |
| 09/07/2011 | CN102176431A Semiconductor assembly and semiconductor packaging structure having the semiconductor assembly |
| 09/07/2011 | CN102176428A Strengthened base plate and manufacturing method thereof |
| 09/07/2011 | CN102176427A Method for manufacturing semiconductor device |
| 09/07/2011 | CN102176426A Method for manufacturing integrated circuit chip and integrated circuit structure |
| 09/07/2011 | CN102176238A Limiter and semiconductor device using the same |
| 09/07/2011 | CN102176237A Limiter, and semiconductor device using same |
| 09/07/2011 | CN102174299A Circuit-connecting material, and connection structure for circuit member |
| 09/07/2011 | CN102174155A Polyorganosiloxane composition |
| 09/07/2011 | CN101872755B Window type semiconductor encapsulation structure with jumper connecting structure and substrate thereof |
| 09/07/2011 | CN101814498B Structure with built-in NMOS auxiliary trigger controllable silicon |