Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/01/2011US8048761 Fabricating method for crack stop structure enhancement of integrated circuit seal ring
11/01/2011US8048736 Semiconductor device comprising a capacitor in the metallization system and a method of forming the capacitor
11/01/2011US8048715 Multi-chip module and methods
11/01/2011US8048714 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
11/01/2011US8048692 LED light emitter with heat sink holder and method for manufacturing the same
11/01/2011US8048479 Method for placing material onto a target board by means of a transfer board
11/01/2011US8047271 Heat dissipation device having a fan holder
11/01/2011US8047267 Apparatus for cooling communication equipment using heat pipe
11/01/2011US8046914 Method for manufacturing multilayer printed circuit board
11/01/2011US8046912 Method of making a connection component with posts and pads
11/01/2011CA2610026C Light-emitting diode cluster lamp
10/2011
10/27/2011WO2011133743A2 Interleaf for leadframe identification
10/27/2011WO2011132971A2 Semiconductor chip including bump having barrier layer, and manufacturing method thereof
10/27/2011WO2011132736A1 Semiconductor module and cooler
10/27/2011WO2011132648A1 Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device
10/27/2011WO2011132647A1 Film for back surface of flip-chip semiconductor
10/27/2011WO2011132630A1 Semiconductor device, semiconductor device manufacturing device, semiconductor device manufacturing method, and ic tag
10/27/2011WO2011132603A1 Glass substrate for forming semiconductor device via
10/27/2011WO2011132601A1 Method for manufacturing glass substrate used for forming through-electrode of semiconductor device
10/27/2011WO2011132600A1 Glass substrate for semiconductor device via
10/27/2011WO2011132419A1 Silver anti-tarnishing agent, silver anti-tarnishing resin composition, silver anti-tarnishing method, and light-emitting diode using same
10/27/2011WO2011132069A2 Power semiconductor device packaging
10/27/2011WO2011131669A1 Methods and devices for stressing an integrated circuit
10/27/2011WO2011131519A1 Composite component and method for producing a composite component
10/27/2011WO2011131362A1 Printed circuit board with cavity
10/27/2011WO2011109310A3 Thermal vias in an integrated circuit package with an embedded die
10/27/2011WO2011072076A3 Transformer within wafer test probe
10/27/2011WO2011051785A3 Routing method for flip chip package and apparatus using the same
10/27/2011WO2010105152A3 Microelectronic assembly wherein a wirebond is impedance controlled by using an additional wirebond connected to a reference potential
10/27/2011US20110263121 Manufacturing method for semiconductor device containing stacked semiconductor chips
10/27/2011US20110261659 Method of manufacturing packages, bonded wafer member, piezoelectric vibrator, oscillator, electronic apparatus, and radio timepiece
10/27/2011US20110260343 Polymeric compositions comprising per(phenylethynyl) arene derivatives
10/27/2011US20110260342 Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device
10/27/2011US20110260341 Power switch component having improved temperature distribution
10/27/2011US20110260340 Circuit board structure, packaging structure and method for making the same
10/27/2011US20110260339 Semiconductor device
10/27/2011US20110260338 Semiconductor Device and Method of Forming Adjacent Channel and DAM Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material
10/27/2011US20110260337 Method of manufacturing semiconductor device and semiconductor device
10/27/2011US20110260336 Wafer level semiconductor package and fabrication method thereof
10/27/2011US20110260335 Power supply interconnect structure of semiconductor integrated circuit
10/27/2011US20110260334 Semiconductor device
10/27/2011US20110260333 Interconnect structure of semiconductor integrated circuit and semiconductor device including the same
10/27/2011US20110260332 Multilevel interconnect structures and methods of fabricating same
10/27/2011US20110260331 Stacked semiconductor device
10/27/2011US20110260330 Semiconductor integrated circuit
10/27/2011US20110260329 Semiconductor integrated circuit
10/27/2011US20110260328 Semiconductor device and method for forming using the same
10/27/2011US20110260327 Chip package
10/27/2011US20110260326 Structures and methods for air gap integration
10/27/2011US20110260325 Semiconductor device
10/27/2011US20110260324 Electronic device package and method of manufacture
10/27/2011US20110260323 Hybrid interconnect structure for performance improvement and reliability enhancement
10/27/2011US20110260322 "Semiconductor on semiconductor substrate multi-chip-scale package"
10/27/2011US20110260321 Flip Chip Interconnection Structure
10/27/2011US20110260320 Method of making a connection component with posts and pads
