| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/29/2011 | US20110233751 Integrated circuit packaging system with encapsulation and method of manufacture thereof |
| 09/29/2011 | US20110233750 Arrangement of Two Substrates having an SLID Bond and Method for Producing such an Arrangement |
| 09/29/2011 | US20110233749 Semiconductor device package and method of fabricating the same |
| 09/29/2011 | US20110233748 Integrated circuit packaging system with interconnect and method of manufacture thereof |
| 09/29/2011 | US20110233747 Integrated circuit packaging system with stacking option and method of manufacture thereof |
| 09/29/2011 | US20110233746 Dual-leadframe Multi-chip Package and Method of Manufacture |
| 09/29/2011 | US20110233745 Integrated Circuit Packages |
| 09/29/2011 | US20110233744 Integrated circuit protruding pad package system and method for manufacturing thereof |
| 09/29/2011 | US20110233743 Integrated circuit packaging system with leadframe and method of manufacture thereof |
| 09/29/2011 | US20110233742 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus |
| 09/29/2011 | US20110233741 Semiconductor memory device and manufacturing the same |
| 09/29/2011 | US20110233740 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices |
| 09/29/2011 | US20110233739 Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device |
| 09/29/2011 | US20110233738 Semiconductor device and lead frame |
| 09/29/2011 | US20110233737 Method for manufacturing 3-dimensional structures using thin film with columnar nano pores and manufacture thereof |
| 09/29/2011 | US20110233736 Integrated circuit packaging system with encapsulation and method of manufacture thereof |
| 09/29/2011 | US20110233735 Semiconductor wafer and its manufacture method, and semiconductor chip |
| 09/29/2011 | US20110233718 Heterogeneous Technology Integration |
| 09/29/2011 | US20110233678 Junction varactor for esd protection of rf circuits |
| 09/29/2011 | US20110233630 Integrated circuit having a semiconductor substrate with barrier layer |
| 09/29/2011 | US20110233625 Semiconductor device and method for manufacturing the same |
| 09/29/2011 | US20110233618 Non-volatile semiconductor memory device and method of manufacturing the same |
| 09/29/2011 | US20110233560 Electrode for silicon carbide, silicon carbide semiconductor element, silicon carbide semiconductor device and method for forming electrode for silicon carbide |
| 09/29/2011 | US20110233548 Test circuit for use in a semiconductor apparatus |
| 09/29/2011 | US20110233547 Display apparatus and method of manufacturing the same |
| 09/29/2011 | US20110233545 Semiconductor Chip Having Double Bump Structure And Smart Card Including The Same |
| 09/29/2011 | US20110233543 Test pad structure for reuse of interconnect level masks |
| 09/29/2011 | US20110232877 Compact vapor chamber and heat-dissipating module having the same |
| 09/29/2011 | US20110232747 Thick-film pastes and solar cells made therefrom |
| 09/29/2011 | DE112009001839T5 Wärmeregelungssystem für eine LED-Beleuchtungsvorrichtung Thermal control system for LED lighting device |
| 09/29/2011 | DE102011005994A1 Sensorgehäuse und Verfahren zum Herstellen eines Sensorgehäuses Sensor housing and method of manufacturing a sensor housing |
| 09/29/2011 | DE102011005767A1 Integrierte-Schaltung-Gehäuseanordnung, die einen Wellenleiter umfasst Integrated circuit package assembly comprising a waveguide |
| 09/29/2011 | DE102011001556A1 Gekapselter Halbleiterchip mit externen Kontaktpads und Herstellungsverfahren Encapsulated semiconductor chip with external contact pads and methods of manufacture |
| 09/29/2011 | DE102010013165A1 Vorrichtung zur Positionierung eines Leistungshalbleiters Device for positioning of a power semiconductor |
| 09/29/2011 | DE102010012457A1 Schaltungsanordnung mit einer elektrischen Komponente und einer Verbundfolie A circuit arrangement with an electrical component and a composite film |
| 09/29/2011 | DE102010006010A1 Integrated circuit package for setting micromodule that is used as electronic key for access control of motor car, has metallic strip retained by transponder antenna that rests on two leverages arranged on metallic strip |
| 09/29/2011 | DE102010003330A1 Wärmeleitende Anordnung zwischen zwei Bauteilen und Verfahren zum Herstellen einer wärmeleitenden Anordnung Thermal conduction device between two components and method of manufacturing a heat-conducting arrangement |
| 09/29/2011 | DE102010003321A1 Optoelektronisches Bauelement Optoelectronic component |
| 09/29/2011 | DE102006031539B4 Integrierter Halbleiterchip mit lateraler Wärmedämmung und Substratkontakt Integrated semiconductor chip with lateral thermal insulation and substrate contact |
| 09/29/2011 | DE102005034649B4 Optische Halbleitervorrichtung, optischer Verbinder und damit ausgerüstete elektronische Einrichtung A semiconductor optical device, optical connector and electronic device equipped therewith |
| 09/29/2011 | DE10196064B3 Halbleiterfotodetektionsgerät Semiconductor photodetection device |
| 09/29/2011 | DE10066446B4 Verfahren zur Herstellung eines elektronischen Bauteils mit zwei Abstrahlungsbauteilen A method of manufacturing an electronic component having two radiation components |
| 09/28/2011 | EP2369624A1 Device for positioning a power semiconductor |
