H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/20/2011	WO2011130748A2 Heat transporting unit, electronic circuit board and electronic device
10/20/2011	WO2011130717A2 Forming functionalized carrier structures with coreless packages
10/20/2011	WO2011130693A2 Method for fabricating through-substrate microchannels
10/20/2011	WO2011130252A2 Ball-grid array device having chip assembled on half-etched metal leadframe
10/20/2011	WO2011129360A1 Capacitor and method for producing same
10/20/2011	WO2011129307A1 Method for manufacturing infrared sensor
10/20/2011	WO2011129272A1 Attachment material for semiconductor chip bonding, attachment film for semiconductor chip bonding, semiconductor device manufacturing method, and semiconductor device
10/20/2011	WO2011127931A1 A flow distributor
10/20/2011	WO2011127636A1 Surface mount device thin package
10/20/2011	WO2011127568A1 High density gallium nitride devices using island topology
10/20/2011	WO2011090568A3 Recessed and embedded die coreless package
10/20/2011	WO2011087591A3 Multiple surface finishes for microelectronic package substrates
10/20/2011	WO2011082241A3 Microelectromechanical system having movable element integrated into leadframe-based package
10/20/2011	WO2011081831A3 Hermetic electrical feedthrough
10/20/2011	WO2011080336A3 Graphite-containing moulded body and method for the production thereof
10/20/2011	WO2011080334A3 Layered composite material for use in a redox flow battery
10/20/2011	US20110256663 High Speed, High Density, Low Power Die Interconnect System
10/20/2011	US20110255960 Specialty pump with heat exchanger and system
10/20/2011	US20110254178 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device
10/20/2011	US20110254177 Power electronic package having two substrates with multiple semiconductor chips and electronic components
10/20/2011	US20110254176 Dicing tape-integrated film for semiconductor back surface
10/20/2011	US20110254175 Semiconductor memory device
10/20/2011	US20110254174 Semiconductor device
10/20/2011	US20110254173 Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street
10/20/2011	US20110254172 Package-on-package system with through vias and method of manufacture thereof
10/20/2011	US20110254171 Integrated Method for High-Density Interconnection of Electronic Components through Stretchable Interconnects
10/20/2011	US20110254170 Semiconductor device
10/20/2011	US20110254169 Semiconductor device with through substrate via
10/20/2011	US20110254168 Integrated circuit interconnect structure
10/20/2011	US20110254167 Stack package having flexible conductors
10/20/2011	US20110254166 Chip Area Optimized Pads
10/20/2011	US20110254165 Semiconductor integrated circuit device and production method thereof
10/20/2011	US20110254164 Self-aligned barrier layers for interconnects
10/20/2011	US20110254163 Sleeve insulators and semiconductor device including the same
10/20/2011	US20110254162 High Speed, High Density, Low Power Die Interconnect System
10/20/2011	US20110254161 Integrated Circuit Package Having Under-Bump Metallization
10/20/2011	US20110254160 TSVs with Different Sizes in Interposers for Bonding Dies
10/20/2011	US20110254159 Conductive feature for semiconductor substrate and method of manufacture
10/20/2011	US20110254158 Mask Programmable Interface Selection
10/20/2011	US20110254157 Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
10/20/2011	US20110254156 Semiconductor Device and Method of Wafer Level Package Integration
10/20/2011	US20110254155 Wafer Level Die Integration and Method Therefor
10/20/2011	US20110254154 Routing layer for mitigating stress in a semiconductor die
10/20/2011	US20110254153 Die structure and die connecting method
10/20/2011	US20110254152 Chip structure, chip bonding structure using the same, and manufacturing method thereof
10/20/2011	US20110254151 Method for fabricating bump structure without ubm undercut
10/20/2011	US20110254150 Method of Manufacturing a Semiconductor Device
10/20/2011	US20110254149 Semiconductor component and manufacturing method of semiconductor component
10/20/2011	US20110254148 Semiconductor apparatus
10/20/2011	US20110254147 Semiconductor equipment and method of manufacturing the same
