H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/03/2011	WO2011137176A1 Method for making an isolated wire bond in electrical components
11/03/2011	WO2011136417A1 Integrated-terminal-type metal base package module and a method for packaging an integrated terminal for a metal base package module
11/03/2011	WO2011136403A1 Method for manufacturing a metal-based package having a via structure
11/03/2011	WO2011136363A1 Method for manufacturing circuit device
11/03/2011	WO2011136362A1 Heat dissipation device and semiconductor device
11/03/2011	WO2011136338A1 Method for forming carbon nanotubes, and carbon nanotube film-forming apparatus
11/03/2011	WO2011136222A1 Power module and method for manufacturing power module
11/03/2011	WO2011135860A1 Shape-retaining film, process for producing same, laminate for packaging, packaging material and process for producing same, shape-retaining fiber, and anisotropic heat-conductive film
11/03/2011	WO2011135641A1 Semiconductor device and method for manufacturing same
11/03/2011	WO2011135153A1 Method for manufacturing an antenna component by etching
11/03/2011	WO2011134166A1 Semiconductor package configured to electrically couple to printed circuit board and method of providing the same
11/03/2011	WO2011134121A1 Led light source module
11/03/2011	WO2011134117A1 Bonding method of heterogeneous material
11/03/2011	WO2011090912A3 Integrated void fill for through silicon via
11/03/2011	WO2011013091A3 Semiconductor device including a stress buffer material formed above a low-k metallization system
11/03/2011	US20110270341 Hermetic wafer-to-wafer bonding with electrical interconnection
11/03/2011	US20110270099 Hermetic wafer-to-wafer bonding with electrical interconnection
11/03/2011	US20110269272 Microelectronic packages and methods therefor
11/03/2011	US20110269258 Solid-state imaging device and method for manufacturing the same
11/03/2011	US20110267796 Nonvolatile memory device and method for manufacturing the same
11/03/2011	US20110267136 Semiconductor device and method of cutting electrical fuse
11/03/2011	US20110267023 Dc voltage conversion module, semiconductor module, and method of making semiconductor module
11/03/2011	US20110266701 Novel build-up package for integrated circuit devices, and methods of making same
11/03/2011	US20110266700 Wire bond interconnection and method of manufacture thereof
11/03/2011	US20110266699 Method for manufacturing a microelectronic device and a microelectronic device thus manufactured
11/03/2011	US20110266698 Semiconductor device comprising variable-sized contact, method of forming same, and apparatus comprising same
11/03/2011	US20110266697 Electronic part package
11/03/2011	US20110266696 Semiconductor device packages including a semiconductor device and a redistribution element
11/03/2011	US20110266695 Semiconductor device layout method, a computer program, and a semiconductor device manufacture method
11/03/2011	US20110266694 Methods of manufacturing semiconductor structures and devices including nanotubes, and semiconductor structures, devices, and systems fabricated using such methods
11/03/2011	US20110266693 Tce compensation for package substrates for reduced die warpage assembly
11/03/2011	US20110266692 Layered chip package and method of manufacturing same
11/03/2011	US20110266691 Through-Substrate Vias with Improved Connections
11/03/2011	US20110266690 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
11/03/2011	US20110266689 Methods Of Forming A Plurality Of Conductive Lines In The Fabrication Of Integrated Circuitry, Methods Of Forming An Array Of Conductive Lines, And Integrated Circuitry
11/03/2011	US20110266688 Planarized passivation layer for semiconductor devices
11/03/2011	US20110266687 Electronic elements and devices with trench under bond pad feature
11/03/2011	US20110266686 Semiconductor device and method of manufacturing the same
11/03/2011	US20110266685 Semiconductor Device Comprising Sophisticated Conductive Elements in a Dielectric Material System Formed by Using a Barrier Layer
11/03/2011	US20110266684 Selective Die Electrical Insulation By Additive Process
11/03/2011	US20110266683 Stackable Power MOSFET, Power MOSFET Stack, and Process of Manufacture
11/03/2011	US20110266681 Electronic component as well as method for its production
11/03/2011	US20110266680 Carbon nanotube circuit component structure
11/03/2011	US20110266679 Semiconductor device, and manufacturing method of semiconductor device
11/03/2011	US20110266678 Semiconductor device and method for manufacturing same
11/03/2011	US20110266677 Semiconductor structure and manufacturing method of the same
11/03/2011	US20110266676 Method for forming interconnection line and semiconductor structure
11/03/2011	US20110266675 Directional self-assembly of biological electrical interconnects
11/03/2011	US20110266674 Laser Etch Via Formation
