Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/02/2014US8901744 Hybrid copper interconnect structure and method of fabricating same
12/02/2014US8901743 Fabrication of semiconductor device including chemical mechanical polishing
12/02/2014US8901742 Monolithic Power Converter Package with Through Substrate vias
12/02/2014US8901741 Interconnect structures with engineered dielectrics with nanocolumnar porosity
12/02/2014US8901739 Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
12/02/2014US8901738 Method of manufacturing an enhanced electromigration performance hetero-junction bipolar transistor
12/02/2014US8901737 Integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks
12/02/2014US8901736 Strength of micro-bump joints
12/02/2014US8901735 Connector design for packaging integrated circuits
12/02/2014US8901734 Semiconductor device and method of forming column interconnect structure to reduce wafer stress
12/02/2014US8901733 Reliable metal bumps on top of I/O pads after removal of test probe marks
12/02/2014US8901732 Semiconductor device package and method
12/02/2014US8901731 Terminal box
12/02/2014US8901730 Methods and apparatus for package on package devices
12/02/2014US8901729 Semiconductor package, packaging substrate and fabrication method thereof
12/02/2014US8901728 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
12/02/2014US8901727 Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages
12/02/2014US8901726 Package on package structure and method of manufacturing the same
12/02/2014US8901725 Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same
12/02/2014US8901724 Semiconductor package with embedded die and its methods of fabrication
12/02/2014US8901723 Electrically isolated power semiconductor package with optimized layout
12/02/2014US8901722 Semiconductor device with integral heat sink
12/02/2014US8901721 Lead frame based semiconductor die package
12/02/2014US8901720 Method for forming narrow structures in a semiconductor device
12/02/2014US8901719 Transition from a chip to a waveguide port
12/02/2014US8901718 Semiconductor package and manufacturing method thereof
12/02/2014US8901716 Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
12/02/2014US8901715 Method for manufacturing a marked single-crystalline substrate and semiconductor device with marking
12/02/2014US8901714 Transmission line formed adjacent seal ring
12/02/2014US8901707 Capacitor and register of semiconductor device, memory system including the semiconductor device, and method of manufacturing the semiconductor device
12/02/2014US8901705 3D integration of a MIM capacitor and a resistor
12/02/2014US8901702 Programmable electrical fuse with temperature gradient between anode and cathode
12/02/2014US8901701 Chip package and fabrication method thereof
12/02/2014US8901688 High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same
12/02/2014US8901671 Scalable construction for lateral semiconductor components having high current-carrying capacity
12/02/2014US8901653 Semiconductor device
12/02/2014US8901629 Semiconductor device and method of manufacturing the same
12/02/2014US8901624 Schottky diodes having metal gate electrodes and methods of formation thereof
12/02/2014US8901622 Semiconductor device and method for fabricating the same
12/02/2014US8901614 Location-related adjustment of the operating temperature distribution or power distribution of a semiconductor power component, and component for carrying out said method
12/02/2014US8901613 Semiconductor device and structure for heat removal
12/02/2014US8901610 Compound semiconductor device
12/02/2014US8901602 Power semiconductor device and power conversion system using the device
12/02/2014US8901592 Optoelectronic component and method for producing it
12/02/2014US8901588 LED devices having lenses and methods of making same
12/02/2014US8901584 Light emitting diode, light emitting diode lamp and illuminating device
12/02/2014US8901580 Package for mounting electronic components, electronic apparatus, and method for manufacturing the package
12/02/2014US8901569 Power semiconductor device
12/02/2014US8901553 Semiconductor device and manufacturing method thereof
12/02/2014US8901435 Hybrid wiring board with built-in stopper, interposer and build-up circuitry
12/02/2014US8901207 Adhesive for electronic components
12/02/2014US8900997 Method for forming a dual damascene structure of a semiconductor device, and a semiconductor device therewith
12/02/2014US8900996 Through silicon via structure and method of fabricating the same
12/02/2014US8900994 Method for producing a protective structure
12/02/2014US8900993 Semiconductor device sealed in a resin section and method for manufacturing the same
12/02/2014US8900991 Film forming method and storage medium
12/02/2014US8900990 System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections
12/02/2014US8900989 Method of fabricating an air gap using a damascene process and structure of same
12/02/2014US8900987 Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices
12/02/2014US8900986 Method to realize flux free indium bumping
12/02/2014US8900983 Structure and method for self protection of power device with expanded voltage ranges
12/02/2014US8900974 High yield substrate assembly
12/02/2014US8900971 Bonded substrate and manufacturing method thereof
12/02/2014US8900970 Method for manufacturing a semiconductor device using a flexible substrate
12/02/2014US8900969 Methods of stress balancing in gallium arsenide wafer processing
12/02/2014US8900966 Alignment for backside illumination sensor
12/02/2014US8900933 Semiconductor module, molding apparatus, and molding method
12/02/2014US8900932 Thermal enhanced package
12/02/2014US8900931 In-situ cavity integrated circuit package
12/02/2014US8900929 Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation
12/02/2014US8900928 Semiconductor device and programming method
12/02/2014US8900927 Multichip electronic packages and methods of manufacture
12/02/2014US8900924 Chip package and method for forming the same
12/02/2014US8900923 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
12/02/2014US8900921 Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
12/02/2014US8900919 Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
12/02/2014US8900894 Method of producing a radiation-emitting optoelectronic component
12/02/2014US8900893 Vertical LED chip package on TSV carrier
12/02/2014US8900885 Wafer bonding misalignment reduction
12/02/2014US8900541 Apparatus for manufacturing carbon nanotube heat sink
12/02/2014US8900478 Etchant and method for manufacturing semiconductor device using same
12/02/2014US8900473 Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP
12/02/2014US8900464 Method of making a microelectronic interconnect element with decreased conductor spacing
12/02/2014US8900040 System and method to redirect and/or reduce airflow using actuators
12/02/2014US8899469 Automatic rework processes for non-stick conditions in wire bonding operations
12/02/2014US8899307 Cooling device
12/02/2014US8898896 Method of making a connection component with hollow inserts
12/02/2014US8898892 Method of making circuit board module
12/02/2014DE202014008859U1 Wärmeableitungsvorrichtung Heat dissipation device
12/02/2014DE202013007768U1 Gehäuse für elektronische Bauteile und Kühlkörper Housing for electronic components and heat sinks
12/01/2014DE202014103704U1 Halbleiterkomponente Semiconductor component
12/01/2014DE202013007630U1 LED Beleuchtung mit thermischer und elektrischer Energierückgewinnung LED lighting with thermal and electrical energy recovery
11/2014
11/28/2014DE202014104575U1 Gestapelte mikroelektronische Chips, die in einem mikroelektronischen Substrat eingebettet sind Stacked microelectronic chips, which are embedded in a microelectronic substrate
11/27/2014US20140350195 Curable composition
11/27/2014US20140349475 Moisture barrier for a wire bond
11/27/2014US20140349462 Method for producing thin semiconductor components
11/27/2014US20140349448 Silicon-based electronics with disabling feature
11/27/2014US20140349447 Method of manufacturing semiconductor device
11/27/2014US20140349446 Methods and materials useful for chip stacking, chip and wafer bonding
11/27/2014US20140349439 Electronic device, method of manufacturing the same, and camera
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