H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/05/2011	CN102208391A Lead frame with sagged unit chip bonding region
10/05/2011	CN102208390A High-density bump substrate and manufacturing method thereof
10/05/2011	CN102208389A Semiconductor package, substrate and manufacturing method thereof
10/05/2011	CN102208388A Semiconductor device and semiconductor device manufacturing method
10/05/2011	CN102208387A Circuit board for being connected with ball grid array packaging assembly and method for forming bonding pad structure
10/05/2011	CN102208386A Integrated circuit encapsulation element with spherical solder beads
10/05/2011	CN102208385A Semiconductor device and semiconductor packaging structure provided with the same
10/05/2011	CN102208384A A semiconductor structure and a forming method for a semiconductor device
10/05/2011	CN102208383A Circuit board and formation method thereof
10/05/2011	CN102208382A Integrated circuit package component provided with side-edge pins
10/05/2011	CN102208381A Circulation cooling pipeline of three-level power module of integrated gate commutated thyristor (IGCT)
10/05/2011	CN102208380A Cooling structure
10/05/2011	CN102208379A Liquid heat dissipation component
10/05/2011	CN102208378A 冷却装置 Cooling device
10/05/2011	CN102208377A Radiating unit with antioxidant nano-film and deposition method of antioxidant nano-film
10/05/2011	CN102208376A 半导体器件 Semiconductor devices
10/05/2011	CN102208375A Circulation radiator, and manufacturing method and components thereof
10/05/2011	CN102208374A Semiconductor package and method of manufacturing the same
10/05/2011	CN102208373A Chip package structure and manufacture method thereof
10/05/2011	CN102208372A High-density conducting channel base plate and manufacturing method thereof
10/05/2011	CN102208371A Aluminium nitride ceramic copper-clad substrate and preparation method thereof
10/05/2011	CN102208370A Silicon wafer with glass layer formed on surface and manufacture method thereof
10/05/2011	CN102208369A Wire bonding structure of semiconductor device and wire bonding method
10/05/2011	CN102208358A Method for soldering flip chip on base plate and packaging apparatus
10/05/2011	CN102208356A Semiconductor device and manufacturing method thereof
10/05/2011	CN102208355A Square planar guide-pin-free semiconductor packaging part and manufacturing method thereof
10/05/2011	CN102208354A Square plane pin-free semiconductor package component and manufacture method thereof
10/05/2011	CN102208352A Manufacturing method and structure of ceramic copper-plated base plate
10/05/2011	CN102206398A Liquid epoxy underfill, preparation method and application thereof
10/05/2011	CN102206098A Ceramic copper-clad substrate and preparation method thereof
10/05/2011	CN102205470A Filling composition, semiconductor device including the same, and method of fabricating the semiconductor device
10/05/2011	CN101853833B Embedded basic island and multi-convex point basic island lead framework and first-etching last-plating method thereof
10/05/2011	CN101840901B Lead frame structure of static release ring without paddle and production method thereof
10/05/2011	CN101789410B Upright packaging structure with paddle exposed out of chip for heat dissipation block
10/05/2011	CN101752267B Chip scale package structure of CMOS (complementary metal-oxide-semiconductor) image sensor and packaging method
10/05/2011	CN101752266B Chip scale package structure of CMOS (complementary metal-oxide-semiconductor) image sensor and packaging method
10/05/2011	CN101742875B Radiation component
10/05/2011	CN101740424B Manufacturing process for a chip package structure
10/05/2011	CN101738806B Array backboard, probe used for testing array backboard and liquid crystal display panel
10/05/2011	CN101738804B Pixel structure
10/05/2011	CN101730935B Method for manufacturing electronic component package
10/05/2011	CN101689521B Method and apparatus for monitoring vias in a semiconductor fab
10/05/2011	CN101673718B Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
10/05/2011	CN101661918B Quad flat non-leaded chip package
10/05/2011	CN101632170B Interposer and manufacturing method of the interposer
10/05/2011	CN101582431B Thin film transistor (TFT) array substrate and manufacture method thereof
10/05/2011	CN101576206B High-power LED lamp based on heat pipe for thermal conductivity
10/05/2011	CN101563775B Heat exchanger for use in cooling of semiconductor element and method for manufacturing the same
