| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/20/2011 | US8022515 Semiconductor device |
| 09/20/2011 | US8022514 Integrated circuit package system with leadfinger support |
| 09/20/2011 | US8022513 Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same |
| 09/20/2011 | US8022512 No lead package with heat spreader |
| 09/20/2011 | US8022511 Semiconductor device packages with electromagnetic interference shielding |
| 09/20/2011 | US8022509 Crack stopping structure and method for fabricating the same |
| 09/20/2011 | US8022508 Semiconductor wafer |
| 09/20/2011 | US8022505 Semiconductor device structure and integrated circuit therefor |
| 09/20/2011 | US8022503 Anti-fusse structure and method of fabricating the same |
| 09/20/2011 | US8022501 Semiconductor device and method for isolating the same |
| 09/20/2011 | US8022497 Semiconductor device comprising insulating film |
| 09/20/2011 | US8022482 Device configuration of asymmetrical DMOSFET with schottky barrier source |
| 09/20/2011 | US8022443 Memory and interconnect design in fine pitch |
| 09/20/2011 | US8022442 Semiconductor device having STI with nitride liner and UV light shielding film |
| 09/20/2011 | US8022403 Semiconductor apparatus including photodiode unit and method of inspection of the same |
| 09/20/2011 | US8022402 Active device array substrate |
| 09/20/2011 | US8022151 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof |
| 09/20/2011 | US8021976 Method of wire bonding over active area of a semiconductor circuit |
| 09/20/2011 | US8021925 Thermal paste containment for semiconductor modules |
| 09/20/2011 | US8021924 Encapsulant cavity integrated circuit package system and method of fabrication thereof |
| 09/20/2011 | US8021921 Method of joining chips utilizing copper pillar |
| 09/20/2011 | US8021920 Method for producing a metal-ceramic substrate for electric circuits on modules |
| 09/20/2011 | US8021918 Integrated circuit chips with fine-line metal and over-passivation metal |
| 09/20/2011 | US8021897 Methods of fabricating a cross point memory array |
| 09/20/2011 | CA2325799C Heat sink and method of fabricating same |
| 09/15/2011 | WO2011112818A1 Processing to reduce wafer level warpage on moulding |
| 09/15/2011 | WO2011112728A2 Package having spaced apart heat sink |
| 09/15/2011 | WO2011111989A2 Metal-bonded ceramic substrate |
| 09/15/2011 | WO2011111716A1 Heat insulation/heat dissipation sheet and intra-device structure |
| 09/15/2011 | WO2011111673A1 Curable composition, hardened material, and method for using curable composition |
| 09/15/2011 | WO2011111667A1 Curable composition, hardened material, and method for using curable composition |
| 09/15/2011 | WO2011111593A1 Magnetic device |
| 09/15/2011 | WO2011111541A1 Mems sensor |
| 09/15/2011 | WO2011111524A1 Substrate wiring method and semiconductor manufacturing device |
| 09/15/2011 | WO2011111361A1 Nonvolatile memory element and method for manufacturing same |
| 09/15/2011 | WO2011111328A1 Semiconductor laser apparatus |
| 09/15/2011 | WO2011111318A1 Module |
| 09/15/2011 | WO2011111308A1 Process for production of semiconductor device, and semiconductor device |
| 09/15/2011 | WO2011111300A1 Semiconductor package having electrode on side surface, and semiconductor device |
| 09/15/2011 | WO2011111295A1 Electronic apparatus |
| 09/15/2011 | WO2011111133A1 Semiconductor apparatus and manufacturing method of the same |
| 09/15/2011 | WO2011111126A1 Semiconductor device and method for manufacturing same |
| 09/15/2011 | WO2011111112A1 Heat dissipating structure and production method therefor |
| 09/15/2011 | WO2011110900A1 Stack of molded integrated circuit dies with side surface contact tracks |
| 09/15/2011 | WO2011110781A1 Electronic device having a chip and method for manufacturing by coils |
| 09/15/2011 | WO2011110390A1 Liquid dimm cooling device |
| 09/15/2011 | WO2011082778A3 Method for producing a component that is embedded in an insulating material and comprises bumps and conductor tracks that overlap said bumps and corresponding device |
| 09/15/2011 | WO2011056668A3 Selective die electrical insulation additive process |
| 09/15/2011 | WO2010125639A9 Power semiconductor device |
| 09/15/2011 | US20110223755 Method for removing oxides |
| 09/15/2011 | US20110223420 Adhesive composition and sheet for forming semiconductor wafer-protective film |
| 09/15/2011 | US20110222328 Distributed semiconductor device methods, apparatus, and systems |
