H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2011
09/21/2011	CN102194761A Manufacturing method of residue-free wafer
09/21/2011	CN102194760A Semiconductor structure and method for forming the same
09/21/2011	CN102194759A Semiconductor element package, ring structure and method for manufacturing the semiconductor element package
09/21/2011	CN102194740A Semiconductor device and method of forming the same
09/21/2011	CN102194739A Formation method of interconnect structures
09/21/2011	CN102194738A Method for making contact hole
09/21/2011	CN102194736A Making method of semiconductor device
09/21/2011	CN102194735A Method for forming through hole
09/21/2011	CN102194722A Organic electroluminescent display and detection method thereof
09/21/2011	CN102194720A Connecting pad producing method
09/21/2011	CN102194718A Semiconductor device and method of forming the same
09/21/2011	CN102194717A Semiconductor device and method of forming insulating layer around semiconductor die
09/21/2011	CN102194716A Method for manufacturing a semiconductor device and a semiconductor device
09/21/2011	CN102194712A Manufacturing method of electronic device package, electronic device package, and oscillator
09/21/2011	CN102194711A Semiconductor device and method of forming IPD in FO-WLCSP
09/21/2011	CN102194705A Embedded die with protective interposer
09/21/2011	CN102194703A Circuit substrate and manufacturing method thereof
09/21/2011	CN102194683A Electrode portion structure
09/21/2011	CN102193604A Heat-radiation circuit of CPU (Central Processing Unit)
09/21/2011	CN102192921A Semiconductor chip used for evaluation, evaluation system, and repairing method thereof
09/21/2011	CN102192136A Piezoelectric fan and cooling device
09/21/2011	CN102191467A Metal line, manufacturing method of thin film, TFT array panel, and method for manufacturing the same
09/21/2011	CN102191005A Adhesive composition and sheet for forming semiconductor wafer-protective film
09/21/2011	CN102191002A High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method
09/21/2011	CN102190885A Resin composition for electronic component encapsulation and electronic component device
09/21/2011	CN102190864A Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereof
09/21/2011	CN102190863A Epoxy resin composition
09/21/2011	CN101864532B Superconductive aluminum-based alloy for LED heat dissipation device
09/21/2011	CN101847617B Packaging substrate and chip packaging structure
09/21/2011	CN101826506B Packaging substrate and chip packaging construct
09/21/2011	CN101807517B Method for forming copper-interconnection MIM capacitor structure and formed structure thereof
09/21/2011	CN101740535B Open type ball grid array substrate and packaging structure thereof
09/21/2011	CN101728342B Control module structure of heat radiating fan
09/21/2011	CN101714551B Low leakage capacitors including portions in inter-layer dielectrics
09/21/2011	CN101685804B Semiconductor wafer with self-adhesive protective layers
09/21/2011	CN101666591B Radiating fin, radiating module and assembling method thereof
09/21/2011	CN101662894B Encapsulating base plate and encapsulating structure
09/21/2011	CN101630673B Esd protection structures on soi substrates
09/21/2011	CN101595562B Stacked packages
09/21/2011	CN101586796B Heat sink built in cavity cylindrical light emitting diode wick
09/21/2011	CN101567360B Electrical fuse structure and method
09/21/2011	CN101527299B Package Structure
09/21/2011	CN101519183B Mems packaging including integrated circuit dies
09/21/2011	CN101453158B Power module used for micro frequency transformer
09/21/2011	CN101425509B High heat radiation power type electrode rack for LED
09/21/2011	CN101278478B Piezoelectric vibrating device
09/21/2011	CN101212889B Heat radiator
09/21/2011	CN101211968B Manufacture method for thyristor for electro-static discharge
09/21/2011	CN101211895B Structure for supervising memory array unit interval and the method
09/21/2011	CN101197347B Interconnection and its forming method
09/21/2011	CN101144000B Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
09/21/2011	CN101090112B Electrostatic discharge device circuit layout
09/21/2011	CN101031195B A heat sink with a centrifugal fan
09/20/2011	US8024689 Semiconductor integrated circuit apparatus with low wiring resistance
09/20/2011	US8023280 Communication circuit for driving a plurality of devices
09/20/2011	US8023267 Avionics chassis
09/20/2011	US8022776 Origami cascaded topology for analog and mixed-signal applications
09/20/2011	US8022560 Overlay mark
09/20/2011	US8022559 Substrate for a display panel, and a display panel having the same
09/20/2011	US8022558 Semiconductor package with ribbon with metal layers
09/20/2011	US8022557 Near chip scale semiconductor packages
09/20/2011	US8022556 Electrical component having a reduced substrate area
09/20/2011	US8022554 Stacked die package for MEMS resonator system
09/20/2011	US8022553 Mounting substrate and manufacturing method thereof
09/20/2011	US8022552 Integrated circuit and method for fabricating the same
09/20/2011	US8022551 Solder composition for electronic devices
09/20/2011	US8022550 Semiconductor integrated circuit device
09/20/2011	US8022549 Standard cell and semiconductor device including the same
09/20/2011	US8022547 Non-volatile memory cells including small volume electrical contact regions
09/20/2011	US8022546 Top layers of metal for high performance IC's
09/20/2011	US8022545 Top layers of metal for high performance IC's
09/20/2011	US8022544 Chip structure
09/20/2011	US8022543 Underbump metallurgy for enhanced electromigration resistance
09/20/2011	US8022542 Semiconductor device having improved metal wiring
09/20/2011	US8022541 Au-Ag based alloy wire for semiconductor package
09/20/2011	US8022540 Chip package
09/20/2011	US8022539 Integrated circuit packaging system with increased connectivity and method of manufacture thereof
09/20/2011	US8022538 Base package system for integrated circuit package stacking and method of manufacture thereof
09/20/2011	US8022537 Semiconductor device
09/20/2011	US8022536 Semiconductor substrate for build-up packages
09/20/2011	US8022535 Systems, devices, and methods for semiconductor device temperature management
09/20/2011	US8022534 Semiconductor package using an active type heat-spreading element
09/20/2011	US8022533 Circuit apparatus provided with asperities on substrate surface
09/20/2011	US8022532 Interposer and semiconductor device
09/20/2011	US8022531 Integrated circuit package system using heat slug
09/20/2011	US8022530 Package substrate having electrically connecting structure
09/20/2011	US8022529 Semiconductor device and method for manufacturing the same
09/20/2011	US8022528 Stack-type semiconductor package and electronic system including the same
09/20/2011	US8022527 Edge connect wafer level stacking
09/20/2011	US8022526 Distributed computing
09/20/2011	US8022525 Semiconductor device and method of manufacturing semiconductor device
09/20/2011	US8022524 Semiconductor device
09/20/2011	US8022523 Multi-chip stack package
09/20/2011	US8022522 Semiconductor package
09/20/2011	US8022521 Package failure prognostic structure and method
09/20/2011	US8022520 System for hermetically sealing packages for optics
09/20/2011	US8022519 System-in-a-package based flash memory card
09/20/2011	US8022518 Semiconductor device having a sealing body and partially exposed conductors
09/20/2011	US8022517 Semiconductor chip package
09/20/2011	US8022516 Metal leadframe package with secure feature

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