H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/04/2011	US8030752 Method of manufacturing semiconductor package and semiconductor plastic package using the same
10/04/2011	US8030751 Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates
10/04/2011	US8030750 Semiconductor device packages with electromagnetic interference shielding
10/04/2011	US8030749 Semiconductor device
10/04/2011	US8030748 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
10/04/2011	US8030747 Stacked package and method of manufacturing the same
10/04/2011	US8030746 Integrated circuit package
10/04/2011	US8030745 ID chip and IC card
10/04/2011	US8030744 Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
10/04/2011	US8030743 Semiconductor package with an embedded printed circuit board and stacked die
10/04/2011	US8030742 Electronic device having profiled elements extending from planar surfaces
10/04/2011	US8030741 Electronic device
10/04/2011	US8030736 Fin anti-fuse with reduced programming voltage
10/04/2011	US8030733 Copper-compatible fuse target
10/04/2011	US8030674 Light-emitting diode package with roughened surface portions of the lead-frame
10/04/2011	US8030661 Power conversion apparatus
10/04/2011	US8030650 Pixel structure and methods for fabricating, detecting, and repairing the pixel structure
10/04/2011	US8030579 Multilayer printed wiring board
10/04/2011	US8030134 Stacked semiconductor package having adhesive/spacer structure and insulation
10/04/2011	US8030113 Thermoelectric 3D cooling
10/04/2011	US8028621 Three-dimensional structures and methods of fabricating the same using a printing plate
10/04/2011	US8028403 Method for forming laminated multiple substrates
10/04/2011	US8028402 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
10/04/2011	CA2441124C Electronic module with fluid dissociation electrodes and methods
09/2011
09/29/2011	WO2011119947A1 Three dimensional inductor and transformer design methodology of glass technology
09/29/2011	WO2011119891A2 High performance low cost open air cavity ceramic power packages for high temperature die attach processes
09/29/2011	WO2011119308A2 Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip
09/29/2011	WO2011119192A1 Backside dummy plugs for 3d integration
09/29/2011	WO2011118789A1 Glass substrate having silicon wiring embedded therein and method for manufacturing the glass substrate
09/29/2011	WO2011118788A1 Method for manufacturing silicon substrate having glass embedded therein
09/29/2011	WO2011118787A1 Manufacturing method for glass-embedded silicon substrate
09/29/2011	WO2011118785A1 Glass substrate having silicon wiring embedded therein and method for manufacturing the glass substrate
09/29/2011	WO2011118600A1 Method for manufacturing a semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device
09/29/2011	WO2011118572A1 Method for manufacturing semiconductor device
09/29/2011	WO2011118544A1 Wireless module and method for manufacturing same
09/29/2011	WO2011118415A1 Electronic component packaging base and electronic component packaging
09/29/2011	WO2011118171A1 Photosensitive resin composition and light receiving device
09/29/2011	WO2011118157A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using same
09/29/2011	WO2011118146A1 Circuit board, semiconductor device, manufacturing method for circuit board, and manufacturing method for semiconductor device
09/29/2011	WO2011118128A1 Circuit board, semiconductor device, manufacturing method for circuit board, and manufacturing method for semiconductor device
09/29/2011	WO2011118116A1 Semiconductor device and method for producing same
09/29/2011	WO2011117939A1 Semiconductor device and manufacturing method of same
09/29/2011	WO2011117920A1 Semiconductor device and method for manufacturing same
09/29/2011	WO2011117781A1 Countermeasure method and device for protecting data circulating in electronic microcircuit
09/29/2011	WO2011117726A1 Ic package stiffener with beam
09/29/2011	WO2011097630A3 Systems and methods providing arrangements of vias
09/29/2011	WO2011089178A3 Integrated dram memory device
09/29/2011	WO2011087573A3 Through mold via polymer block package
09/29/2011	WO2011071603A3 Module package with embedded substrate and leadframe
09/29/2011	WO2011063247A3 Interposer films useful in semiconductor packaging applications, and methods relating thereto
