| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/21/2011 | EP2367406A1 Surface mount electronic component |
| 09/21/2011 | EP2367202A2 Method for producing an electrically conductive connection between a contact and a counter contact |
| 09/21/2011 | EP2365934A1 Functional capping |
| 09/21/2011 | EP2260511B1 Component arrangement and method for producing a component arrangement |
| 09/21/2011 | EP2164822B1 Conductor paste for ceramic substrate and electric circuit |
| 09/21/2011 | EP1932407B1 Electrical module |
| 09/21/2011 | EP1880389B1 Nonvolatile memory cell comprising a diode and a resistance-switching material |
| 09/21/2011 | EP1378154B1 Electronic module including a cooling substrate with fluid dissociation electrodes and operating method thereof |
| 09/21/2011 | EP1261988B1 Group iii nitride based fets and hemts with reduced trapping and method for producing the same |
| 09/21/2011 | EP1068638B1 Wafer-pair having chambers sealed with a deposited layer and method for forming wafer-pair |
| 09/21/2011 | CN201986254U 带有绝缘微散热器的印刷电路板 A printed circuit board with the insulating microelements radiator |
| 09/21/2011 | CN201985802U 一种电机软起动器 A motor soft starters |
| 09/21/2011 | CN201985801U 适用于电机软起动器散热器的绝缘结构 Insulation applied to the radiator motor soft starters |
| 09/21/2011 | CN201985106U 瞬态电压抑制二极管的复合内钝化层结构 Transient voltage suppression diodes composite inner structure of the passivation layer |
| 09/21/2011 | CN201985104U 有机发光器件像素电路的倒t字形薄膜晶体管结构 T-shaped inverted organic light emitting device structure of a thin film transistor pixel circuit |
| 09/21/2011 | CN201985098U 基板穿孔绝缘结构 Perforated insulation board |
| 09/21/2011 | CN201985092U Microelectronic unit, interconnecting base plate and system |
| 09/21/2011 | CN201985091U 裸晶封装载板 Die package carrier |
| 09/21/2011 | CN201985090U 一种驱动裸片的兼容封装结构 A package structure compatible driver dies |
| 09/21/2011 | CN201985089U 一体式电脑散热器 One computer radiator |
| 09/21/2011 | CN201985088U 散热装置和计算机 Cooling devices and computers |
| 09/21/2011 | CN201985087U 一种防污电子散热器 An antifouling electronic radiator |
| 09/21/2011 | CN201985086U 一种晶片封装结构 A wafer package structure |
| 09/21/2011 | CN1700453B Structure of forming pressure contact with power semiconductor module |
| 09/21/2011 | CN1649043B 电子元件 Electronic component |
| 09/21/2011 | CN102197533A Resin multilayer device and method for manufacturing same |
| 09/21/2011 | CN102197481A Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it |
| 09/21/2011 | CN102197480A Method for verifying an identification circuit |
| 09/21/2011 | CN102197479A Through-substrate via and redistribution layer with metal paste |
| 09/21/2011 | CN102197478A Microelectronic substrate having metal posts joined thereto using bond layer |
| 09/21/2011 | CN102197477A Pb-free solder bumps with improved mechanical properties |
| 09/21/2011 | CN102197476A A semiconductor device comprising a carbon based material for through hole vias |
| 09/21/2011 | CN102197475A Semiconductor module |
| 09/21/2011 | CN102197474A Microelectronic package assembly, method for disconnecting a microelectronic package |
| 09/21/2011 | CN102197456A Improved metal-on-metal capacitor with diagonal feedline |
| 09/21/2011 | CN102197445A Integrated circuit packages incorporating an inductor and methods |
| 09/21/2011 | CN102197335A Al alloy film for display device, display device and sputtering target |
| 09/21/2011 | CN102197092A Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device |
| 09/21/2011 | CN102197069A Heat conducting sheet, manufacturing method thereof, and heat radiator that utilizes same |
| 09/21/2011 | CN102196708A Wind scooper |
| 09/21/2011 | CN102196706A Heat dissipation device |
| 09/21/2011 | CN102196663A Printed circuit board (PCB), semiconductor package, electrical and electronic apparatus, method of fabricating the pcb, and method of fabricating the semiconductor package |
| 09/21/2011 | CN102196657A Circuit substrate |
| 09/21/2011 | CN102195614A Relay circuit of electrostatic discharge circuit, method for protecting the same and integrated circuit |
| 09/21/2011 | CN102195502A Semiconductor device |
| 09/21/2011 | CN102195388A Voltage regulator brush carrier assembly formed by connecting a plurality of layers of lines |
| 09/21/2011 | CN102195112A Transmission line, impedance transformer, integrated circuit mounted device, and communication device module |
| 09/21/2011 | CN102194895A Integrated circuit and capacitor therein |
| 09/21/2011 | CN102194891A Transistor substrate and manufacturing method of the same |
| 09/21/2011 | CN102194878A Termination structure with multiple embedded potential spreading capacitive structures for trench MOSFET and method |