| 09/28/2011 | EP2369622A1 Method and device of coutermeasure against a fault-injection error attack within an electronic microcircuit |
| 09/28/2011 | EP2369621A2 System and method to track and authenticate semiconductor chips, multi-chip package modules and derivative system products |
| 09/28/2011 | EP2369620A2 Heat transfer device with fins defining air flow channels |
| 09/28/2011 | EP2369619A2 Circuit assembly with an electric component and a compound film |
| 09/28/2011 | EP2369617A2 Semiconductor device and method of manufacturing the same |
| 09/28/2011 | EP2369411A1 Light source module and display apparatus having the same |
| 09/28/2011 | EP2369226A1 Lighting device including at least one light-emitting diode and a cooling system with fins. |
| 09/28/2011 | EP2369023A1 Bonding wire |
| 09/28/2011 | EP2368930A1 Novel low dielectric resin varnish composition for laminates and the preparation thereof |
| 09/28/2011 | EP1368861B1 Semiconductor device having signal contacts and high current power contacts |
| 09/28/2011 | EP1292970B1 Thin film forming method |
| 09/28/2011 | CN201994305U 后通孔互联型圆片级mosfet封装结构 After the through-hole interconnection type wafer level package structure mosfet |
| 09/28/2011 | CN201994304U 沟槽互联型圆片级mosfet封装结构 Trench-type wafer-level interconnection structure mosfet package |
| 09/28/2011 | CN201994303U 通孔互联型圆片级mosfet封装结构 Through-hole interconnection type wafer level package structure mosfet |
| 09/28/2011 | CN201994302U 过热自我保护半导体三极管 Self-semiconductor transistor overheat protection |
| 09/28/2011 | CN201994300U Power transistor with copper wire structure |
| 09/28/2011 | CN201994298U 集成电路的esd保护结构 Esd protection structure ICs |
| 09/28/2011 | CN201994296U 一种高功率封装模块 A high-power package module |
| 09/28/2011 | CN201994292U 高密度系统级封装结构 High-density system-level package structure |
| 09/28/2011 | CN201994291U 一种三维高集成度系统级封装结构 A three-dimensional highly integrated system-level package structure |
| 09/28/2011 | CN201994290U 扇出高密度封装结构 Fan-out of high-density packaging structure |
| 09/28/2011 | CN201994289U 晶圆级转接板结构 Wafer-level structure of the adapter plate |
| 09/28/2011 | CN201994288U 一种防渗引线框架 One kind of seepage leadframe |
| 09/28/2011 | CN201994287U 机械锁定和锡焊双重定位二极管脚的导电体 Mechanical locks and soldering dual positioning pin diode conductor |
| 09/28/2011 | CN201994286U 一种无尾翼水冷散热器 A non-tail water cooler |
| 09/28/2011 | CN201994285U 绝缘栅双极型晶体管的散热器及其晶体管散热器组件 Sink transistor and heat sink assembly of the insulated gate bipolar transistor |
| 09/28/2011 | CN201994284U 一种散热装置及功率模块 A heat sink device and power module |
| 09/28/2011 | CN201994283U 微均温板结构改良 Improved micro-structure of the average temperature plate |
| 09/28/2011 | CN201994282U 一种带有散热结构的电子封装用复合材料热沉组件 Electronic Packaging composite heat sink assembly for a structure with heat |
| 09/28/2011 | CN201994281U 电子元件的散热组装结构 Cooling the assembly structure of the electronic component |
| 09/28/2011 | CN201994280U 立式散热组件的改良结构 Vertical cooling components improved structure |
| 09/28/2011 | CN201994279U 放大器散热装置 Amplifier heat sink |
| 09/28/2011 | CN201994278U Laminated substrate with inductance used for chip package |
| 09/28/2011 | CN201994277U 晶圆封装结构 Wafer package structure |
| 09/28/2011 | CN1881577B Semiconductor device and method of fabricating the same |
| 09/28/2011 | CN1819159B Semiconductor wafer, semiconductor device manufacturing method, and semiconductor device |
| 09/28/2011 | CN102204418A Method for integrating an electronic component into a printed circuit board |
| 09/28/2011 | CN102203940A Supporting body for a semiconductor component, semiconductor element and method for production of a supporting body |
| 09/28/2011 | CN102203939A 热管和电子装置 Heat pipe and electronic devices |
| 09/28/2011 | CN102203938A A semiconductor device comprising an in-chip active heat transfer system |
| 09/28/2011 | CN102203927A Method for device plastic packaging and packaging structure |
| 09/28/2011 | CN102203926A Manufacturing method of electronic parts module |
| 09/28/2011 | CN102203916A Sputtering target for forming thin film transistor wiring film |
| 09/28/2011 | CN102203843A Drive device, display panel module, display device and method for manufacturing drive device |
| 09/28/2011 | CN102202488A Heat-pipe heat radiation apparatus |
| 09/28/2011 | CN102202486A Heat sink assembly and electronic device applying the same |
| 09/28/2011 | CN102202485A Heat-radiating device combination and electronic device employing same |
| 09/28/2011 | CN102202463A Side edge packaged type PCB (printed circuit board) |
| 09/28/2011 | CN102202461A Wiring substrate and method of manufacturing the same |
| 09/28/2011 | CN102202459A PCB (printed circuit board) with metal micro radiator |
| 09/28/2011 | CN102201665A Electrostatic discharge protection device |
| 09/28/2011 | CN102201449A Low-heat-resistance packaging structure of power MOS (Metal Oxide Semiconductor) device |
| 09/28/2011 | CN102201427A 发光元件 Light-emitting element |
| 09/28/2011 | CN102201420A Photoelectric conversion apparatus, image pickup system, and manufacturing method therefor |
| 09/28/2011 | CN102201416A Three-dimensional semiconductor memory devices and methods of fabricating the same |
| 09/28/2011 | CN102201415A 半导体器件 Semiconductor devices |
| 09/28/2011 | CN102201414A Semiconductor memory device and manufacturing the same |