11/03/2011	US20110266673 Integrated circuit package structure and method
11/03/2011	US20110266672 Integrated-circuit attachment structure with solder balls and pins
11/03/2011	US20110266671 Substrate for a semiconductor package and manufacturing method thereof
11/03/2011	US20110266670 Wafer level chip scale package with annular reinforcement structure
11/03/2011	US20110266669 Semiconductor chip with post-passivation scheme formed over passivation layer
11/03/2011	US20110266668 Microelectronic assemblies having compliancy
11/03/2011	US20110266667 Cu pillar bump with non-metal sidewall protection structure
11/03/2011	US20110266666 Circuit board with built-in semiconductor chip and method of manufacturing the same
11/03/2011	US20110266665 Press-pack module with power overlay interconnection
11/03/2011	US20110266664 Integrated circuit packaging system with package-on-package and method of manufacture thereof
11/03/2011	US20110266663 Lead frame based semiconductor package and a method of manufacturing the same
11/03/2011	US20110266662 Leadframe enhancing molding compound bondability and package structure thereof
11/03/2011	US20110266661 Lead frame and method for manufacturing semiconductor device using the same
11/03/2011	US20110266660 Insulating film for semiconductor device, process and apparatus for producing insulating film for semiconductor device, semiconductor device, and process for producing the semiconductor device
11/03/2011	US20110266658 Isolated wire bond in integrated electrical components
11/03/2011	US20110266657 Semiconductor device and method for manufacturing the same
11/03/2011	US20110266656 Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue
11/03/2011	US20110266653 Semiconductor device having a fuse element
11/03/2011	US20110266652 Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof
11/03/2011	US20110266646 Semiconductor device
11/03/2011	US20110266592 Device and method for transient voltage suppressor
11/03/2011	US20110266541 Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip
11/03/2011	US20110266540 Semiconductor device
11/03/2011	US20110266539 High Performance Compliant Wafer Test Probe
11/03/2011	US20110266510 Controlled Placement of Dopants in Memristor Active Regions
11/03/2011	US20110266234 Mounting system for solar modules and method for installing a solar system
11/03/2011	US20110266233 Mounting system for solar modules
11/03/2011	US20110266048 Housing and method for manufacturing same
11/03/2011	US20110266041 Method for embedding a component in a base
11/03/2011	US20110265861 Fastening structure for a large solar module, and solar module
11/03/2011	DE102011017585A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
11/03/2011	DE102010028481A1 Elektronikgehäuse für eine Lampe, Halbleiterlampe und Verfahren zum Vergießen eines Elektronikgehäuses für eine Lampe Electronics housing for a lamp, the semiconductor lamp and method for encapsulating an electronic package for a lamp
11/03/2011	DE102010028465A1 Halbleiterbauelement mit Metallgate und Halbleiterwiderständen, die auf der Grundlage eines Austauschgateverfahrens hergestellt sind A semiconductor device with metal gate and semiconductor resistors which are formed on the basis of a replacement gate method
11/02/2011	EP2384108A2 Dust-disposal heat-dissipation device with double cooling fans
11/02/2011	EP2384103A1 Electronic device manufacturing method and electronic device
11/02/2011	EP2383808A2 Light emitting device package having leads with a recess for the chip mount area
11/02/2011	EP2383779A1 Mounting base
11/02/2011	EP2383777A1 Multilevel interconnect structures and methods for fabricating same
11/02/2011	EP2382661A2 Integrated electronic device with transceiving antenna and magnetic interconnection
11/02/2011	EP2382660A1 Electrical or electronic composite component and method for producing an electrical or electronic composite component
11/02/2011	EP2382659A1 Electrical or electronic composite component and method for producing an electrical or electronic composite component
11/02/2011	EP2382658A1 Redundant metal barrier structure for interconnect applications
11/02/2011	EP2294902B1 Cooling system for an led chip array
11/02/2011	EP2243161B1 Semiconductor package and its manufacture
11/02/2011	EP1627428B1 An integrated circuit package employing a head-spreader member
11/02/2011	EP1528595B1 Lead frame, wire-bonding stage and method for fabricating a semiconductor apparatus
11/02/2011	EP1412976B1 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
11/02/2011	EP1289355B1 Method for producing ceramic substrate
11/02/2011	DE202011050391U1 Wärmerohr zufügbarer Kühlkörper Heat pipe heat sink zufügbarer
11/02/2011	CN202026556U Radiator, radiation module, notebook computer and integrated computer radiation system
11/02/2011	CN202026555U Heat radiation device

1 ... 441 442 443 444 445 446 447 448 449 450 451 452 453 454 455 456 457 458 459 460 461 ... 2262