| 09/21/2011 | CN102194865A High-power insulated gate bipolar translator (IGBT) flat pressed and connected packaging structure |
| 09/21/2011 | CN102194826A Three-dimensional semiconductor storing device and formation method thereof |
| 09/21/2011 | CN102194822A Bit line structure, semiconductor element and forming method thereof |
| 09/21/2011 | CN102194821A Three-dimensional storing array with improved serial selection line and bit line contact distribution |
| 09/21/2011 | CN102194816A Semiconductor device for applying common source lines with individual bias voltages |
| 09/21/2011 | CN102194811A 热电装置 Thermoelectric devices |
| 09/21/2011 | CN102194806A Stacked dual chip package and method of fabrication |
| 09/21/2011 | CN102194805A Semiconductor package with stacked chips and method for manufacturing the same |
| 09/21/2011 | CN102194804A Package structure |
| 09/21/2011 | CN102194803A Semiconductor structure |
| 09/21/2011 | CN102194802A Electronic assembly body |
| 09/21/2011 | CN102194800A Multi-chip package with improved signal transmission |
| 09/21/2011 | CN102194799A Unit in collection of units and its manufacture method |
| 09/21/2011 | CN102194798A Short-circuit deembedding test structure for micro-capacitance MOS (Metal Oxide Semiconductor) varactor and variode |
| 09/21/2011 | CN102194797A Square flat leadless packaging structure capable of avoiding electromagnetic interference and manufacturing method thereof |
| 09/21/2011 | CN102194796A Wafer detection structure, manufacturing method thereof and wafer detection method |
| 09/21/2011 | CN102194795A Test structure of dielectric layer under metal layer |
| 09/21/2011 | CN102194794A Plasma damage detection structure as well as detection method and formation method thereof |
| 09/21/2011 | CN102194793A Three-dimensional semiconductor device |
| 09/21/2011 | CN102194792A Integrated circuit and a method for producing the same |
| 09/21/2011 | CN102194791A Multilayer wiring substrate and method of manufacturing the same |
| 09/21/2011 | CN102194790A Thermoelectric separated metal chip on board |
| 09/21/2011 | CN102194789A Waterproof sealed lead wire frame |
| 09/21/2011 | CN102194788A Multi-layer lead frame package and method of fabrication |
| 09/21/2011 | CN102194787A Electronic component |
| 09/21/2011 | CN102194786A Lead frame for semiconductor device and method of manufacturing of the same |
| 09/21/2011 | CN102194785A Leadframe circuit and method therefor |
| 09/21/2011 | CN102194784A 半导体装置 Semiconductor device |
| 09/21/2011 | CN102194783A Enhanced WLP for superior temperature cycling, drop test and high current applications |
| 09/21/2011 | CN102194782A Semiconductor package, substrate, electronic component, and method of mounting semiconductor package |
| 09/21/2011 | CN102194781A Image sensor package and fabrication method thereof |
| 09/21/2011 | CN102194780A Electronic device and its manufacture method |
| 09/21/2011 | CN102194779A Packaging structure |
| 09/21/2011 | CN102194778A Display wiring substrate and display apparatus |
| 09/21/2011 | CN102194777A Chip package and method for forming the same |
| 09/21/2011 | CN102194776A Stress resistant micro-via structure for flexible circuits |
| 09/21/2011 | CN102194775A Pin-free packaging structure with four flat sides |
| 09/21/2011 | CN102194774A Heat-radiating type flip chip package structure and application thereof |
| 09/21/2011 | CN102194773A Semiconductor device and manufacturing method therefor |
| 09/21/2011 | CN102194772A Surface mount electronic component |
| 09/21/2011 | CN102194771A Semiconductor device and manufacturing method thereof |
| 09/21/2011 | CN102194770A Ultrathin semiconductor package |
| 09/21/2011 | CN102194769A Chip packaging structure and method |
| 09/21/2011 | CN102194768A Substrates, package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages |
| 09/21/2011 | CN102194767A Substrate for power module, preparing method thereof, substrate with radiator and power module thereof |
| 09/21/2011 | CN102194766A Power module substrate, preparing method thereof, substrate with radiator, and power module |
| 09/21/2011 | CN102194765A Substrate for power module, preparing method thereof, substrate with heat radiator and power module |
| 09/21/2011 | CN102194764A Semiconductor device, method for producing the semiconductor device, substrate for semiconductor element and method for producing the substrate |
| 09/21/2011 | CN102194763A Substrate for carrying semiconductor components and manufacturing method thereof |
| 09/21/2011 | CN102194762A Semiconductor device and manufacturing method thereof |