| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/13/2011 | US8018719 Vapor chamber heat sink with cross member and protruding boss |
| 09/13/2011 | US8018078 Photo key and method of fabricating semiconductor device using the photo key |
| 09/13/2011 | US8018077 Electromechanical system having a controlled atmosphere, and method of fabricating same |
| 09/13/2011 | US8018076 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof |
| 09/13/2011 | US8018075 Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package |
| 09/13/2011 | US8018074 Components joining method and components joining structure |
| 09/13/2011 | US8018073 Electronic packages with fine particle wetting and non-wetting zones |
| 09/13/2011 | US8018072 Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate |
| 09/13/2011 | US8018071 Stacked structure using semiconductor devices and semiconductor device package including the same |
| 09/13/2011 | US8018070 Semiconductor device, method for manufacturing semiconductor devices and mask systems used in the manufacturing of semiconductor devices |
| 09/13/2011 | US8018069 Through-hole contacts in a semiconductor device |
| 09/13/2011 | US8018068 Semiconductor package including a top-surface metal layer for implementing circuit features |
| 09/13/2011 | US8018067 Electrically shielded through-wafer interconnect |
| 09/13/2011 | US8018066 Semiconductor device and method of manufacturing the same |
| 09/13/2011 | US8018065 Wafer-level integrated circuit package with top and bottom side electrical connections |
| 09/13/2011 | US8018064 Arrangement including a semiconductor device and a connecting element |
| 09/13/2011 | US8018063 Solder joint reliability in microelectronic packaging |
| 09/13/2011 | US8018062 Production of a self-aligned CuSiN barrier |
| 09/13/2011 | US8018059 Electrical interconnect with an electrical pathway including at least a first member overlain by a second member at a contact point |
| 09/13/2011 | US8018058 Semiconductor memory device |
| 09/13/2011 | US8018057 Semiconductor device with resin layers and wirings and method for manufacturing the same |
| 09/13/2011 | US8018056 Package for high power density devices |
| 09/13/2011 | US8018055 Semiconductor apparatus with decoupling capacitor |
| 09/13/2011 | US8018054 Semiconductor die package including multiple semiconductor dice |
| 09/13/2011 | US8018053 Heat transfer device |
| 09/13/2011 | US8018052 Integrated circuit package system with side substrate having a top layer |
| 09/13/2011 | US8018051 Thermally enhanced semiconductor package |
| 09/13/2011 | US8018050 Integrated circuit package with integrated heat sink |
| 09/13/2011 | US8018049 Silicon condenser microphone and manufacturing method |
| 09/13/2011 | US8018048 Semiconductor device |
| 09/13/2011 | US8018047 Power semiconductor module including a multilayer substrate |
| 09/13/2011 | US8018046 Printed wiring board with notched conductive traces |
| 09/13/2011 | US8018045 Printed circuit board |
| 09/13/2011 | US8018044 Semiconductor device, substrate for producing semiconductor device and method of producing them |
| 09/13/2011 | US8018043 Semiconductor package having side walls and method for manufacturing the same |
| 09/13/2011 | US8018042 Integrated circuit with flexible planar leads |
| 09/13/2011 | US8018041 Integrated circuit package system with offset stacked die |
| 09/13/2011 | US8018040 Shielded stacked integrated circuit packaging system and method of manufacture thereof |
| 09/13/2011 | US8018039 Integrated circuit package system with stacked devices |
| 09/13/2011 | US8018038 IC card with terminals for direct access to internal components |
| 09/13/2011 | US8018037 Semiconductor chip package |
| 09/13/2011 | US8018036 Ultra-thin quad flat no-lead (QFN) package |
| 09/13/2011 | US8018035 Semiconductor device and semiconductor integrated circuit |
| 09/13/2011 | US8018034 Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure |
| 09/13/2011 | US8018033 Semiconductor device and manufacturing method of the same |
| 09/13/2011 | US8018032 Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip |
| 09/13/2011 | US8018027 Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor |
| 09/13/2011 | US8018024 P-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse |
| 09/13/2011 | US8018023 Trench sidewall protection by a carbon-rich layer in a semiconductor device |
| 09/13/2011 | US8018022 Guard ring structures and method of fabricating thereof |
