Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2014
11/27/2014US20140349424 Lead frame for mounting led elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
11/27/2014US20140349105 Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
11/27/2014US20140347838 Electronic device and manufacturing method of electronic device
11/27/2014US20140347820 Systems and methods for cooling of power electronic devices
11/27/2014US20140347490 Vehicle, display device and manufacturing method for a semiconductor device
11/27/2014US20140346686 Methods for forming color images on memory devices and memory devices formed thereby
11/27/2014US20140346685 Silicon-based electronics with disabling feature
11/27/2014US20140346684 Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same
11/27/2014US20140346683 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
11/27/2014US20140346682 Semiconductor device
11/27/2014US20140346681 Electronic device
11/27/2014US20140346680 Forming of an electric connection of the via type
11/27/2014US20140346679 Package substrates with multiple dice
11/27/2014US20140346678 Parallel Signal Via Structure
11/27/2014US20140346677 Semiconductor device and method of manufacturing the same
11/27/2014US20140346676 Semiconductor device
11/27/2014US20140346675 Semiconductor Integrated Circuit and Fabricating the Same
11/27/2014US20140346674 Graphene-metal e-fuse
11/27/2014US20140346673 Methods and Apparatus for bump-on-trace Chip Packaging
11/27/2014US20140346672 Integrated Circuit Structure Having Dies with Connectors
11/27/2014US20140346671 Fan-Out Package Structure and Methods for Forming the Same
11/27/2014US20140346670 Semiconductor package with single sided substrate design and manufacturing methods thereof
11/27/2014US20140346669 Semiconductor package and method of manufacturing the same
11/27/2014US20140346668 Semiconductor device, method for manufacturing same, and electronic component
11/27/2014US20140346667 Semiconductor package and method of fabricating the same
11/27/2014US20140346666 Semiconductor device and manufacturing method thereof
11/27/2014US20140346665 Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination
11/27/2014US20140346664 Variable temperature solders for multi-chip module packaging and repackaging
11/27/2014US20140346663 Semiconductor structure with sacrificial anode and method for forming
11/27/2014US20140346660 Power electronics devices having thermal stress reduction elements
11/27/2014US20140346659 Semiconductor device and method for manufacturing semiconductor device
11/27/2014US20140346656 Multilevel Leadframe
11/27/2014US20140346655 Memory cell
11/27/2014US20140346654 Chip package
11/27/2014US20140346653 Electronic device
11/27/2014US20140346652 Buried digitline (bdl) access device and memory array
11/27/2014US20140346651 Charge damage protection on an interposer for a stacked die assembly
11/27/2014US20140346646 Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers
11/27/2014US20140346645 Through silicon via and process thereof
11/27/2014US20140346642 Surface mountable electronic component
11/27/2014US20140346637 Hybrid Semiconductor Package
11/27/2014US20140346636 Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
11/27/2014US20140346634 On-chip inductors with reduced area and resistance
11/27/2014US20140346623 Film-Covered Open-Cavity Sensor Package
11/27/2014US20140346579 Magnetic field sensor device
11/27/2014US20140346552 Three-Terminal Light Emitting Device (LED)
11/27/2014US20140346549 Phosphor sheet, light-emitting device having the phosphor sheet and method of manufacturing the same
11/27/2014US20140346522 Method and system for co-packaging vertical gallium nitride power devices
11/27/2014US20140346516 Semiconductor memory devices and semiconductor packages
11/27/2014US20140346513 Mixed-Sized Pillars That Are Probeable and Routable
11/27/2014US20140346512 Semiconductor integrated circuit device
11/27/2014US20140345931 Dual layered lead frame
11/27/2014US20140345915 High pin count, small son/qfn packages
11/27/2014US20140345117 Semiconductor device with thermal dissipation lead frame
11/25/2014US8897832 Semiconductor device and communication system including the same
11/25/2014US8897184 System and method for wireless communication in a backplane fabric architecture
11/25/2014US8897046 DC voltage conversion module, semiconductor module, and method of making semiconductor module
11/25/2014US8897028 Circuit module
11/25/2014US8897027 Bonding pad structure
11/25/2014US8897016 Heat removal in compact computing systems
11/25/2014US8897015 Base plate
11/25/2014US8897010 High performance liquid cooled heatsink for IGBT modules
11/25/2014US8896495 Method for direct connection of MMIC amplifiers to balanced antenna aperture
11/25/2014US8896380 High frequency amplifier
11/25/2014US8896335 Thermal controller for electronic devices
11/25/2014US8896138 Chip identification for organic laminate packaging and methods of manufacture
11/25/2014US8896137 Solid-state image pickup device and a method of manufacturing the same
11/25/2014US8896136 Alignment mark and method of formation
11/25/2014US8896135 Encapsulation film, package structure utilizing the same, and method for forming the package structure
11/25/2014US8896133 Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
11/25/2014US8896132 Electronic device and fabrication method thereof
11/25/2014US8896131 Cascode scheme for improved device switching behavior
11/25/2014US8896130 Multi-chip stack structure and method for fabricating the same
11/25/2014US8896129 Semiconductor device and manufacturing method for the same
11/25/2014US8896128 Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
11/25/2014US8896127 Via structure and via etching process of forming the same
11/25/2014US8896126 Packaging DRAM and SOC in an IC package
11/25/2014US8896125 Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
11/25/2014US8896124 Via network structures and method therefor
11/25/2014US8896123 Nonvolatile memory devices having a three dimensional structure
11/25/2014US8896121 Chip assembly system
11/25/2014US8896120 Structures and methods for air gap integration
11/25/2014US8896119 Bonding material for semiconductor devices
11/25/2014US8896118 Electronic assembly with copper pillar attach substrate
11/25/2014US8896117 Semiconductor device bonded by an anisotropic conductive film
11/25/2014US8896116 Microelectronic package and method of manufacturing same
11/25/2014US8896115 Semiconductor device and method of forming shielding layer around back surface and sides of semiconductor wafer containing IPD structure
11/25/2014US8896114 Semiconductor device
11/25/2014US8896113 Base plate and semiconductor device
11/25/2014US8896112 Multi-chip module with self-populating positive features
11/25/2014US8896111 Semiconductor device and method for manufacturing the same
11/25/2014US8896110 Paste thermal interface materials
11/25/2014US8896109 Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
11/25/2014US8896108 Semiconductor device with parasitic bipolar transistor
11/25/2014US8896107 High power semiconductor package with conductive clip
11/25/2014US8896105 Microelectronic devices and methods for manufacturing microelectronic devices
11/25/2014US8896104 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
11/25/2014US8896102 Die edge sealing structures and related fabrication methods
11/25/2014US8896095 Semiconductor device with circuits connected to each other in contactless manner
11/25/2014US8896093 Circuit configuration and manufacturing processes for vertical transient voltage suppressor (TVS) and EMI filter
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