H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2011
10/26/2011	EP2381478A2 Integrated circuit device
10/26/2011	EP2381474A2 Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
10/26/2011	EP2381473A2 Press-fit diode resistant to changes in temperature
10/26/2011	EP2380934A1 Composition for Silicone Resin
10/26/2011	EP2380415A1 Chip packages with power management integrated circuits and related techniques
10/26/2011	EP2380197A1 High power semiconductor device for wireless applications and method of forming a high power semiconductor device
10/26/2011	EP2380196A1 Semiconductor-based submount with electrically conductive feed-throughs
10/26/2011	EP2380195A1 Electrical contacts for cmos devices and iii-v devices formed on a silicon substrate
10/26/2011	EP2380194A1 Face-to-face (f2f) hybrid structure for an integrated circuit
10/26/2011	EP2380193A1 Component having a via, and a method for producting a component such as this
10/26/2011	EP2379998A1 Device and method for producing a device
10/26/2011	EP2118926B1 Passivation layer for a circuit device and method of manufacture
10/26/2011	EP1747584B1 System for shielding integrated circuits
10/26/2011	EP1609339B1 Method for manufacturing an electronic module and an electronic module
10/26/2011	EP1090423B1 Thin film capacitor element with protection elements
10/26/2011	CN202019514U Water-cooling heat radiation structure of flameproof and intrinsically safe frequency control device
10/26/2011	CN202019493U Welding pad structure of circuit board with holes
10/26/2011	CN202018965U Coupler with light-emitting diode (LED) and photoresistor
10/26/2011	CN202018959U Low-stress grouting rectification square bridge
10/26/2011	CN202018958U SOP (standard operating procedure) packaging element repair fixture
10/26/2011	CN1790703B 半导体装置 Semiconductor device
10/26/2011	CN102227806A Reconfiguring through silicon vias in stacked multi-die packages
10/26/2011	CN102227805A Wafer and method for manufacturing package product
10/26/2011	CN102226992A Transistor array substrate
10/26/2011	CN102226991A Copper palladium alloy monocrystal bonding wire and manufacturing method thereof
10/26/2011	CN102226990A Novel transistor construction
10/26/2011	CN102226987A Packaging and manufacturing methods for semiconductor with non-conducting layer
10/26/2011	CN101819953B Transparent epoxy resin packaging adhesive
10/26/2011	CN101800207B Packaging structure of semiconductor element and manufacture method thereof
10/26/2011	CN101764148B Electroluminescent device
10/26/2011	CN101764124B Measurement structure of interconnection resistance and method thereof
10/26/2011	CN101714521B Semiconductor device and method of manufacturing the same
10/26/2011	CN101663752B A power semiconductor arrangement and a semiconductor valve provided therewith
10/26/2011	CN101662883B Circuit board including aligned nanostructures and manufacture method
10/26/2011	CN101635266B Structure and method for connecting three-dimensional interconnect between crystalline grain and wafer
10/26/2011	CN101621053B System-in-package module and mobile terminal having the same
10/26/2011	CN101604682B Electronic device and method of manufacturing the same
10/26/2011	CN101578030B Heat dissipation structure and manufacturing method thereof
10/26/2011	CN101572253B Packaging housing of humidity-sensitive electronic device, substrate and leakproof structure thereof
10/26/2011	CN101556942B Anisotropic conductive film with excellent connection reliability and circuits interconnection structure using the same
10/26/2011	CN101552273B Improved three-dimensional read only memory (ROM)
10/26/2011	CN101484609B Film deposition method and film deposition apparatus
10/26/2011	CN101483208B LED encapsulation construction and assembling method thereof
10/26/2011	CN101431329B OR gate logic circuit and its forming method
10/26/2011	CN101425505B Circuit layout construction for measuring whether concave falls are generated by copper wire
10/26/2011	CN101383332B Electronic element device and manufacturing process thereof
10/26/2011	CN101312174B Line component
10/26/2011	CN101256980B Organic electroluminescent display apparatus and manufacturing method thereof
10/26/2011	CN101246873B Integrated circuit structure
10/26/2011	CN101236949B Printed circuit board and manufacturing method thereof
