H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/02/2011	CN202025763U Power MOS field effect transistor suitable for automotive electronics
11/02/2011	CN202025761U Crimping type controlled silicon chip structure
11/02/2011	CN202025756U Semiconductor LED secondary packaging piece adopting gold-plated bonding copper wires for connection
11/02/2011	CN202025749U Three-dimensional high-density system level packaging structure
11/02/2011	CN202025748U High-density system-on-package structure
11/02/2011	CN202025747U Fan-out system-on-package structure
11/02/2011	CN202025746U High integrated level SiP structure
11/02/2011	CN202025745U Base material with metallized surface
11/02/2011	CN202025744U Printed circuit board and crystal grain connecting structure
11/02/2011	CN202025743U Packaging structure of SMD (Surface Mount Device) product
11/02/2011	CN202025742U Improved heat conducting device
11/02/2011	CN202025741U Heat conducting device
11/02/2011	CN202025740U Plate sintering heat pipe
11/02/2011	CN202025739U Heat pipe
11/02/2011	CN202025738U Central processing unit (CPU) provided with radiating devices and fixing seat thereof
11/02/2011	CN202025737U Heat-radiating structure
11/02/2011	CN202025736U Fast heat-conducting radiator
11/02/2011	CN202025735U Novel lead framework structure
11/02/2011	CN202025734U Insulating thermal wrapping seal structure of electronic element
11/02/2011	CN202025733U Semiconductor-packaging structure
11/02/2011	CN202025732U Silicon controlled rectifier gasket
11/02/2011	CN102232244A Heat sink blockage detector
11/02/2011	CN102231938A Printed circuit board
11/02/2011	CN102231794A Equipment with multipath universal serial buses (USB) for acquiring charge coupled device (CCD) camera data
11/02/2011	CN102231793A Industrial split jointed charge coupled device (CCD) camera with extra large target surface
11/02/2011	CN102231396A Photovoltaic terminal box
11/02/2011	CN102231383A Ceramic packing device and method of image sensor
11/02/2011	CN102231382A Ceramic package for image sensor and package method
11/02/2011	CN102231376A Multi-cycle arrangement carrier-free double-integrated chip (IC) package and production method
11/02/2011	CN102231375A Semiconductor device and storage card
11/02/2011	CN102231374A High-stability face-down bonding substrate applied to linear array infrared focal plane detector
11/02/2011	CN102231373A Semiconductor substrate and methods for the production thereof
11/02/2011	CN102231372A Multi-turn arranged carrier-free IC (Integrated Circuit) chip packaging component and manufacturing method thereof
11/02/2011	CN102231371A Semiconductor chip and storage device
11/02/2011	CN102231370A High power fin cold plate radiator and manufacturing method thereof
11/02/2011	CN102231369A High-power heat-dissipation module
11/02/2011	CN102231366A Four-side without pin semiconductor packaging method and packaging die structure thereof
11/02/2011	CN102231361A Semiconductor component and method for manufacturing same
11/02/2011	CN102231313A Multilayer stacked inductance utilizing parallel connection of metals
11/02/2011	CN102231013A Semiconductor device and display device
11/02/2011	CN102230684A Hybrid heat exchanger
11/02/2011	CN102230457A Drive circuit for piezoelectric pump and cooling system that uses this drive circuit
11/02/2011	CN101950109B Flat panel display device with test architecture
11/02/2011	CN101770563B Intelligent card heat dissipating device and manufacturing method thereof
11/02/2011	CN101728282B Electronic device and process for manufacturing electronic device
11/02/2011	CN101681848B Electronic component package
11/02/2011	CN101652847B Electrical interconnect structure and method of forming the same
11/02/2011	CN101651131B Low dielectric constant insulating film and preparation method thereof
11/02/2011	CN101640999B Radiator device
11/02/2011	CN101510534B Cooling device for cooling power semiconductor device e.g. insulated gate bipolar transistor (igbt), has lower cavity and upper cavity having cross sectional area that decreases and increases in downs
11/02/2011	CN101501845B Transistor formed with self-aligned contacts
11/02/2011	CN101492149B Electrical device for structuring to semiconductor integrated circuit
11/02/2011	CN101454898B Method and system for composite bond wires
11/02/2011	CN101419962B LED, production method therefore and illuminator manufactured by the LED
11/02/2011	CN101335319B High-power LED ceramic package base and productive technology
11/02/2011	CN101308836B Light emitting diode, light emitting diode component and llight emitting diode lamp string
11/02/2011	CN101047156B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/01/2011	US8050048 Lead frame with solder flow control
11/01/2011	US8050047 Integrated circuit package system with flexible substrate and recessed package
11/01/2011	US8049345 Overlay mark
11/01/2011	US8049344 Semiconductor apparatus, manufacturing method for the semiconductor apparatus, and electronic information device
11/01/2011	US8049343 Semiconductor device and method of manufacturing the same
11/01/2011	US8049342 Semiconductor device and method of fabrication thereof
11/01/2011	US8049341 Semiconductor package and method for manufacturing the same
11/01/2011	US8049340 Device for avoiding parasitic capacitance in an integrated circuit package
11/01/2011	US8049339 Semiconductor package having isolated inner lead
11/01/2011	US8049338 Power semiconductor module and fabrication method
11/01/2011	US8049337 Substrate and manufacturing method of package structure
11/01/2011	US8049336 Interconnect structure
11/01/2011	US8049335 System and method for plasma induced modification and improvement of critical dimension uniformity
11/01/2011	US8049334 Buried silicide local interconnect with sidewall spacers and method for making the same
11/01/2011	US8049333 Transparent conductors comprising metal nanowires
11/01/2011	US8049332 Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same
11/01/2011	US8049331 Structure and method for forming a capacitively coupled chip-to-chip signaling interface
11/01/2011	US8049330 Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels
11/01/2011	US8049329 Wafer stacked package waving bertical heat emission path and method of fabricating the same
11/01/2011	US8049328 Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
11/01/2011	US8049327 Through-silicon via with scalloped sidewalls
11/01/2011	US8049326 Environment-resistant module, micropackage and methods of manufacturing same
11/01/2011	US8049325 Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolation
11/01/2011	US8049324 Preventing access to stub traces on an integrated circuit package
11/01/2011	US8049323 Chip holder with wafer level redistribution layer
11/01/2011	US8049322 Integrated circuit package-in-package system and method for making thereof
11/01/2011	US8049321 Semiconductor device assembly and method thereof
11/01/2011	US8049320 Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
11/01/2011	US8049319 Ultra wideband system-on-package
11/01/2011	US8049318 Semiconductor light emitting device
11/01/2011	US8049317 Grid array packages
11/01/2011	US8049316 Semiconductor package
11/01/2011	US8049315 Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
11/01/2011	US8049314 Integrated circuit package system with insulator over circuitry
11/01/2011	US8049313 Heat spreader for semiconductor package
11/01/2011	US8049312 Semiconductor device package and method of assembly thereof
11/01/2011	US8049309 Edge seal for a semiconductor device
11/01/2011	US8049278 ESD protection for high voltage applications
11/01/2011	US8049260 High-density integrated circuitry for semiconductor memory
11/01/2011	US8049249 Integrated circuit devices with ESD protection in scribe line, and methods for fabricating same
11/01/2011	US8049213 Feature dimension measurement
11/01/2011	US8049208 Organic semiconductor device having composite electrode
11/01/2011	US8049135 Systems and methods for alignment of laser beam(s) for semiconductor link processing

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