H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/11/2011	US8035211 Integrated circuit package system with support structure under wire-in-film adhesive
10/11/2011	US8035210 Integrated circuit package system with interposer
10/11/2011	US8035209 Micromechanical device which has cavities having different internal atmospheric pressures
10/11/2011	US8035207 Stackable integrated circuit package system with recess
10/11/2011	US8035206 Self-aligning structures and method for integrated circuits
10/11/2011	US8035205 Molding compound flow controller
10/11/2011	US8035204 Large die package structures and fabrication method therefor
10/11/2011	US8035203 Radio frequency over-molded leadframe package
10/11/2011	US8035202 Electronic device having a wiring substrate
10/11/2011	US8035201 Reliable interconnection
10/11/2011	US8035200 Neutralization of trapped charge in a charge accumulation layer of a semiconductor structure
10/11/2011	US8035198 Through wafer via and method of making same
10/11/2011	US8035197 Electronic device and method for fabricating the same
10/11/2011	US8035194 Semiconductor device and semiconductor package including the same
10/11/2011	US8035186 Low-noise semiconductor photodetectors
10/11/2011	US8035179 Packaged microelectronic imagers and methods of packaging microelectronic imagers
10/11/2011	US8035162 System and method for ESD protection
10/11/2011	US8035135 Semiconductor memory device
10/11/2011	US8035134 Forward body bias-controlled semiconductor integrated circuit
10/11/2011	US8035105 Solid state image pickup device and method of producing solid state image pickup device
10/11/2011	US8035040 Electrical junction box provided with electric current sensor
10/11/2011	US8035026 Thermoelectric material, thermoelectric element, thermoelectric module and methods for manufacturing the same
10/11/2011	US8034715 Method of fabricating semiconductor integrated circuit device
10/11/2011	US8034711 Bonding structure and fabrication thereof
10/11/2011	US8034703 Semiconductor device and method for manufacturing the same
10/11/2011	US8034658 Electronic module with a conductive-pattern layer and a method of manufacturing same
10/11/2011	US8034643 Method for fabrication of a semiconductor device
10/11/2011	US8033446 Manufacturing method of solid-state image pickup device
10/11/2011	US8033397 Cover tape for packaging semiconductor device and package for semiconductor device
10/11/2011	US8033218 Printing device, production unit, and production method of electronic parts
10/11/2011	CA2568630C Heat exchange device and method
10/11/2011	CA2474740C Thermal management materials having a phase change dispersion
10/06/2011	WO2011123442A1 Fabricating voids using slurry protect coat before chemical-mechanical polishing
10/06/2011	WO2011123220A2 Packaging process to create wettable lead flank during board assembly
10/06/2011	WO2011122665A1 Leadframe or substrate for led, semiconductor device, and method for manufacturing leadframe or substrate for led
10/06/2011	WO2011122502A1 Noise suppression structure
10/06/2011	WO2011122311A1 High-frequency circuit board
10/06/2011	WO2011122232A1 Metal support flexible board, metal support carrier tape for tape automated bonding using same, metal support flexible circuit board for mounting led, and copper foil-laminated metal support flexible circuit board for forming circuit
10/06/2011	WO2011122228A1 Substrate with built-in semiconductor
10/06/2011	WO2011122211A1 Method for fabricating resin composition for sealing semiconductors, and pulverizer
10/06/2011	WO2011122206A1 Method for manufacturing laminated body, and laminated body
10/06/2011	WO2011122202A1 Device and method for manufacturing molded objects
10/06/2011	WO2011122182A1 Anti-fuse module
10/06/2011	WO2011121879A1 Semiconductor device
10/06/2011	WO2011121686A1 Method for manufacturing wafer-bonded semiconductor device
10/06/2011	WO2011120770A1 Led module and manufacturing method thereof
10/06/2011	WO2011120752A1 Device for cooling, and method for the production thereof
10/06/2011	WO2011120389A1 Semiconductor package and method of manufacturing the same
10/06/2011	WO2011120236A1 Power amplifier fixing device and communication equipment
