H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/18/2011	US8039837 In-line voltage contrast detection of PFET silicide encroachment
10/18/2011	US8039757 Electronic part mounting substrate and method for producing same
10/18/2011	US8039395 Technique for forming embedded metal lines having increased resistance against stress-induced material transport
10/18/2011	US8039367 Scribe line structure and method for dicing a wafer
10/18/2011	US8039366 Method for providing rotationally symmetric alignment marks for an alignment system that requires asymmetric geometric layout
10/18/2011	US8039365 Integrated circuit package system including wafer level spacer
10/18/2011	US8039363 Small chips with fan-out leads
10/18/2011	US8039359 Method of forming low capacitance ESD device and structure therefor
10/18/2011	US8039343 Scratch protection for direct contact sensors
10/18/2011	US8039320 Optimized circuit design layout for high performance ball grid array packages
10/18/2011	US8039317 Aluminum leadframes for semiconductor QFN/SON devices
10/18/2011	US8039316 Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof
10/18/2011	US8039313 Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate
10/18/2011	US8039310 Method of manufacturing semiconductor device with improved design freedom of external terminal
10/18/2011	US8039307 Mounted body and method for manufacturing the same
10/18/2011	US8039306 3D integration of vertical components in reconstituted substrates
10/18/2011	US8039303 Method of forming stress relief layer between die and interconnect structure
10/18/2011	US8037925 Heat exchanger having integrated tank header and partition structure and partition inserting groove with leak detection
10/14/2011	DE202011005548U1 Kühlvorrichtung Cooler
10/13/2011	WO2011127416A2 Improved mechanical support for a thin-film thermoelectric cooling device
10/13/2011	WO2011126973A2 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
10/13/2011	WO2011126682A1 Self-aligned contacts for field effect transistor devices
10/13/2011	WO2011126516A1 Stacked dual inductor structure
10/13/2011	WO2011126457A1 Light emtting diode (led) light
10/13/2011	WO2011125935A1 Semiconductor device and manufacturing method thereof
10/13/2011	WO2011125928A1 Semiconductor device and method for manufacturing same
10/13/2011	WO2011125874A1 Mounting board and method for manufacturing a mounting board
10/13/2011	WO2011125802A1 Wiring structure, display device and semiconductor device
10/13/2011	WO2011125753A1 Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode
10/13/2011	WO2011125752A1 Method of forming microstructures, laser irradiation device, and substrate
10/13/2011	WO2011125741A1 Membrane wiring board
10/13/2011	WO2011125624A1 Epoxy resin based molding material for use in sealing, and electronic components and devices
10/13/2011	WO2011125546A1 Interposer and electronic device using same
10/13/2011	WO2011125519A1 Base of surface-mount-type electronic component-use package, and surface-mount-type electronic component-use package
10/13/2011	WO2011125463A1 Sealant for optical semiconductors and optical semiconductor device
10/13/2011	WO2011125441A1 Magnesium-based composite member, heat dissipation member, and semiconductor device
10/13/2011	WO2011125414A1 Electronic component and method for producing same
10/13/2011	WO2011125380A1 Wiring substrate incorporating semiconductor element
10/13/2011	WO2011125354A1 Substrate with built-in functional element
10/13/2011	WO2011125344A1 Substrate and method for manufacturing substrate
10/13/2011	WO2011124091A1 Silicon wafer alignment method applied to through silicon via interconnection
10/13/2011	WO2011093956A3 Protruding tsv tips for enhanced heat dissipation for ic devices
10/13/2011	WO2011090570A3 Semiconductor package with embedded die and its methods of fabrication
10/13/2011	WO2011081844A3 Patch on interposer assembly and structures formed thereby
10/13/2011	WO2011059205A3 Lead frame and manufacturing method of the same
10/13/2011	US20110250717 Solid-state imaging device and method for manufacturing the same
10/13/2011	US20110250710 Electrical alignment mark set and method for aligning wafer stack
10/13/2011	US20110249484 Semiconductor memory device
10/13/2011	US20110249407 Power semiconductor module
10/13/2011	US20110248412 Chip identification for organic laminate packaging and methods of manufacture
