H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/06/2011	US20110241179 Diffusion region routing for narrow scribe-line devices
10/06/2011	US20110241178 Semiconductor device and method of manufacturing the same
10/06/2011	US20110241177 Semiconductor wafer including cracking stopper structure and method of forming the same
10/06/2011	US20110241170 Monolithic semiconductor switches and method for manufacturing
10/06/2011	US20110241168 Package on package structure
10/06/2011	US20110241164 Semiconductor device and method for manufacturing same
10/06/2011	US20110241162 Semiconductor Device Comprising Metal-Based eFuses of Enhanced Programming Efficiency by Enhancing Heat Generation
10/06/2011	US20110241159 High efficiency amplifier with reduced parasitic capacitance
10/06/2011	US20110241130 Semiconductor device having a blocking structure and method of manufacturing the same
10/06/2011	US20110241125 Power Semiconductor Device with Low Parasitic Metal and Package Resistance
10/06/2011	US20110241124 SEMICONDUCTOR DEVICE COMPRISING HIGH-K METAL GATE ELECTRODE STRUCTURES AND eFUSES FORMED IN THE SEMICONDUCTOR MATERIAL
10/06/2011	US20110241119 System and method for providing alignment mark for high-k metal gate process
10/06/2011	US20110241117 Semiconductor Device Comprising Metal Gate Structures Formed by a Replacement Gate Approach and eFuses Including a Silicide
10/06/2011	US20110241099 Semiconductor device including transistor and fuse circuit and semiconductor module including the same
10/06/2011	US20110241086 Aluminum fuses in a semiconductor device comprising metal gate electrode structures
10/06/2011	US20110241082 Double-sided integrated circuit chips
10/06/2011	US20110241078 Stacked Bit Line Dual Word Line Nonvolatile Memory
10/06/2011	US20110241077 Integrated circuit 3d memory array and manufacturing method
10/06/2011	US20110241040 Novel semiconductor package with through silicon vias
10/06/2011	DE102011001405A1 Halbleiter-Kapselung und Stapel von Halbleiterkapselungen Semiconductor encapsulation and stacks of semiconductor packages
10/06/2011	DE102011001306A1 Halbleiter-Kapselung Semiconductor encapsulation
10/06/2011	DE102010016216A1 Method for wire bonding wire bonding contact region on wire bonding structure of silicon carbide junction FET of e.g. semiconductor component in e.g. integrated power switching circuit, involves cleaning wire bonding contact region
10/06/2011	DE102010013486A1 Soldered electrode for electric actuator, has stripy solder layer arranged to stripy formed net electrode part, where stripy solder layer and/or net electrode part is folded to connect stripy solder layer with net electrode
10/06/2011	DE102010013317A1 Optoelektronisches Bauteil, Gehäuse hierfür und Verfahren zur Herstellung des optoelektronischen Bauteils The optoelectronic device, the housing thereof and method for manufacturing the optoelectronic device
10/06/2011	DE102010003559A1 Halbleiterbauelement mit Metallgatestrukturen, die durch ein Austauschgateverfahren hergestellt sind, und E-Sicherung mit einem Silizid A semiconductor device with metal gate structures, which are prepared by a replacement gate method, and e-fuse with a silicide
10/06/2011	DE102010003555A1 Aluminiumsicherungen in einem Halbleiterbauelement, das Metallgateelektrodenstrukturen aufweist Comprises aluminum fuses in a semiconductor device, the metal gate electrode structures
10/06/2011	DE102010003533A1 Substrate arrangement for use in e.g. power semiconductor chip, of power semiconductor module, has wire structure bonded on bottom metallization layer, and comprising multiple bonding wire portions
10/06/2011	DE102010003454A1 Halbleiterbauelement mit Metallgateelektrodenstrukturen mit großem ε und E-Sicherungen, die in dem Halbleitermaterial hergestellt sind A semiconductor device with metal gate electrode structures with large ε and e-fuses which are produced in the semiconductor material
10/06/2011	DE102010003450A1 Halbleiterbauelement mit E-Sicherung auf Metallbasis mit verbesserter Programmiereffizienz durch Erhöhen der Wärmeerzeugung A semiconductor device with e-fuse to the metal base with improved programming efficiency by increasing the heat generation
10/05/2011	EP2373137A1 Printed circuit board unit, electronic device and method of fabricating printed circuit board
10/05/2011	EP2372767A1 Method and apparatus for forming I/O clusters in integrated circuits
10/05/2011	EP2372763A2 Power semiconductor module
10/05/2011	EP2372762A1 Compact cold plate configuration
10/05/2011	EP2372761A2 Cold plate with integral structural fluid port
10/05/2011	EP2372760A2 Compact two sided cold plate suport assembly with transfer tubes
10/05/2011	EP2372759A2 Integral cold plate and structural member
10/05/2011	EP2372758A2 Cooling device
10/05/2011	EP2372757A2 Integral cold plate and honeycomb facesheet assembly