10/27/2011US20110260319 Three-dimensional stacked substrate arrangements
10/27/2011US20110260318 Integrated circuits with multiple I/O regions
10/27/2011US20110260317 Cu pillar bump with electrolytic metal sidewall protection
10/27/2011US20110260316 Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
10/27/2011US20110260315 Power block and power semiconductor module using same
10/27/2011US20110260314 Die package and corresponding method for realizing a double side cooling of a die package
10/27/2011US20110260313 Integrated circuit package system with contoured encapsulation and method for manufacturing thereof
10/27/2011US20110260312 Semiconductor device and lead frame used for the same
10/27/2011US20110260311 Resin molded semiconductor device and manufacturing method thereof
10/27/2011US20110260310 Quad flat non-leaded semiconductor package and fabrication method thereof
10/27/2011US20110260309 Semiconductor package, test socket and related methods
10/27/2011US20110260308 Circuit board structure, packaging structure and method for making the same
10/27/2011US20110260307 Integrated circuit including bond wire directly bonded to pad
10/27/2011US20110260306 Lead frame package structure for side-by-side disposed chips
10/27/2011US20110260305 Power Semiconductor Device Packaging
10/27/2011US20110260304 Leadframe for electronic components
10/27/2011US20110260303 Semiconductor Device and Method of Forming Openings in Thermally-Conductive Frame of FO-WLCSP to Dissipate Heat and Reduce Package Height
10/27/2011US20110260302 Shielding device
10/27/2011US20110260301 Semiconductor device packages with electromagnetic interference shielding
10/27/2011US20110260300 Wafer-Bump Structure
10/27/2011US20110260299 Method for via plating in electronic packages containing fluoropolymer dielectric layers
10/27/2011US20110260297 Through-substrate via and fabrication method thereof
10/27/2011US20110260288 Semiconductor device and method for manufacturing the same
10/27/2011US20110260287 Structure in a high voltage path of an ultra-high voltage device for providing esd protection
10/27/2011US20110260284 Method for Producing a Semiconductor Component, and Semiconductor Component
10/27/2011US20110260281 Shielding for high-voltage semiconductor-on-insulator devices
10/27/2011US20110260266 Semiconductor package structure and package process
10/27/2011US20110260252 Use of epitaxial ni silicide
10/27/2011US20110260218 Semiconductor device
10/27/2011US20110260198 Insulation structure for high temperature conditions and manufacturing method thereof
10/27/2011US20110260183 Electronic device and method of manufacturing the same
10/27/2011US20110260161 Test device and semiconductor integrated circuit device
10/27/2011US20110260027 Solar panel mounting assembly with locking cap
10/27/2011DE202007019330U1 Beschichtung/Abdeckung für optoelektronische Bauteile Coating / cover for optoelectronic devices
10/27/2011DE102011017563A1 Press contact type semiconductor device e.g. gate turn-off thyristor, has gasket between the outer pressing contact electrode structure and cover, whose deformation force is smaller than force required for peeling the cover from substrate
10/27/2011DE102011007227A1 Leistungsblock und ihn verwendendes Halbleiterleistungsmodul Power block and him-use semiconductor power module
10/27/2011DE102011002234A1 GaN-basierte Leistungsvorrichtung mit integrierten Schutzvorrichtungen: Strukturen und Verfahren GaN-based power device with integrated protection devices: Structures and processes
10/27/2011DE102011001423A1 Die-Gehäuse The housing
10/27/2011DE102011001063A1 Integrierter Schaltkreis mit einem direkt an ein Pad gebondeten Bonddraht Integrated circuit with a directly bonded to a pad bonding wire
10/27/2011DE102010028199A1 Press-fit diode i.e. rectifier diode, for use in motor car generator of automotive generator system for rectifying alternating current, has used solders, where melting temperature of each solder is larger than junction temperature of chip
10/27/2011DE102010028196A1 Temperaturwechselfeste Einpressdiode Thermal shock resistant press-fit diode
10/27/2011DE102010028121A1 Method for manufacturing e.g. application-specific integrated switching circuit, involves removing connector of plastic mass and chips from carrier by thermal decomposition of thermoplastic material at temperature
10/27/2011DE102010028045A1 Ein Leistungsschalterbauelement mit verbesserter Temperaturverteilung A circuit breaker device with improved temperature distribution
10/26/2011EP2381575A1 Piezoelectric oscillation device, method for manufacturing a piezoelectric oscillation device, and etching method of structural components forming a piezoelectric oscillation device
10/26/2011EP2381498A1 Method for manufacturing a thermoelectric module, and thermoelectric module
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