| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/15/2011 | DE10305411B4 Mikroelektromechanische Vorrichtung und Verfahren zu deren Herstellung Micro-electromechanical device and process for their preparation |
| 09/15/2011 | DE10297300B4 Mehrere Halbleiterbauteile in einem monolithischen Flip-Chip A plurality of semiconductor devices in a monolithic flip-chip |
| 09/15/2011 | DE102011005363A1 Integrierte Schaltungsanordnung mit einem Defektsensor Integrated circuit with sensor failures |
| 09/15/2011 | DE102011002535A1 Halbleitervorrichtung Semiconductor device |
| 09/15/2011 | DE102006014582B4 Halbleitermodul Semiconductor module |
| 09/15/2011 | DE102006008292B4 Überlastschutz für steuerbare Stromverbraucher Overload protection for controllable current consumer |
| 09/14/2011 | EP2365742A1 Electrode portion structure |
| 09/14/2011 | EP2365524A2 Post passivation interconnection schemes on top of the IC chips |
| 09/14/2011 | EP2365523A2 Stress Resistant Micro-Via Structure for Flexible Circuits |
| 09/14/2011 | EP2365522A1 Electrically isolated power device package |
| 09/14/2011 | EP2365519A1 Semiconductor Die Package |
| 09/14/2011 | EP2365020A1 Resin Composition for Electronic Component Encapsulation and Electronic Component Device |
| 09/14/2011 | EP2364581A1 Rectifier module with cooled busbar |
| 09/14/2011 | EP2364580A1 Rectifier module with cooled busbar |
| 09/14/2011 | EP1538666B1 Semiconductor integrated circuit device |
| 09/14/2011 | EP1276799B1 Flame retardant epoxy molding compositions |
| 09/14/2011 | CN201976388U 一种功率放大器的新型铜散热器结构 New copper radiator structure for a power amplifier |
| 09/14/2011 | CN201976023U 高压大功率三相整流全桥装置 High power three-phase full-bridge rectifier device |
| 09/14/2011 | CN201975395U 一种高效半导体二极管 An efficient semiconductor diode |
| 09/14/2011 | CN201975393U 一拖二荧光灯电子镇流器用开关晶体管 One with two fluorescent electronic ballast switching transistors |
| 09/14/2011 | CN201975389U Fixing device for high power thyristor valve string |
| 09/14/2011 | CN201975388U Anti-oxidation copper-based bonding wire |
| 09/14/2011 | CN201975387U Small-body high voltage semiconductor rectifier |
| 09/14/2011 | CN201975386U 一种热管鳍片式焊接散热片 A heat pipe welding heat sink fins |
| 09/14/2011 | CN201975385U 散热模块 Thermal Module |
| 09/14/2011 | CN201975384U 防凝露半导体制冷cpu控温器 Anti-condensation semiconductor cooling cpu temperature control |
| 09/14/2011 | CN201975383U 复合散热板 Composite heat sink plate |
| 09/14/2011 | CN201975382U 一种散热器 Radiator |
| 09/14/2011 | CN201975381U 散热模块结构 Cooling module structure |
| 09/14/2011 | CN201974743U 一种电脑散热器的散热片 One kind of computer radiator fins |
| 09/14/2011 | CN1983571B Polycrystalline silicon layer, flat panel display using the polyscrystalline silicon layer and method for fabricating the same |
| 09/14/2011 | CN1959954B Film pattern forming method, device, electro-optical apparatus, and electronic appliance |
| 09/14/2011 | CN1957466B Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips |
| 09/14/2011 | CN1941339B Semiconductor IC-embedded substrate and method for manufacturing same |
| 09/14/2011 | CN1767921B Phase change lead-free super plastic solders and welding method therefor |
| 09/14/2011 | CN102187751A Composite material and electronic equipment |
| 09/14/2011 | CN102187570A Integrated circuit with parallel sets of transistor amplifiers having different turn on power levels |
| 09/14/2011 | CN102187468A Optical semiconductor device, optical pickup device using same, and electronic apparatus |
| 09/14/2011 | CN102187457A Cooling arrangement |
| 09/14/2011 | CN102187456A Semiconductor device cooling structure and power converter provided with the cooling structure |
| 09/14/2011 | CN102187452A Semiconductor substrates with unitary vias and via terminals, and associated systems and methods |
| 09/14/2011 | CN102187277A Positive photosensitive resin composition for spray coating and method for producing through electrode using same |
| 09/14/2011 | CN102187149A A system for heat conduction between two connectable members |
| 09/14/2011 | CN102186937A Bonding method, bonded structure, method for producing optical module, and optical module |
| 09/14/2011 | CN102186907A Method for producing silicone moulded bodies from light-curable silicone mixtures |
| 09/14/2011 | CN102185474A Dc-dc converter |
| 09/14/2011 | CN102185411A Brush yoke assembly of voltage regulator |
| 09/14/2011 | CN102185093A Active cool type radiating substrate using air convection |
| 09/14/2011 | CN102184928A 显示元件及其制造方法 Element and manufacturing method thereof |
| 09/14/2011 | CN102184927A Device having a contact between semiconductor regions through a buried insulating layer, and process for fabricating said device |
| 09/14/2011 | CN102184922A Monolithic output stage with vertical high-side PMOS and vertical low-side NMOS interconnected using buried metal, structure and method |