10/05/2011	EP2372756A1 Semiconductor device and manufacturing method thereof
10/05/2011	EP2372293A2 Cooling device
10/05/2011	EP2372290A2 Compact two side cold plate support assembly with threaded inserts
10/05/2011	EP2371003A1 Power mos transistor device
10/05/2011	EP2371000A1 Method for producing lamps
10/05/2011	EP2370999A1 Telephony and digital media services device
10/05/2011	EP2370906A1 System, method, and apparatus for providing telephony and digital media services
10/05/2011	EP2370537A1 Switchable antireflective coatings
10/05/2011	EP2370510A2 Acrylic thermal conductive sheet and method for producing the same
10/05/2011	EP2370502A1 Uv-curable inorganic-organic hybrid resin and method for preparation thereof
10/05/2011	EP2030230B1 Holder for electrical component and electrical device including the holder and component
10/05/2011	EP1738127B1 Low-profile thermosyphon-based cooling system for computers and other electronic devices
10/05/2011	EP1146552B1 Interconnections to copper ICs
10/05/2011	CN202004669U Special three-phase rectifier bridge device for electric welding machine
10/05/2011	CN202004576U Motor control box and conveying device comprising same
10/05/2011	CN202004017U Junction box for solar photovoltaic power generation assembly
10/05/2011	CN202004001U Integrated diode for photovoltaic system
10/05/2011	CN202003999U High junction temperature semiconductor controlled silicon
10/05/2011	CN202003991U Discrete semiconductor paster ultrathin rectifier
10/05/2011	CN202003990U Low-cost chip fan-out structure
10/05/2011	CN202003989U Semiconductor packaging framework
10/05/2011	CN202003988U QFN (quad flat no-lead) package structure and lead frame strip thereof
10/05/2011	CN202003987U Bare copper frame with water-proof groove structure
10/05/2011	CN202003986U Lead frame with selective black oxide layer
10/05/2011	CN202003985U Directly placed, first plated, then carved single packaging structure of two-sided figure chip
10/05/2011	CN202003984U Single first-plating second-etching packaging structure of flip chip with double-sided graphs
10/05/2011	CN202003983U Interconnecting aluminium strip for packaging integrated circuit
10/05/2011	CN202003982U Chip with metal pins
10/05/2011	CN202003981U Liquid-cooling radiator for large computer central processing unit (CPU)
10/05/2011	CN202003980U Radiator structure with temperature equalizing plate
10/05/2011	CN202003979U Radiating fin fixing device
10/05/2011	CN202003978U Heating component heat-conducting base structure with diamond heat-conducting thick film
10/05/2011	CN202003977U Improved structure of radiator
10/05/2011	CN202003976U High-power insulated triode
10/05/2011	CN202003975U Circular radiator
10/05/2011	CN202003974U Ultrathin tube shell
10/05/2011	CN202003387U SIM pasting card with flipped bare chip molded by pouring sealant
10/05/2011	CN1966580B Radiation-curable silicone rubber composition
10/05/2011	CN1937067B Reconfigurable input/output in hierarchical memory link
10/05/2011	CN1913171B Light emitting device and manufacturing method
10/05/2011	CN1713468B Seal-capping for wafer-scale optoelectronic packages and preparation method thereof
10/05/2011	CN1649227B Static discharging protective circuit with two or multiple voltage supply electronic circuit
10/05/2011	CN1282106B Contact structure and semiconductor device
10/05/2011	CN102210021A Surface-mountable apparatus
10/05/2011	CN102210020A Technique for interconnecting integrated circuits
10/05/2011	CN102209459A 冷却装置 Cooling device
10/05/2011	CN102208438A Virtually substrate-less composite power semiconductor device and method
10/05/2011	CN102208435A Power semiconductor device terminal and power semiconductor device
10/05/2011	CN102208419A Method for manufacturing semiconductor device and method for manufacturing display device
10/05/2011	CN102208409A 集成电路结构 Integrated circuit structure
10/05/2011	CN102208408A Gate-drive thyristor and electrostatic protection circuit
10/05/2011	CN102208407A Composite power circuit and bidirectional thyristor
10/05/2011	CN102208404A High density integrated circuit module structure
10/05/2011	CN102208403A Half-bridge power module
10/05/2011	CN102208400A Electric power converter
10/05/2011	CN102208399A Electric power converter
10/05/2011	CN102208398A Electric power converter
10/05/2011	CN102208396A Semiconductor package part and manufacturing method thereof
10/05/2011	CN102208395A Semiconductor device and method of forming high-attenuation balanced band-pass filter
10/05/2011	CN102208394A Semiconductor device
10/05/2011	CN102208393A Semiconductor element and forming method thereof
10/05/2011	CN102208392A High-reflection and high-heat-conduction type electric component and manufacturing method thereof

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