10/26/2011	CN101126950B Data processing apparatus and heat radiating member
10/26/2011	CN101097924B Tft array with photosensitive passivation layer
10/26/2011	CN101027774B Chip with light protection layer
10/25/2011	US8046616 Controlling power change for a semiconductor module to preserve thermal interface therein
10/25/2011	US8045331 Printed circuit board, method of fabricating the same, and electronic apparatus employing the same
10/25/2011	US8045066 Fully integrated tuner architecture
10/25/2011	US8044757 Electronic device including LTCC inductor
10/25/2011	US8044526 Integrated circuit assemblies with alignment features and devices and methods related thereto
10/25/2011	US8044525 Substrate with check mark and method of inspecting position accuracy of conductive glue dispensed on the substrate
10/25/2011	US8044524 Adhesive for connection of circuit member and semiconductor device using the same
10/25/2011	US8044523 Semiconductor device
10/25/2011	US8044522 Semiconductor device
10/25/2011	US8044520 Semiconductor device
10/25/2011	US8044519 Semiconductor device and method of fabricating the same
10/25/2011	US8044518 Junction member comprising junction pads arranged in matrix and multichip package using same
10/25/2011	US8044516 Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same
10/25/2011	US8044514 Semiconductor integrated circuit
10/25/2011	US8044512 Electrical property altering, planar member with solder element in IC chip package
10/25/2011	US8044511 Function element and function element mounting structure
10/25/2011	US8044510 Product and method for integration of deep trench mesh and structures under a bond pad
10/25/2011	US8044509 Semiconductor device
10/25/2011	US8044508 Method and apparatus for integrated-circuit battery devices
10/25/2011	US8044507 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer
10/25/2011	US8044506 Thermal-emitting memory module, thermal-emitting module socket, and computer system
10/25/2011	US8044505 Prepreg, method for manufacturing prepreg, substrate, and semiconductor device
10/25/2011	US8044504 Semiconductor device including an inner conductive layer which is cut out in the vicinity of a corner
10/25/2011	US8044502 Composite contact for fine pitch electrical interconnect assembly
10/25/2011	US8044501 Contact structure, display device and electronic device
10/25/2011	US8044500 Power module substrate, method for manufacturing power module substrate, and power module
10/25/2011	US8044499 Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof
10/25/2011	US8044498 Interposer, semiconductor chip mounted sub-board, and semiconductor package
10/25/2011	US8044497 Stacked die package
10/25/2011	US8044496 QFN semiconductor package
10/25/2011	US8044495 Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds
10/25/2011	US8044494 Stackable molded packages and methods of making the same
10/25/2011	US8044489 Semiconductor device with fluorine-containing interlayer dielectric film to prevent chalcogenide material layer from exfoliating from the interlayer dielectric film and process for producing the same
10/25/2011	US8044474 Optoelectronic module, and method for the production thereof
10/25/2011	US8044468 Semiconductor device
10/25/2011	US8044466 ESD protection device in high voltage and manufacturing method for the same
10/25/2011	US8044431 Microdisplay packaging system
10/25/2011	US8044418 Leadframe-based packages for solid state light emitting devices
10/25/2011	US8044396 Semiconductor device and method of designing the same
10/25/2011	US8044394 Semiconductor wafer with electrically connected contact and test areas
10/25/2011	US8044320 Method and apparatus for the correction of defective solder bump arrays
10/25/2011	US8043976 Adhesion to copper and copper electromigration resistance
10/25/2011	US8043892 Semiconductor die package and integrated circuit package and fabricating method thereof
10/25/2011	US8042727 Heater, reflow apparatus, and solder bump forming method and apparatus
10/25/2011	US8042605 Heat conduction device
10/25/2011	US8042267 Method for producing microsystems
10/21/2011	DE202010004109U1 Brückenverbindung von Wärmeleitrohren und deren Kühlmodul Bridge connection of heat pipes and the cooling module

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