10/06/2011	WO2011093955A3 Dual carrier for joining ic die or wafers to tsv wafers
10/06/2011	US20110246746 Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same
10/06/2011	US20110244651 Method and device for alternately contacting two wafers
10/06/2011	US20110242870 Stacked memory and devices including the same
10/06/2011	US20110241229 Encapsulated nanoparticles
10/06/2011	US20110241228 Epoxy resin composition for sealing packing of semiconductor, semiconductor device, and manufacturing method thereof
10/06/2011	US20110241227 Liquid resin composition and semiconductor device
10/06/2011	US20110241226 Method for producing a microfluid component, as well as microfluid component
10/06/2011	US20110241225 Semiconductor memory device
10/06/2011	US20110241224 Wire bonding structure of semiconductor device and wire bonding method
10/06/2011	US20110241223 Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
10/06/2011	US20110241222 Semiconductor Package and Manufacturing Method
10/06/2011	US20110241221 Semiconductor device with improved resin configuration
10/06/2011	US20110241220 Air gaps in a multilayer integrated circuit and method of making same
10/06/2011	US20110241219 Semiconductor device and method for manufacturing the same
10/06/2011	US20110241218 Electronic Device and Manufacturing Method
10/06/2011	US20110241217 Multi-Layer Interconnect Structure for Stacked Dies
10/06/2011	US20110241216 Semiconductor device
10/06/2011	US20110241215 Embedded semiconductive chips in reconstituted wafers, and systems containing same
10/06/2011	US20110241214 Virtually Substrate-less Composite Power Semiconductor Device and Method
10/06/2011	US20110241213 Silicide Contact Formation
10/06/2011	US20110241212 Stress layer structure
10/06/2011	US20110241211 Method of manufacturing a semiconductor device and semiconductor device
10/06/2011	US20110241210 Composition for sealing semiconductor, semiconductor device, and process for producing semiconductor device
10/06/2011	US20110241209 Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power
10/06/2011	US20110241208 Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same
10/06/2011	US20110241207 Dummy shoulder structure for line stress reduction
10/06/2011	US20110241206 Semiconductor device
10/06/2011	US20110241205 Semiconductor with through-substrate interconnect
10/06/2011	US20110241204 Semiconductor device
10/06/2011	US20110241203 Semiconductor module, method for manufacturing semiconductor module, and portable apparatus
10/06/2011	US20110241202 Dummy Metal Design for Packaging Structures
10/06/2011	US20110241201 Radiate Under-Bump Metallization Structure for Semiconductor Devices
10/06/2011	US20110241200 Ultra low dielectric constant material with enhanced mechanical properties
10/06/2011	US20110241199 Programmable system in package
10/06/2011	US20110241198 Power Semiconductor Module
10/06/2011	US20110241197 Device and Method for Manufacturing a Device
10/06/2011	US20110241196 Compliant spring interposer for wafer level three dimensional (3d) integration and method of manufacturing
10/06/2011	US20110241195 Forming in-situ micro-feature structures with coreless packages
10/06/2011	US20110241194 Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof
10/06/2011	US20110241193 Semiconductor Device Packages with Fan-Out and with Connecting Elements for Stacking and Manufacturing Methods Thereof
10/06/2011	US20110241192 Wafer-Level Semiconductor Device Packages with Stacking Functionality
10/06/2011	US20110241190 Semiconductor Package
10/06/2011	US20110241189 Apparatus for and methods of attaching heat slugs to package tops
10/06/2011	US20110241188 Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
10/06/2011	US20110241187 Lead frame with recessed die bond area
10/06/2011	US20110241186 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
10/06/2011	US20110241185 Signal shielding through-substrate vias for 3d integration
10/06/2011	US20110241183 Stacked chip package with redistribution lines
10/06/2011	US20110241182 Die seal ring
10/06/2011	US20110241180 Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip package

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