| 09/14/2011 | CN102184917A Global system for mobile communications (GSM) radio-frequency emission front-end module adopting Quad Flat No-lead package |
| 09/14/2011 | CN102184913A Anti-static device |
| 09/14/2011 | CN102184912A Lamination contact structure and preparation method of metallic copper and nickel-silicon compound |
| 09/14/2011 | CN102184911A Miller parasitic capacitance shielding structure of high-power and high-frequency device |
| 09/14/2011 | CN102184910A Non-fully-convex dioctahedral transformer Balun |
| 09/14/2011 | CN102184909A Pin structure for connecting chips |
| 09/14/2011 | CN102184908A Advanced square flat pin-free encapsulating structure and manufacturing method thereof |
| 09/14/2011 | CN102184907A To3p waterproof sealing lead frame |
| 09/14/2011 | CN102184906A Packaging substrate with well structure filled with insulator and manufacturing method thereof |
| 09/14/2011 | CN102184905A Micro-interconnection welding spot structure of single intermetallic compounds |
| 09/14/2011 | CN102184904A Bonding disc structure aiming at BOAC frame and integrated circuit device structure |
| 09/14/2011 | CN102184903A Encapsulated semiconductor chip and manufacturing method of through holes thereof |
| 09/14/2011 | CN102184902A Porous alloy heat pipe radiator with gradient composite structure |
| 09/14/2011 | CN102184901A Preparation method of porous core with gradient composite structure |
| 09/14/2011 | CN102184900A Radiating fin |
| 09/14/2011 | CN102184899A Two-point form clamping device for high-power thyristor |
| 09/14/2011 | CN102184890A Metal interconnecting structure forming method and metal interconnecting structure |
| 09/14/2011 | CN102184873A Method for preparing diamond-silicon carbide electronic packaging material fast |
| 09/14/2011 | CN102184844A Voltage protecting ring of channel metal-oxide-semiconductor field effect transistor (MOSFET)-based diode and manufacturing method thereof |
| 09/14/2011 | CN102184843A Chip cutting protection ring of diode based on groove MOSFET (metal-oxide-semiconductor field effect transistor) and manufacturing method thereof |
| 09/14/2011 | CN102181168A Polymer matrix composite material and production method of polymer matrix composite material |
| 09/14/2011 | CN102181129A Epoxy resin composition for semiconductor encapsulation |
| 09/14/2011 | CN102181026A Production method for electronic-grade phenolic resin |
| 09/14/2011 | CN102179974A Fixed high-strength glass fiber epoxy wrapping belt used for thyristor valve string |
| 09/14/2011 | CN101794767B Mechanical press mounting structure of group large-power flat-plate power electronic device |
| 09/14/2011 | CN101764118B Base plate for packaging and semiconductor packaging structure |
| 09/14/2011 | CN101764115B Conducting structure for semiconductor integrated circuit and forming method thereof |
| 09/14/2011 | CN101699622B Packaging structure and packaging method of semiconductor device |
| 09/14/2011 | CN101689516B Method for manufacturing the semiconductor element mounting structure and pressurizing tool |
| 09/14/2011 | CN101646329B Method and structure for levelly combining evaporation ends of parallel heat pipes with fixing base |
| 09/14/2011 | CN101609802B Preparation method of low thermal resistance thermal interface |
| 09/14/2011 | CN101604669B Semiconductor device and manufacturing method of the semiconductor device |
| 09/14/2011 | CN101584259B Multilayer body, method for producing substrate, substrate and semiconductor device |
| 09/14/2011 | CN101546907B Electrostatic protection circuit and active-element array substrate |
| 09/14/2011 | CN101546740B Embedded printed circuit board and manufacturing method thereof |
| 09/14/2011 | CN101488482B Semi-conductor package structure and manufacturing method thereof |
| 09/14/2011 | CN101432869B Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device |
| 09/14/2011 | CN101425525B Semiconductor device and method of manufacturing the same |
| 09/14/2011 | CN101361182B Interposer with built-in passive part |
| 09/14/2011 | CN101355013B Process for fabricating a structure for epitaxy without an exclusion zone |
| 09/14/2011 | CN101339935B Connection structure between printed circuit board and electronic component |
| 09/14/2011 | CN101268120B Member for semiconductor light-emitting device, method of manufacturing the same, and semiconductor light-emitting device using the same |
| 09/14/2011 | CN101253627B Circuit device and method for manufacturing same |
| 09/14/2011 | CN101211906B Packaged chip structure |
| 09/14/2011 | CN101115376B Electronic apparatus |
| 09/13/2011 | US8020133 Semiconductor integrated circuit with multi-cut via and automated layout method for the same |
| 09/13/2011 | US8018739 Apparatus for shielding integrated circuit devices |
| 09/13/2011 | US8018723 Heat dissipation for electronic modules |
| 09/13/2011 | US8018720 Condenser structures with fin cavities facilitating vapor condensation cooling of coolant |