| 09/13/2011 | US8018002 Field effect resistor for ESD protection |
| 09/13/2011 | US8018001 Semiconductor device |
| 09/13/2011 | US8018000 Electrostatic discharge protection pattern for high voltage applications |
| 09/13/2011 | US8017999 Semiconductor device |
| 09/13/2011 | US8017943 Semiconductor device with reduced pad pitch |
| 09/13/2011 | US8017942 Semiconductor device and method |
| 09/13/2011 | US8017520 Method of fabricating a pad over active circuit I.C. with frame support structure |
| 09/13/2011 | US8017516 Method for stress free conductor removal |
| 09/13/2011 | US8017515 Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief |
| 09/13/2011 | US8017467 Semiconductor memory device including multi-layer gate structure |
| 09/13/2011 | US8017453 Method and apparatus for forming an integrated circuit electrode having a reduced contact area |
| 09/13/2011 | US8017450 Method of forming assymetrical encapsulant bead |
| 09/13/2011 | US8017449 Process for fabricating electronic components using liquid injection molding |
| 09/13/2011 | US8017448 Method for manufacturing semiconductor device |
| 09/13/2011 | US8017445 Warpage-compensating die paddle design for high thermal-mismatched package construction |
| 09/13/2011 | US8017444 Adhesive sheet, semiconductor device, and process for producing semiconductor device |
| 09/13/2011 | US8017443 Light transmissive cover, device provided with same and methods for manufacturing them |
| 09/13/2011 | US8017436 Thin substrate fabrication method and structure |
| 09/13/2011 | US8017435 Method for packaging electronic devices and integrated circuits |
| 09/13/2011 | US8017418 Semiconductor image sensor and method for fabricating the same |
| 09/13/2011 | US8017255 Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same |
| 09/13/2011 | US8017245 Composition for preparing organic insulator |
| 09/12/2011 | DE202011101737U1 Flachwärmerohr Flat heat pipe |
| 09/09/2011 | WO2011109648A1 Through-package-via (tpv) structures on inorganic interposer and methods for fabricating same |
| 09/09/2011 | WO2011109310A2 Thermal vias in an integrated circuit package with an embedded die |
| 09/09/2011 | WO2011109121A1 Method of making a coated article, coating including an alloyed carbon nanotube thin film |
| 09/09/2011 | WO2011109044A1 Multi-chip integrated circuit |
| 09/09/2011 | WO2011108715A1 Electronic component package sealing member, electronic component package, and method for fabricating electronic component package sealing member |
| 09/09/2011 | WO2011108664A1 Optical semiconductor device |
| 09/09/2011 | WO2011108588A1 Curable resin composition and cured article thereof |
| 09/09/2011 | WO2011108456A1 Inter-low-permittivity layer insulating film, and method for forming inter-low-permittivity layer insulating film |
| 09/09/2011 | WO2011108308A1 Wiring board with built-in semiconductor element |
| 09/09/2011 | WO2011108280A1 Method for producing semiconductor device |
| 09/09/2011 | WO2011108178A1 Semiconductor device |
| 09/09/2011 | WO2011108051A1 Semiconductor device |
| 09/09/2011 | WO2011108050A1 Thin film transistor substrate and process for production thereof |
| 09/09/2011 | WO2011107832A1 Manufacturing of a semiconductor device and corresponding semiconductor device |
| 09/09/2011 | WO2011107612A1 Customizable interconnections between electronic circuits |
| 09/09/2011 | WO2011107044A2 Waterproof structure for bonding pad, waterproof bonding pad and method for forming waterproof structure |
| 09/09/2011 | WO2011088384A3 Solder pillars in flip chip assembly and manufacturing method thereof |
| 09/09/2011 | WO2011084235A3 Glass core substrate for integrated circuit devices and methods of making the same |
| 09/09/2011 | WO2011084216A3 Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
| 09/09/2011 | WO2011059186A3 Soldering jig, surface array antenna and a production method therefor |
| 09/09/2011 | WO2011053981A3 Package configurations for low emi circuits |
| 09/08/2011 | US20110215484 Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like |
| 09/08/2011 | US20110215483 Flux-free chip to substrate joint serial linear thermal processor arrangement |
| 09/08/2011 | US20110215482 Semiconductor device |
| 09/08/2011 | US20110215481 Semiconductor device |
| 09/08/2011 | US20110215480 Stress resistant micro-via structure for flexible circuits |
| 09/08/2011 | US20110215479 Feature Patterning Methods and Structures Thereof |