H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/19/2011	CN102224587A Lead frame, semiconductor device using the lead frame, intermediate product thereof, and methods for producing same
10/19/2011	CN102224586A Structure and manufacture method for multi-row lead frame and semiconductor package
10/19/2011	CN102224584A Electronic component package and electronic component package manufacturing method
10/19/2011	CN102224583A Methods for protecting a die surface with photocurable materials
10/19/2011	CN102224579A Semiconductor device and electronic device
10/19/2011	CN102224577A Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device
10/19/2011	CN102224567A Integrated capacitor with grid plates
10/19/2011	CN102224566A Integrated capacitor with alternating layered segments
10/19/2011	CN102224565A Integrated capacitor with array of crosses
10/19/2011	CN102224536A Substrate for display panel, and display panel
10/19/2011	CN102223757A Wiring board and method for manufacturing wiring board
10/19/2011	CN102223756A Method for producing an electrically conductive connection between a contact and a counter contact
10/19/2011	CN102223121A Drive unit of electric motor and motorized equipment using the drive unit
10/19/2011	CN102223082A Regulator assembly of rectifying bridge of automobile AC (alternating-current) generator with vacuum pump
10/19/2011	CN102222676A Solid-state image pickup device and electronic apparatus
10/19/2011	CN102222668A Semiconductor device and method for forming the same
10/19/2011	CN102222664A High-current high-voltage high-frequency high-performance IGBT (Insulated Gate Bipolar Transistor) module
10/19/2011	CN102222663A Stack package having flexible conductors
10/19/2011	CN102222662A Packaging structure for electrostatic protection by using point discharge
10/19/2011	CN102222661A Electrical alignment mark set and method for aligning wafer stack
10/19/2011	CN102222660A Double-lead-frame multi-chip common package body and manufacturing method thereof
10/19/2011	CN102222659A 半导体集成电路 The semiconductor integrated circuit
10/19/2011	CN102222658A Multi-circle arranged IC (integrated circuit) chip packaging member and producing method thereof
10/19/2011	CN102222657A Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof
10/19/2011	CN102222656A Leadframe package for high-speed data rate applications
10/19/2011	CN102222655A Chip adapter plate
10/19/2011	CN102222654A Semiconductor device with through substrate via and its production method
10/19/2011	CN102222653A Dimpling block structure
10/19/2011	CN102222652A Power semiconductor module with connection elements
10/19/2011	CN102222651A TSVs with different sizes in interposers for bonding dies
10/19/2011	CN102222650A Electronic element packaging body and formation method thereof
10/19/2011	CN102222649A Adhesive composition,circuit connecting material, connection structure of circuit connectors and semiconductor devices
10/19/2011	CN102222648A Chip area optimized pads
10/19/2011	CN102222647A Semiconductor die and method of manufacturing semiconductor feature
10/19/2011	CN102222643A Method for filling redundant metal in manufacturing process of integrated circuit and semiconductor device
10/19/2011	CN102222642A Integrated circuit system with stress redistribution layer
10/19/2011	CN102222630A Method for preparing Sn-Ag-In ternary lead-free flip salient point
10/19/2011	CN102222629A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/19/2011	CN102222622A Semiconductor device and manufacturing method for semiconductor device
10/19/2011	CN102222621A Method for combining heat-radiating fins of heat radiator with heat pipe and heat radiator thereof
10/19/2011	CN102222609A Impurity concentration distribution control method of semiconductor component and related semiconductor component
10/19/2011	CN102222601A Method for enhancing sharpness of wafer ID
10/19/2011	CN101958304B Double-side graph chip direct-put module package structure and package method thereof
10/19/2011	CN101826502B Island-exposed and submerged island-exposed type lead frame structure and method for sequentially etching and plating
10/19/2011	CN101807561B Electronic element
10/19/2011	CN101719487B Inverted packaging device of monolithic integration switching-type regulator and its packaging method
