| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/27/2011 | US8026592 Through-silicon via structures including conductive protective layers |
| 09/27/2011 | US8026591 Semiconductor device with lead terminals having portions thereof extending obliquely |
| 09/27/2011 | US8026590 Die package and method of manufacturing the same |
| 09/27/2011 | US8026589 Reduced profile stackable semiconductor package |
| 09/27/2011 | US8026588 Method of wire bonding over active area of a semiconductor circuit |
| 09/27/2011 | US8026587 Semiconductor package including top-surface terminals for mounting another semiconductor package |
| 09/27/2011 | US8026586 Semiconductor package |
| 09/27/2011 | US8026585 Die stacking structure and fabricating method thereof |
| 09/27/2011 | US8026582 Integrated circuit package system with internal stacking module adhesive |
| 09/27/2011 | US8026581 Gallium nitride material devices including diamond regions and methods associated with the same |
| 09/27/2011 | US8026580 Semiconductor device package with integrated heat spreader |
| 09/27/2011 | US8026578 Barrier film and method of producing barrier film |
| 09/27/2011 | US8026573 Electrical fuse structure |
| 09/27/2011 | US8026572 Semiconductor device and method for manufacturing same |
| 09/27/2011 | US8026571 Semiconductor-device isolation structure |
| 09/27/2011 | US8026567 Thermoelectric cooler for semiconductor devices with TSV |
| 09/27/2011 | US8026566 Semiconductor device and method for manufacturing semiconductor device |
| 09/27/2011 | US8026552 Protection element and fabrication method for the same |
| 09/27/2011 | US8026536 Semiconductor device having a dummy gate |
| 09/27/2011 | US8026530 Semiconductor light-emitting device, lighting module and lighting apparatus |
| 09/27/2011 | US8026152 Separation method of semiconductor device |
| 09/27/2011 | US8026128 Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask |
| 09/27/2011 | US8025201 Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles |
| 09/27/2011 | US8024857 Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same |
| 09/27/2011 | DE202011102888U1 Kühlmodul Cooling module |
| 09/26/2011 | DE202011003706U1 Oberflächenmontierbaren Leistungsgehäusen für Halbleiterchips und deren Anordnung zur Wärmeableitung Surface-mount power packages for semiconductor chips and the arrangement for heat dissipation |
| 09/22/2011 | WO2011116325A1 Through glass via manufacturing process |
| 09/22/2011 | WO2011116106A2 System-in-package using embedded-die coreless substrates, and processes of forming same |
| 09/22/2011 | WO2011115859A2 Biaxial strained field effect transistor devices |
| 09/22/2011 | WO2011115041A1 Semiconductor device manufacturing method and semiconductor device |
| 09/22/2011 | WO2011114989A1 Thin film formation method |
| 09/22/2011 | WO2011114960A1 Film forming method and film forming apparatus |
| 09/22/2011 | WO2011114935A1 Epoxy resin composition and cured substance |
| 09/22/2011 | WO2011114774A1 Substrate having integrated semiconductor element, and manufacturing method for same |
| 09/22/2011 | WO2011114766A1 Substrate with built-in functional element |
| 09/22/2011 | WO2011114687A1 Resin composition for sealing semiconductors, and semiconductor device using same |
| 09/22/2011 | WO2011114665A1 Heat-resistant adhesive |
| 09/22/2011 | WO2011114616A1 Ebullient cooling device |
| 09/22/2011 | WO2011114404A1 Active matrix substrate |
| 09/22/2011 | WO2011113720A2 Optoelectronic component and method for the production thereof |
| 09/22/2011 | WO2011113511A1 Laminate structure for a chip card and method for the production thereof |
| 09/22/2011 | WO2011113288A1 High power led illuminating device |
| 09/22/2011 | WO2011113222A1 Led streetlamp |
| 09/22/2011 | WO2011113178A1 Cooling assembly for cooling heat generating component |
| 09/22/2011 | WO2011113136A1 Multi-chip package with offset die stacking and method of making same |
| 09/22/2011 | WO2011090574A3 Semiconductor package and method |
| 09/22/2011 | WO2011081696A3 Dap ground bond enhancement |
| 09/22/2011 | WO2011068777A3 Slotted configuration for optimized placement of micro-components using adhesive bonding |
| 09/22/2011 | WO2011055984A3 Leadframe and method of manufacuring the same |
| 09/22/2011 | US20110228464 System-in-package using embedded-die coreless substrates, and processes of forming same |
| 09/22/2011 | US20110227235 Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device |
| 09/22/2011 | US20110227234 Multi-function card device |
| 09/22/2011 | US20110227233 Packaged Electronic Device Having Metal Comprising Self-Healing Die Attach Material |
| 09/22/2011 | US20110227232 Crenulated wiring structure and method for integrated circuit interconnects |
| 09/22/2011 | US20110227231 Semiconductor device and methods of manufacturing the same |
| 09/22/2011 | US20110227230 Through-silicon via fabrication with etch stop film |
| 09/22/2011 | US20110227229 Semiconductor wafer processing |
