H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/12/2011	CN202008999U Power MOS bridge-type circuit
10/12/2011	CN202008998U High-power optical coupling isolated drive module
10/12/2011	CN202008995U Upright-array type water-cooled radiator
10/12/2011	CN202008994U Loop heat pipe structure
10/12/2011	CN202008993U Novel elastic connecting piece for fixing fan
10/12/2011	CN202008992U Conical column water cooling radiator for power semiconductor devices
10/12/2011	CN202008991U Integrated circuit heat radiator
10/12/2011	CN202008990U Combined structure of heat pipe and heat conductor
10/12/2011	CN1913044B Thick film conductor composition, and its use in ltcc circuit and device
10/12/2011	CN102217070A Semiconductor device and method for producing same
10/12/2011	CN102217064A Millimetre-wave radio antenna module
10/12/2011	CN102217063A Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same
10/12/2011	CN102217062A Pre-molded, clip-bonded multi-die semiconductor package
10/12/2011	CN102217061A Improved wafer level chip scale packaging
10/12/2011	CN102217060A Flexible and stackable semiconductor die packages, systems using the same, and methods of making the same
10/12/2011	CN102217059A Insulating ring, insulating assembly and package for packaging
10/12/2011	CN102215658A Radiating device combination and electronic device using same
10/12/2011	CN102215639A Semiconductor chip built-in wiring board and manufacturing method thereof
10/12/2011	CN102214915A Electrostatic discharge protection circuit
10/12/2011	CN102214699A Method for manufacturing display device
10/12/2011	CN102214691A Groove metal oxide semiconductor field effect tube (MOSFET) and manufacturing method thereof
10/12/2011	CN102214656A Circuit structure of ultrahigh voltage level shifter
10/12/2011	CN102214642A Combined type high-power semiconductor chip
10/12/2011	CN102214641A Wafer-level semiconductor device packages with stacking functionality
10/12/2011	CN102214640A Semiconductor device
10/12/2011	CN102214639A Tag for semiconductor package structure
10/12/2011	CN102214638A Integrated circuit 3D memory array and manufacturing method
10/12/2011	CN102214637A Line structure, semiconductor integrated circuit having line structure and design method
10/12/2011	CN102214636A Framework of SMD (Surface Mount Device) type diode
10/12/2011	CN102214635A Semiconductor package structure and manufacturing method thereof
10/12/2011	CN102214634A Aluminium bracket for packing infrared receiver
10/12/2011	CN102214633A Copper band for lead frame
10/12/2011	CN102214632A Lead frame for replacing lead frame of fusion structure
10/12/2011	CN102214631A Lead frame for semiconductor device
10/12/2011	CN102214630A Silver-base microalloy bonding wire and preparation method thereof
10/12/2011	CN102214629A Semiconductor device and storage card
10/12/2011	CN102214628A Package substrate and fabricating method thereof
10/12/2011	CN102214627A Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
10/12/2011	CN102214626A Built-in type semiconductor package and manufacturing method thereof
10/12/2011	CN102214625A Semiconductor wafer electrode structure and manufacturing method thereof
10/12/2011	CN102214624A Semiconductor structure with through holes and manufacturing method thereof
10/12/2011	CN102214623A Chip package and method for forming the same
10/12/2011	CN102214622A 功率半导体模块 Power semiconductor module
10/12/2011	CN102214621A Semiconductor device package and method of manufacturing same
10/12/2011	CN102214620A Semiconductor substrate having copper/diamond composite material and method of making same
10/12/2011	CN102214619A Light emitting device module
10/12/2011	CN102214618A Semiconductor device and method of manufacturing the same
10/12/2011	CN102214617A Semiconductor package substrates
10/12/2011	CN102214616A Metal conductive structure and manufacturing method thereof
10/12/2011	CN102214615A Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
10/12/2011	CN102214614A Chip package body
10/12/2011	CN102214600A Method for reducing electromigration of copper in copper interconnection structure and copper interconnection structure
10/12/2011	CN102214576A Semiconductor device and manufacturing method thereof
10/12/2011	CN102214551A Method for monitoring formation process of metallic silicide layer
10/12/2011	CN102212249A Epoxy resin composition and semiconductor device
10/12/2011	CN102211984A Epoxy molding compound, epoxy resin and preparation methods thereof
10/12/2011	CN101814491B IC circuit with fuse and a system thereof
10/12/2011	CN101771015B Wafer structure and wafer packaging structure
10/12/2011	CN101546731B Vertical channel transistor in semiconductor device and method of fabricating the same
10/12/2011	CN101533814B Chip-level flip chip package structure
10/12/2011	CN101506972B An integrated circuit device having at least one bond pad with a selectable plurality of input-output functionalities
10/12/2011	CN101419949B Circuit apparatus and method of manufacturing the same
10/12/2011	CN101408688B Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
10/12/2011	CN101399272B Thin-film transistor array substrate
10/12/2011	CN101369572B Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same
10/12/2011	CN101364575B Semiconductor device
10/12/2011	CN101290920B 半导体装置 Semiconductor device
10/12/2011	CN101236910B Method for electrically connecting semiconductor member to substrate and semiconductor structure
10/12/2011	CN101217118B Methods for fabricating silicon carriers with conductive through-vias and its produced semiconductor
10/12/2011	CN101154672B Semiconductor device
10/12/2011	CN101118940B Built crystal substrate and liquid built crystal growing method
10/11/2011	US8037445 System for and method of controlling a VLSI environment
10/11/2011	US8036629 Methods of operating electronic devices, and methods of providing electronic devices
10/11/2011	US8036628 Wireless communication system
10/11/2011	US8035781 Liquid crystal display device
10/11/2011	US8035238 Driving circuit and liquid crystal display device including the same
10/11/2011	US8035237 Integrated circuit package system with heat slug
10/11/2011	US8035236 Semiconductor device comprising high performance encapsulation resins
10/11/2011	US8035235 Integrated circuit packaging system with package-on-package and method of manufacture thereof
10/11/2011	US8035234 Wiring substrate, manufacturing method thereof, and semiconductor device
10/11/2011	US8035232 Semiconductor device including interconnects, vias connecting the interconnects and greater thickness of the liner film adjacent the vias
10/11/2011	US8035231 Semiconductor device and method of manufacturing the same
10/11/2011	US8035230 Semiconductor device and method for manufacturing same
10/11/2011	US8035228 High-density 3-dimensional resistors
10/11/2011	US8035227 Top layers of metal for high performance IC's
10/11/2011	US8035226 Wafer level package integrated circuit incorporating solder balls containing an organic plastic-core
10/11/2011	US8035225 Semiconductor chip assembly and fabrication method therefor
10/11/2011	US8035224 Semiconductor device
10/11/2011	US8035223 Structure and process for electrical interconnect and thermal management
10/11/2011	US8035222 Semiconductor device
10/11/2011	US8035221 Clip mount for integrated circuit leadframes
10/11/2011	US8035220 Semiconductor packaging device
10/11/2011	US8035219 Packaging semiconductors at wafer level
10/11/2011	US8035218 Microelectronic package and method of manufacturing same
10/11/2011	US8035217 Semiconductor device and method for manufacturing same
10/11/2011	US8035216 Integrated circuit package and method of manufacturing same
10/11/2011	US8035215 Semiconductor device and manufacturing method of the same
10/11/2011	US8035214 Conductive connecting pin for package substance
10/11/2011	US8035213 Chip package structure and method of manufacturing the same
10/11/2011	US8035212 Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic device

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