10/05/2011	CN101562143B Method for manufacturing a semiconductor device, method and structure for mounting the semiconductor device
10/05/2011	CN101529587B Method of packaging a device having a multi-contact elastomer connector contact area and device thereof
10/05/2011	CN101496169B Electric power converter
10/05/2011	CN101488464B Method for forming an encapsulated device and structure
10/05/2011	CN101460404B Spherical sintered ferrite particle, semiconductor sealing resin composition making use of the same and semiconductor device obtained therewith
10/05/2011	CN101452908B Display apparatus and repairing method therefor
10/05/2011	CN101443905B Semiconductor device having low dielectric insulating film and manufacturing method of the same
10/05/2011	CN101440943B LED mechanism capable of being replaced
10/05/2011	CN101430068B Liquid crystal display device
10/05/2011	CN101416373B Power conversion apparatus
10/05/2011	CN101409239B Method for manufacturing wiring plate
10/05/2011	CN101350337B IC having wafer paste sheet adhesive tape and encapsulation method tehreof
10/05/2011	CN101290916B Film device and its manufacture method
10/05/2011	CN101174602B Small shape ic package for high-current semiconductor power device
10/05/2011	CN101148542B Heat-curable silicone composition and light emitting diode element using same
10/04/2011	USRE42785 Semiconductor module with serial bus connection to multiple dies
10/04/2011	USRE42776 Tap connections for circuits with leakage suppression capability
10/04/2011	US8032804 Systems and methods for monitoring a memory system
10/04/2011	US8031475 Integrated circuit package system with flexible substrate and mounded package
10/04/2011	US8031282 Active matrix substrate and display device
10/04/2011	US8030785 Shadow mask deposition of materials using reconfigurable shadow masks
10/04/2011	US8030784 Semiconductor nanoparticle surface modification
10/04/2011	US8030783 Integrated circuit package with open substrate
10/04/2011	US8030782 Metal-metal bonding of compliant interconnect
10/04/2011	US8030781 Bond pad structure having dummy plugs and/or patterns formed therearound
10/04/2011	US8030780 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
10/04/2011	US8030779 Multi-layered metal interconnection
10/04/2011	US8030778 Integrated circuit structure and manufacturing method thereof
10/04/2011	US8030777 Protection of Cu damascene interconnects by formation of a self-aligned buffer layer
10/04/2011	US8030776 Integrated circuit with protective structure
10/04/2011	US8030775 Wirebond over post passivation thick metal
10/04/2011	US8030774 Imaging device equipped with a last copper and aluminum based interconnection level
10/04/2011	US8030773 Semiconductor integrated circuit device comprising different level interconnection layers connected by conductor layers including conductor layer for redundancy
10/04/2011	US8030772 Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region
10/04/2011	US8030770 Substrateless package
10/04/2011	US8030769 Grooving bumped wafer pre-underfill system
10/04/2011	US8030768 Semiconductor package with under bump metallization aligned with open vias
10/04/2011	US8030767 Bump structure with annular support
10/04/2011	US8030766 Semiconductor device
10/04/2011	US8030765 Configuration terminal for integrated devices and method for configuring an integrated device
10/04/2011	US8030764 High temperature operating package and circuit design
10/04/2011	US8030763 Semiconductor package with reduced inductive coupling between adjacent bondwire arrays
10/04/2011	US8030762 Light emitting diode package having anodized insulation layer and fabrication method therefor
10/04/2011	US8030761 Mold design and semiconductor package
10/04/2011	US8030760 Semiconductor apparatus and manufacturing method thereof
10/04/2011	US8030759 Heat conductive plate structure
10/04/2011	US8030758 Semiconductor module and method for fabricating semiconductor module
10/04/2011	US8030757 Forming a semiconductor package including a thermal interface material
10/04/2011	US8030756 Plastic ball grid array package with integral heatsink
10/04/2011	US8030755 Integrated circuit package system with a heat sink
10/04/2011	US8030754 Chip cooling channels formed in wafer bonding gap
10/04/2011	US8030753 Semiconductor device and method for making the same

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