10/13/2011	US20110248411 Integrated circuit package in package system
10/13/2011	US20110248409 Method for Stacking Semiconductor Dies
10/13/2011	US20110248408 Package substrate and fabricating method thereof
10/13/2011	US20110248407 Process For Making a Semiconductor System
10/13/2011	US20110248406 Method of Manufacturing Semiconductor Device
10/13/2011	US20110248405 Selective Patterning for Low Cost through Vias
10/13/2011	US20110248404 Dummy Pattern in Wafer Backside Routing
10/13/2011	US20110248403 Dual-Side Interconnected CMOS For Stacked Integrated Circuits
10/13/2011	US20110248402 Semiconductor device and method for manufacturing the same
10/13/2011	US20110248401 Nanotube-based electrodes
10/13/2011	US20110248399 Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate
10/13/2011	US20110248398 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
10/13/2011	US20110248397 Semiconductor device having stacked components
10/13/2011	US20110248396 Bow-balanced 3d chip stacking
10/13/2011	US20110248395 Semiconductor device
10/13/2011	US20110248394 Leadframe package for high-speed data rate applications
10/13/2011	US20110248393 Lead frame for semiconductor device
10/13/2011	US20110248392 Ball-Grid Array Device Having Chip Assembled on Half-Etched metal Leadframe
10/13/2011	US20110248391 Integrated circuit package stacking system with lead overlap and method of manufacture thereof
10/13/2011	US20110248390 Lead frame for semiconductor package
10/13/2011	US20110248389 Semiconductor device and manufacturing method thereof
10/13/2011	US20110248388 Multi-layer chip overlay target and measurement
10/13/2011	US20110248387 Semiconductor integrated circuit and pattern layouting method for the same
10/13/2011	US20110248385 Method for selectively forming symmetrical or asymmetrical features using a symmetrical photomask during fabrication of a semiconductor device and electronic systems including the semiconductor device
10/13/2011	US20110248383 Electrostatic discharge (esd) protection circuit
10/13/2011	US20110248379 Semiconductor device and method for manufacturing the same
10/13/2011	US20110248378 Semiconductor device
10/13/2011	US20110248357 Integrated circuit devices including device isolation structures and methods of fabricating the same
10/13/2011	US20110248318 Method and apparatus for configurable systems
10/13/2011	US20110248280 Transistor having thermo electron cooling
10/13/2011	US20110248263 Integrated circuits having backside test structures and methods for the fabrication thereof
10/13/2011	US20110248137 Methods and Apparatus for Mounting Solar Panels
10/13/2011	US20110247874 Adhesive for bonding circuit members, circuit board and process for its production
10/13/2011	US20110247873 Adhesive for bonding circuit members, circuit board and process for its production
10/13/2011	US20110247867 Adhesive for bonding circuit members, circuit board and process for its production
10/13/2011	US20110247690 Semiconductor devices comprising antireflective conductive layers and methods of making and using
10/13/2011	DE102011005690A1 Leistungshalbleitermodul The power semiconductor module
10/12/2011	EP2375444A1 Semiconductor device, method for producing the same, millimeter-wave dielectric transmission device, method for producing the same, and millimeter-wave dielectric transmission system
10/12/2011	EP2375219A1 Inertial sensor and method for manufacturing the same
10/12/2011	EP2374335A1 Flexible electronic product and method for manufacturing the same
10/12/2011	EP2374150A1 Heat exchangers and related methods
10/12/2011	EP2276606B1 Method of manufacturing a heat exchanger
10/12/2011	EP2193544B1 Device for cooling electronic components
10/12/2011	EP2156465B1 Electrical interconnect structure and method of forming the same
10/12/2011	EP2086295B1 Printed circuit board and method of manufacturing the same
10/12/2011	EP2061290B1 Ceramic substrate manufacturing method and ceramic substrate
10/12/2011	EP1364404B1 Hollow structure in an integrated circuit and method for producing such a hollow structure in an integrated circuit
10/12/2011	DE202011105366U1 Befestigung eines Kühlelements Attachment of a cooling element
10/12/2011	DE202011050935U1 Schleifen-Wärmerohr-Anordnung Loop heat pipe assembly
10/12/2011	CN202009341U High-voltage high-power inverter module

1 ... 447 448 449 450 451 452 453 454 455 456 457 458 459 460 461 462 463 464 465 466 467 ... 2262