09/29/2011	WO2011049710A3 Stacked semiconductor device
09/29/2011	WO2011037735A3 Apparatus for using heat pipes in controlling temperature of an led light unit
09/29/2011	US20110239170 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
09/29/2011	US20110237004 Chipstack package and manufacturing method thereof
09/29/2011	US20110237001 Semiconductor chip used for evaluation, evaluation system, and repairing method thereof
09/29/2011	US20110235436 Semiconductor memory device
09/29/2011	US20110235407 Semiconductor memory device and a method of manufacturing the same
09/29/2011	US20110233796 Semiconductor Devices and Electronic Systems
09/29/2011	US20110233795 Stacked wafer level package having a reduced size
09/29/2011	US20110233794 Semiconductor device and manufacturing method thereof
09/29/2011	US20110233793 Semiconductor device and method for manufacturing the same
09/29/2011	US20110233792 Methods and systems for material bonding
09/29/2011	US20110233791 Method for performing parallel stochastic assembly
09/29/2011	US20110233790 Sacrificial Material to Facilitate Thin Die Attach
09/29/2011	US20110233789 Adhesive-bonded substrates in a multi-chip module
09/29/2011	US20110233787 Semiconductor structure and manufacturing method of semiconductor structure
09/29/2011	US20110233786 Semiconductor device and method for manufacturing the same
09/29/2011	US20110233785 Backside dummy plugs for 3d integration
09/29/2011	US20110233784 Composite substrate for a semiconductor chip
09/29/2011	US20110233783 Substrate arrangement
09/29/2011	US20110233782 Electronic device package and fabrication method thereof
09/29/2011	US20110233781 METAL LINE OF SEMICONDUCTOR DEVICE HAVING A DIFFUSION BARRIER WITH AN AMORPHOUS TaBN LAYER AND METHOD FOR FORMING THE SAME
09/29/2011	US20110233780 Cobalt nitride layers for copper interconnects and methods for forming them
09/29/2011	US20110233779 Semiconductor device and method of manufacturing the same
09/29/2011	US20110233778 Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance
09/29/2011	US20110233777 Through-wafer interconnects for photoimager and memory wafers
09/29/2011	US20110233776 Semiconductor chip with coil element over passivation layer
09/29/2011	US20110233775 Three-Dimensional Multichip Module
09/29/2011	US20110233774 Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices
09/29/2011	US20110233773 Manufacturing process and structure of through silicon via
09/29/2011	US20110233772 Semiconductor element and semiconductor device using the same
09/29/2011	US20110233771 Semiconductor packages having warpage compensation
09/29/2011	US20110233770 Chip package
09/29/2011	US20110233769 Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same
09/29/2011	US20110233768 Semiconductor device
09/29/2011	US20110233767 Semiconductor device and semiconductor device manufacturing method
09/29/2011	US20110233766 Semiconductor Device and Method of Forming a Dual UBM Structure for Lead Free Bump Connections
09/29/2011	US20110233765 Semiconductor device and method of manufacturing the same
09/29/2011	US20110233764 Semiconductor device package and method of fabricating the same
09/29/2011	US20110233763 Integrated circuit system with stress redistribution layer and method of manufacture thereof
09/29/2011	US20110233762 Wafer level integrated interconnect decal and manufacturing method thereof
09/29/2011	US20110233761 Cu pillar bump with non-metal sidewall protection structure
09/29/2011	US20110233760 Semiconductor device
09/29/2011	US20110233759 Semiconductor device
09/29/2011	US20110233758 Semiconductor device
09/29/2011	US20110233756 Wafer level packaging with heat dissipation
09/29/2011	US20110233755 Semiconductor Housing Package, Semiconductor Package Structure Including The Semiconductor Housing Package, And Processor-Based System Including The Semiconductor Package Structure
09/29/2011	US20110233754 Encapsulated Semiconductor Chip with External Contact Pads and Manufacturing Method Thereof
09/29/2011	US20110233753 Integrated circuit packaging system with leads and method of manufacture thereof
09/29/2011	US20110233752 Integrated circuit packaging system with an intermediate pad and method of manufacture thereof

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