| 09/15/2011 | US20110221466 Semiconductor device and method of testing semiconductor device |
| 09/15/2011 | US20110221077 Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the same |
| 09/15/2011 | US20110221076 Semiconductor device |
| 09/15/2011 | US20110221075 Method of manufacturing electronic device and electronic device |
| 09/15/2011 | US20110221074 Board on chip package |
| 09/15/2011 | US20110221073 Layered chip package with wiring on the side surfaces |
| 09/15/2011 | US20110221072 Integrated circuit packaging system with via and method of manufacture thereof |
| 09/15/2011 | US20110221071 Electronic device and manufacturing method of electronic device |
| 09/15/2011 | US20110221070 Chip package and method for forming the same |
| 09/15/2011 | US20110221069 Semiconductor device and method of manufacturing the same |
| 09/15/2011 | US20110221068 Interconnect structure comprising blind vias intended to be metalized |
| 09/15/2011 | US20110221067 Semiconductor integrated circuit device |
| 09/15/2011 | US20110221066 Method for manufacturing a semiconductor device and a semiconductor device |
| 09/15/2011 | US20110221065 Methods of forming semiconductor chip underfill anchors |
| 09/15/2011 | US20110221064 Electromigration resistant aluminum-based metal interconnect structure |
| 09/15/2011 | US20110221063 Manufacturing Method of Semiconductor Device |
| 09/15/2011 | US20110221062 Methods for fabrication of an air gap-containing interconnect structure |
| 09/15/2011 | US20110221061 Anode for an organic electronic device |
| 09/15/2011 | US20110221060 Process for Fabricating Electronic Components Using Liquid Injection Molding |
| 09/15/2011 | US20110221059 Quad flat non-leaded semiconductor package and method of fabricating the same |
| 09/15/2011 | US20110221058 Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces |
| 09/15/2011 | US20110221057 Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation |
| 09/15/2011 | US20110221056 Electrode structure and microdevice package provided therewith |
| 09/15/2011 | US20110221055 Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die |
| 09/15/2011 | US20110221054 Semiconductor Device and Method of Forming Conductive Vias Through Interconnect Structures and Encapsulant of WLCSP |
| 09/15/2011 | US20110221053 Pre-processing to reduce wafer level warpage |
| 09/15/2011 | US20110221052 Lead frame for semiconductor device and method of manufacturing of the same |
| 09/15/2011 | US20110221051 Leadframe based multi terminal ic package |
| 09/15/2011 | US20110221050 Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device |
| 09/15/2011 | US20110221049 Quad flat non-leaded semiconductor package and method for fabricating the same |
| 09/15/2011 | US20110221048 Package Having Spaced Apart Heat Sink |
| 09/15/2011 | US20110221047 Flip chip package structure with heat dissipation enhancement and its application |
| 09/15/2011 | US20110221046 Semiconductor assembly package having shielding layer and method therefor |
| 09/15/2011 | US20110221044 Tungsten barrier and seed for copper filled tsv |
| 09/15/2011 | US20110221043 Semiconductor device and manufacturing method therefor |
| 09/15/2011 | US20110221042 Semiconductor device and method of fabricating same |
| 09/15/2011 | US20110221041 Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die |
| 09/15/2011 | US20110221021 Solid state image pickup device and method of producing solid state image pickup device |
| 09/15/2011 | US20110221013 Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same |
| 09/15/2011 | US20110221010 Semiconductor device having improved reliability |
| 09/15/2011 | US20110221008 Semiconductor Packaging and Fabrication Method Using Connecting Plate for Internal Connection |
| 09/15/2011 | US20110221005 Integrated circuit package for semiconductior devices with improved electric resistance and inductance |
| 09/15/2011 | US20110220999 Semiconductor device and a method of manufacturing the same |
| 09/15/2011 | US20110220968 Device |
| 09/15/2011 | US20110220728 Protective film for electronic component, method for manufacturing the same, and use thereof |
| 09/15/2011 | US20110220596 Support system for solar panels |
| 09/15/2011 | US20110220406 Electrode portion structure |
| 09/15/2011 | US20110220330 Capacitive device and method for the electrostatic transport of dielectric and ferroelectric fuilds |