10/19/2011	CN101681898B Structure for cooling semiconductor element
10/19/2011	CN101656250B Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates
10/19/2011	CN101582421B Testable electrostatic discharge protection circuit
10/19/2011	CN101510037B LCD panel
10/19/2011	CN101482918B Finger print detection device
10/18/2011	US8040674 Heat dissipation module and fan thereof
10/18/2011	US8040148 System in package with built-in test-facilitating circuit
10/18/2011	US8040145 Miniature fluid-cooled heat sink with integral heater
10/18/2011	US8039975 Device comprising a semiconductor component, and a manufacturing method
10/18/2011	US8039974 Assembly of electronic components
10/18/2011	US8039973 Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module
10/18/2011	US8039972 Printed circuit board and method thereof and a solder ball land and method thereof
10/18/2011	US8039971 Electronic circuit arrangement
10/18/2011	US8039970 Stacked semiconductor device and method of manufacturing the same
10/18/2011	US8039969 Semiconductor device
10/18/2011	US8039968 Semiconductor integrated circuit device
10/18/2011	US8039967 Wiring substrate with a wire terminal
10/18/2011	US8039964 Fluorine depleted adhesion layer for metal interconnect structure
10/18/2011	US8039963 Semiconductor device having seal ring structure
10/18/2011	US8039962 Semiconductor chip, method of fabricating the same and stack package having the same
10/18/2011	US8039961 Composite carbon nanotube-based structures and methods for removing heat from solid-state devices
10/18/2011	US8039960 Solder bump with inner core pillar in semiconductor package
10/18/2011	US8039959 Microelectronic connection component
10/18/2011	US8039955 Mold lock on heat spreader
10/18/2011	US8039953 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
10/18/2011	US8039951 Thermally enhanced semiconductor package and method of producing the same
10/18/2011	US8039950 Solder material lining a cover wafer attached to wafer substrate
10/18/2011	US8039949 Ball grid array package having one or more stiffeners
10/18/2011	US8039948 Device mounting board and semiconductor apparatus using the same
10/18/2011	US8039947 Integrated circuit package system with different mold locking features
10/18/2011	US8039946 Chip package structure and fabricating method thereof
10/18/2011	US8039945 Plastic electronic component package
10/18/2011	US8039944 Electrical connection device and assembly method thereof
10/18/2011	US8039943 Semiconductor device and manufacturing method therefor
10/18/2011	US8039942 Ball grid array package stacking system
10/18/2011	US8039941 Circuit board, lead frame, semiconductor device, and method for fabricating the same
10/18/2011	US8039940 Semiconductor storage device, semiconductor device, and manufacturing method therefor
10/18/2011	US8039939 Embedded wiring board, semiconductor package including the same and method of fabricating the same
10/18/2011	US8039938 Airgap micro-spring interconnect with bonded underfill seal
10/18/2011	US8039937 Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
10/18/2011	US8039936 Semiconductor device
10/18/2011	US8039935 Wafer level chip scale packaging structure and method of fabricating the same
10/18/2011	US8039934 Resin-encapsulated semiconductor device and its manufacturing method
10/18/2011	US8039933 QFN semiconductor package
10/18/2011	US8039932 Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor device
10/18/2011	US8039931 Power semiconductor component having a topmost metallization layer
10/18/2011	US8039930 Package structure for wireless communication module
10/18/2011	US8039929 Asymmetrically stressed CMOS FinFET
10/18/2011	US8039928 Chip stack package
10/18/2011	US8039925 Integrated radio frequency circuits
10/18/2011	US8039924 Semiconductor device including capacitor element provided above wiring layer that includes wiring with an upper surface having protruding portion
10/18/2011	US8039899 Electrostatic discharge protection device
10/18/2011	US8039883 Solid-state image pickup device and method for manufacturing same
10/18/2011	US8039852 Thin film transistor for a liquid crystal device in which a sealing pattern is electrically connected to a common electrode wiring

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