| 09/22/2011 | US20110227228 Filling composition, semiconductor device including the same, and method of fabricating the semiconductor device |
| 09/22/2011 | US20110227227 Integrated circuit having tsvs including hillock suppression |
| 09/22/2011 | US20110227226 Multi-chip stack structure having through silicon via |
| 09/22/2011 | US20110227225 Copper alloy via bottom liner |
| 09/22/2011 | US20110227224 Semiconductor device and method for manufacturing the same |
| 09/22/2011 | US20110227223 Embedded die with protective interposer |
| 09/22/2011 | US20110227222 Surface-mounted electronic component |
| 09/22/2011 | US20110227221 Electronic device having interconnections and pads |
| 09/22/2011 | US20110227220 Stackable semiconductor package and manufacturing method thereof |
| 09/22/2011 | US20110227219 Enhanced wlp for superior temp cycling, drop test and high current applications |
| 09/22/2011 | US20110227218 Silicon substrate for package |
| 09/22/2011 | US20110227217 Semiconductor package with stacked chips and method for manufacturing the same |
| 09/22/2011 | US20110227216 Under-Bump Metallization Structure for Semiconductor Devices |
| 09/22/2011 | US20110227215 Electronic device, package including the same and method of fabricating the package |
| 09/22/2011 | US20110227214 Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
| 09/22/2011 | US20110227213 Method for fabricating semiconductor devices and a semiconductor device made therefrom |
| 09/22/2011 | US20110227212 Semiconductor device package and method of fabricating the same |
| 09/22/2011 | US20110227211 Integrated circuit packaging system with package leads and method of manufacture thereof |
| 09/22/2011 | US20110227210 Chip package and method for forming the same |
| 09/22/2011 | US20110227209 Integrated circuit package system with package stacking and method of manufacture thereof |
| 09/22/2011 | US20110227208 Structure and Manufacture Method For Multi-Row Lead Frame and Semiconductor Package |
| 09/22/2011 | US20110227207 Stacked dual chip package and method of fabrication |
| 09/22/2011 | US20110227206 Integrated circuit packaging system with lead frame and method of manufacture thereof |
| 09/22/2011 | US20110227205 Multi-layer lead frame package and method of fabrication |
| 09/22/2011 | US20110227204 Semiconductor device and method for manufacturing a semiconductor device |
| 09/22/2011 | US20110227201 Semiconductor chip with a rounded corner |
| 09/22/2011 | US20110227200 Alignment structures for integrated-circuit packaging |
| 09/22/2011 | US20110227197 Semiconductor integrated circuit comprising electro static discharge protection element |
| 09/22/2011 | US20110227190 Electronic device package structure and method for fabricating the same |
| 09/22/2011 | US20110227126 Electronics device, semiconductor device, and method for manufacturing the same |
| 09/22/2011 | US20110227122 Semiconductor chip assembly with post/base heat spreader with thermal via |
| 09/22/2011 | US20110227115 Semiconductor device and manufacturing method thereof, and camera module including the same |
| 09/22/2011 | US20110227069 Semiconductor substrate and semiconductor chip |
| 09/22/2011 | US20110226981 Multilayered cap barrier in microelectronic interconnect structures |
| 09/22/2011 | US20110226520 Integrated circuit carrier assembly |
| 09/22/2011 | DE10240415B4 Halbleiteranordnung mit einem in einem Hohlraum eingebetteten Modul und Verfahren zum Herstellen derselben A semiconductor device comprising an embedded in a cavity module and method for manufacturing the same |
| 09/22/2011 | DE102011013225A1 Weiterentwickeltes Wafer-Level-Packaging (WLP) für verbesserte Temperaturwechsel,- Fallversuchs- und Hochstromanwendung Evolved wafer-level packaging (WLP) for improved thermal shock, - Fallversuchs- and high current application |
| 09/22/2011 | DE102010012239A1 Operating and indicator device of motor car, has combination instrument containing virtual operating unit which is displayed during approximation of thumb with respect to actual operating unit |
| 09/22/2011 | DE102010012042A1 Bauelement mit einem Chip in einem Hohlraum und einer spannungsreduzierten Befestigung Component with a chip in a cavity and a voltage reduced fastening |
| 09/22/2011 | DE102007061599B4 Trägeraufbau für einen Leistungsbaustein mit einem Kühlkörper und Verfahren zu dessen Herstellung Support structure for a power module to a heat sink and method for manufacturing the |
| 09/22/2011 | DE102004063039B4 Anordnung mit einem elektrischen Leistungshalbleiterbauelement und einer Zwei-Phasen-Kühlvorrichtung Arrangement with an electric power semiconductor component and a two-phase cooling device |
| 09/22/2011 | DE10066442B4 Halbleitervorrichtung mit Abstrahlungs-Struktur A semiconductor device having radiating structure |
| 09/22/2011 | CA2790932A1 Laminate structure for a chip card and method for the production thereof |