H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2011
09/28/2011	CN102201410A Semiconductor device
09/28/2011	CN102201409A Power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) device with tungsten spacing layer and production method thereof
09/28/2011	CN102201407A Capacitor on chip
09/28/2011	CN102201402A 半导体装置 Semiconductor device
09/28/2011	CN102201401A 半导体装置 Semiconductor device
09/28/2011	CN102201399A Light emitting element
09/28/2011	CN102201398A Resin sealed semiconductor device and manufacturing method therefor
09/28/2011	CN102201395A Multi-layer semiconductor module packaging structure with anti-surge function and manufacturing method thereof
09/28/2011	CN102201394A Semiconductor wafer and its manufacture method, and semiconductor chip
09/28/2011	CN102201393A Circuit assembly with an electric component and a compound film
09/28/2011	CN102201392A Electric fuse circuit and method of operating the same
09/28/2011	CN102201391A Semiconductor device and method of manufacturing the same
09/28/2011	CN102201390A Chip on film (COF) packaging substrate for high-pixel camera module and manufacturing method thereof
09/28/2011	CN102201389A Semiconductor device provided with tin diffusion inhibiting layer and manufacturing method of the same
09/28/2011	CN102201388A QFN semiconductor package and fabrication method thereof
09/28/2011	CN102201387A OFN semiconductor package and fabrication method thereof
09/28/2011	CN102201386A QFN semiconductor package and fabricating method thereof
09/28/2011	CN102201385A QFN semiconductor package and fabricating method thereof
09/28/2011	CN102201384A Small outline package lead frame of LED (light emitting diode) driving circuit
09/28/2011	CN102201383A Electronic device package and fabricating method thereof
09/28/2011	CN102201382A Semiconductor packaging piece and manufacturing method thereof
09/28/2011	CN102201381A Modular semiconductor device for strengthening heat dissipation
09/28/2011	CN102201380A 半导体装置 Semiconductor device
09/28/2011	CN102201379A Device packaging structure and packaging method thereof
09/28/2011	CN102201378A Insulation membrane structure of single grain sized semiconductor element
09/28/2011	CN102201377A Wafer level packaging with heat dissipation
09/28/2011	CN102201376A Optical cover plate with improved solder mask dam on galss for image sensor package and fabrication method thereof
09/28/2011	CN102201375A Integrated circuit device and packaging assembly
09/28/2011	CN102201374A Semiconductor chip with packaging ring and manufacturing method thereof
09/28/2011	CN102201365A Method for producing semiconductor device
09/28/2011	CN102201351A Semiconductor device and method for forming dual UBM structure for lead free bump connection
09/28/2011	CN102201349A Circuit component built-in module and manufacturing method therefor
09/28/2011	CN102201283A Capacitor, integrated device, radio frequency switching device and electronic apparatus
09/28/2011	CN102199404A Film-like circuit connecting material and connection structure for circuit member
09/28/2011	CN102199276A Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof
09/28/2011	CN101825412B Heat radiator with composite structure and preparation method thereof
09/28/2011	CN101819955B Semiconductor packaging structure with reinforced heat dissipation property
09/28/2011	CN101807555B Substrate structure and package structure using the same
09/28/2011	CN101789421B Semiconductor device
09/28/2011	CN101785099B 电子零件 Electronic Parts
09/28/2011	CN101752373B Anti-static protection structure and manufacturing method thereof
09/28/2011	CN101740542B Welded structure of surface mount technology for ball grid array
09/28/2011	CN101740404B Structure of semiconductor packaging piece and manufacture method thereof
09/28/2011	CN101728378B Organic light emitting diode display device and manufacturing method thereof
09/28/2011	CN101689502B Cu wiring film
09/28/2011	CN101668403B Electronic device and radiator thereof
09/28/2011	CN101635281B Semiconductor device packages with electromagnetic interference shielding and its forming method
09/28/2011	CN101630668B Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element
09/28/2011	CN101621902B Fixing device and heat sink using same
09/28/2011	CN101593753B Nonvolatile memory and manufacturing method thereof
09/28/2011	CN101589466B Electronic component
09/28/2011	CN101586795B 光源装置 The light source device
09/28/2011	CN101577346B Battery pack
09/28/2011	CN101568248B Cooling apparatus for electronic device and electronic device including the same
09/28/2011	CN101566332B Heat dissipation device and lighting equipment
09/28/2011	CN101562962B Heat dissipating device
09/28/2011	CN101527300B 堆叠式集成电路与其制造方法 Stacked ICs and its manufacturing method
09/28/2011	CN101504940B Semiconductor package, and method of manufacturing semiconductor package
09/28/2011	CN101472439B Radiating device
09/28/2011	CN101466226B Fastener and radiating device using the same
09/28/2011	CN101465315B Integrated circuit structure and its forming method
09/28/2011	CN101460038B Heat radiation device
09/28/2011	CN101457913B LED lamp
09/28/2011	CN101447492B Semiconductor display device
09/28/2011	CN101442063B Semiconductor device and image sensing device
09/28/2011	CN101374396B Combination of radiating device
09/28/2011	CN101320779B Light-emitting diode
09/28/2011	CN101316494B Heat radiating device and fastener thereof
09/28/2011	CN101292349B Device comprising an element with electrodes coupled to connections
09/28/2011	CN101276805B Semiconductor encapsulation structure with electromagnetic interference shield function and manufacturing method thereof
09/28/2011	CN101218673B 半导体装置 Semiconductor device
09/28/2011	CN101189625B Semiconductor device, method for manufacturing the same, and method for manufacturing antenna
09/28/2011	CN101188204B Semiconductor device and manufacturing method therefor
09/28/2011	CN101026943B Guided radiating device
09/27/2011	US8028208 Wireless radio frequency technique design and method for testing of integrated circuits and wafers
09/27/2011	US8027161 Electronic power converter and mounting structure of semiconductor device
09/27/2011	US8026618 Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape
09/27/2011	US8026617 Contact layout structure
09/27/2011	US8026616 Printed circuit board, semiconductor package, card apparatus, and system
09/27/2011	US8026615 IC package reducing wiring layers on substrate and its carrier
09/27/2011	US8026614 Semiconductor IC-embedded substrate and method for manufacturing same
09/27/2011	US8026613 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
09/27/2011	US8026612 Semiconductor device and method of manufacturing semiconductor device
09/27/2011	US8026611 Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
09/27/2011	US8026610 Silicon interposer and method for manufacturing the same
09/27/2011	US8026609 Semiconductor device and method for producing the same
09/27/2011	US8026608 Stackable electronic package
09/27/2011	US8026607 Semiconductor apparatus
09/27/2011	US8026605 Interconnect structure and method of manufacturing a damascene structure
09/27/2011	US8026604 Semiconductor devices having contact holes including protrusions exposing contact pads
09/27/2011	US8026603 Interconnect structure of an integrated circuit and manufacturing method thereof
09/27/2011	US8026602 Fabrication method of semiconductor device having conductive bumps
09/27/2011	US8026601 Encapsulated wafer level package with protection against damage and manufacturing method
09/27/2011	US8026600 Controlled impedance structures for high density interconnections
09/27/2011	US8026599 Method of protecting integrated circuits
09/27/2011	US8026598 Semiconductor chip module with stacked flip-chip unit
09/27/2011	US8026597 Fluid cooled encapsulated microelectronic package
09/27/2011	US8026596 Thermal designs of packaged gallium nitride material devices and methods of packaging
09/27/2011	US8026594 Sensor device and production method therefor
09/27/2011	US8026593 Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

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