10/20/2011	US20110254146 Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape
10/20/2011	US20110254144 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
10/20/2011	US20110254143 Chip package structure and method of making the same
10/20/2011	US20110254139 Cmp-first damascene process scheme
10/20/2011	US20110254138 Low-temperature absorber film and method of fabrication
10/20/2011	US20110254136 Semiconductor device
10/20/2011	US20110254124 Forming functionalized carrier structures with coreless packages
10/20/2011	US20110254123 Ultra high speed signal transmission/reception
10/20/2011	US20110254122 Semiconductor device and manufacturing method thereof
10/20/2011	US20110254121 Programmable anti-fuse structures with conductive material islands
10/20/2011	US20110254117 Electrical Devices Including Dendritic Metal Electrodes
10/20/2011	US20110254087 Semiconductor device and a method of manufacturing the same
10/20/2011	US20110254049 Semiconductor device
10/20/2011	US20110254001 High performance sub-system design and assembly
10/20/2011	US20110254000 Semiconductor chip embedded with a test circuit
10/20/2011	US20110253999 Semiconductor wafer having scribe line test modules including matching portions from subcircuits on active die
10/20/2011	US20110253432 Method and Apparatus for Providing Hermetic Electrical Feedthrough
10/20/2011	US20110253306 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
10/20/2011	US20110253190 Solar panel mounting bracket and solar panel mounting system
10/20/2011	US20110252641 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
10/20/2011	DE102010027932A1 Verbundbauteil und Verfahren zum Herstellen eines Verbundbauteils Composite component and method of manufacturing a composite component
10/20/2011	DE102010014940A1 Leistungshalbleitermodul mit Anschlusselementen Power semiconductor module with connecting elements
10/20/2011	CA2796155A1 High density gallium nitride devices using island topology
10/19/2011	EP2378616A1 High-power semiconductor laser and method for manufacturing the same
10/19/2011	EP2378551A2 Micro pin hybrid interconnect array and method of manufacturing same
10/19/2011	EP2378550A1 Leadless IC package and manufacturing method thereof
10/19/2011	EP2378547A1 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, and three-dimensional structure, on the surface of which wiring is provided and fabrication method thereof
10/19/2011	EP2378389A2 Heat dissipation system and heat dissipation method
10/19/2011	EP2377839A1 Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module
10/19/2011	EP2377173A1 Aligned multiple emitter package
10/19/2011	EP2377172A1 Method for producing an optoelectronic component and optoelectronic component
10/19/2011	EP2377155A1 System and method for isolated nmos-based esd clamp cell
10/19/2011	EP2376903A1 An arrangement related to a gas sensor
10/19/2011	EP2376835A1 Light emitting diode luminaire
10/19/2011	EP1997777B1 Silica powder and use thereof
10/19/2011	EP1728278B1 Heat exchanger
10/19/2011	CN202014432U Aluminum alloy stepped heat conduction fin radiator
10/19/2011	CN202013887U High-accuracy voltage-stabilizing tube capable of realizing transient voltage suppressor (TVS) function
10/19/2011	CN202013880U Liquid-cooled radiator
10/19/2011	CN202013879U Heat radiation device and fan fixing frame structure thereof
10/19/2011	CN202013878U Electronic device possessing heat dissipation function
10/19/2011	CN202013877U Multi-pipe heat conducting pipe heat radiation structure
10/19/2011	CN202013876U Radiating structure for aluminum tube heat conducting tube
10/19/2011	CN202013875U Radiating structure for signal-tube heat conducting tube
10/19/2011	CN202013867U 薄膜芯片装置 Thin-film chip device
10/19/2011	CN202013545U Shared fixing structure used for radiator
10/19/2011	CN102224593A Power mos transistor device and switch apparatus comprising the same
10/19/2011	CN102224590A Antenna integrated in a semiconductor chip
10/19/2011	CN102224589A Integrated capacitor with interlinked lateral fins
10/19/2011	CN102224588A Shielding for integrated capacitors

1 ... 445 446 447 448 449 450 451 452 453 454 455 456 457 458 459 460 461 462 463 464 465 ... 2262