H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/09/2011	CN101647109B 半导体装置 Semiconductor device
11/09/2011	CN101641001B Radiating device
11/09/2011	CN101604679B Lead frame, semiconductor device, method for manufacturing lead frame and method for manufacturing semiconductor device
11/09/2011	CN101573021B Cooling system and electronic equipment including cooling system
11/09/2011	CN101563774B IC chip mounting package and process for manufacturing the same
11/09/2011	CN101558489B Ic chip package manufacture method
11/09/2011	CN101552260B Wiring structure
11/09/2011	CN101527294B Manufacturing method of thermal dissipation layer for driver ic substrate and structure thereof
11/09/2011	CN101473432B Heat sink and cooler
11/09/2011	CN101466240B Radiating device
11/09/2011	CN101466238B Heat radiator
11/09/2011	CN101466224B Radiating device
11/09/2011	CN101465394B Light-emitting diode, light-emitting diode string
11/09/2011	CN101449374B Highly heat conductive, flexible sheet and its manufacture method
11/09/2011	CN101442061B Camera component
11/09/2011	CN101436600B Semiconductor device and method for manufacturing the same, and electric device
11/09/2011	CN101430081B Fence type LED lighting device
11/09/2011	CN101409270B Metallic conduction structure applying for module integrated circuit and preparation method thereof
11/09/2011	CN101384155B Heat radiating assembly
11/09/2011	CN101374394B Combination of fastening device
11/09/2011	CN101370370B Heat radiation module
11/09/2011	CN101369575B Sheet type diode and preparation method thereof
11/09/2011	CN101363600B LED lamp
11/09/2011	CN101325310B Light emitting device and method of fabricating a light emitting device
11/09/2011	CN101304008B Stress layer structure
11/09/2011	CN101266963B Wiring board, mounting structure for electronic components, and semiconductor device
11/09/2011	CN101236942B IC base plate and its making method
11/09/2011	CN101232793B Thermal conduction heat radiating device for electronic components
11/09/2011	CN101231667B Method of filling redundancy for semiconductor manufacturing process and semiconductor device
11/09/2011	CN101211892B Multi-layer metal wiring of semiconductor device and method for forming the same
11/09/2011	CN101211876B 半导体装置 Semiconductor device
11/09/2011	CN101188230B Package structure and its making method
11/09/2011	CN101155501B Heat radiator
11/09/2011	CN101133097B Hardening accelerator, hardenable resin composition, and electronic component device
11/09/2011	CN101057324B Semiconductor device and method for manufacturing semiconductor device
11/09/2011	CN101030573B Semiconductor chip, semiconductor device and method for manufacturing semiconductor device
11/09/2011	CN101009250B Thin film transistor array panel and method of manufacturing the same
11/08/2011	US8054673 Three dimensionally stacked non volatile memory units
11/08/2011	US8054629 Microfins for cooling an ultramobile device
11/08/2011	US8054370 Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof
11/08/2011	US8054324 Optical head and image forming apparatus
11/08/2011	US8053911 Semiconductor device and data processor
11/08/2011	US8053910 Substrate including alignment columnar member and plural protection columnar members, and method of making the same
11/08/2011	US8053909 Semiconductor component having through wire interconnect with compressed bump
11/08/2011	US8053908 Semiconductor device
11/08/2011	US8053907 Method and system for forming conductive bumping with copper interconnection
11/08/2011	US8053906 Semiconductor package and method for processing and bonding a wire
11/08/2011	US8053905 Compliant bonding structures for semiconductor devices
11/08/2011	US8053904 Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same
11/08/2011	US8053903 Chip capacitive coupling
11/08/2011	US8053902 Isolation structure for protecting dielectric layers from degradation
11/08/2011	US8053901 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
11/08/2011	US8053900 Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect
11/08/2011	US8053899 Semiconductor devices including damascene trenches with conductive structures
11/08/2011	US8053896 IC chip coating material and vacuum fluorescent display device using same
11/08/2011	US8053895 Metal line of semiconductor device having a multilayer molybdenum diffusion barrier and method for forming the same
11/08/2011	US8053894 Surface treatment of metal interconnect lines
11/08/2011	US8053893 Semiconductor device and manufacturing method thereof
11/08/2011	US8053892 Low resistance and reliable copper interconnects by variable doping
11/08/2011	US8053891 Standing chip scale package
11/08/2011	US8053889 Semiconductor module
11/08/2011	US8053888 System for clamping heat sink
11/08/2011	US8053886 Semiconductor package and manufacturing method thereof
11/08/2011	US8053885 Wafer level vertical diode package structure and method for making the same
11/08/2011	US8053884 Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it
11/08/2011	US8053883 Isolated stacked die semiconductor packages
11/08/2011	US8053882 Stacked semiconductor devices and signal distribution methods thereof
11/08/2011	US8053881 Semiconductor package and method for manufacturing the same
11/08/2011	US8053880 Stacked, interconnected semiconductor package
11/08/2011	US8053879 Stacked semiconductor package and method for fabricating the same
11/08/2011	US8053878 Substrate, semiconductor device using the same, method for inspecting semiconductor device, and method for manufacturing semiconductor device
11/08/2011	US8053877 Semiconductor package
11/08/2011	US8053876 Multi lead frame power package
11/08/2011	US8053875 Method of manufacturing a semiconductor device
11/08/2011	US8053874 Semiconductor package having a bridge plate connection
11/08/2011	US8053873 IC having voltage regulated integrated Faraday shield
11/08/2011	US8053872 Integrated shield for a no-lead semiconductor device package
11/08/2011	US8053871 Implementation of a metal barrier in an integrated electronic circuit
11/08/2011	US8053870 Semiconductor structure incorporating multiple nitride layers to improve thermal dissipation away from a device and a method of forming the structure
11/08/2011	US8053869 Package having exposed integrated circuit device
11/08/2011	US8053868 Wafer level chip scale package of image sensor and manufacturing method thereof
11/08/2011	US8053862 Integrated circuit fuse
11/08/2011	US8053852 Light sensor receiving light from backside
11/08/2011	US8053814 On-chip embedded thermal antenna for chip cooling
11/08/2011	US8053777 Thin film transistors for imaging system and method of making the same
11/08/2011	US8053774 Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis
11/08/2011	US8053687 Semiconductor device and touch sensor device
11/08/2011	US8053685 Metal wiring plate
11/08/2011	US8053684 Mounting structure and method for mounting electronic component onto circuit board
11/08/2011	US8053371 Apparatus and methods for selective removal of material from wafer alignment marks
11/08/2011	US8053369 Process for forming opening portion in interlayer insulation film on metallic layer of semiconductor device
11/08/2011	US8053361 Interconnects with improved TDDB
11/08/2011	US8053358 Methods of forming integrated circuit devices using contact hole spacers to improve contact isolation
11/08/2011	US8053357 Prevention of post CMP defects in CU/FSG process
11/08/2011	US8053282 Mounting structure of component of lighting device and method thereof
11/08/2011	US8052499 Organic electroluminescence device and manufacturing method thereof
11/08/2011	CA2695746C Methods for making millichannel substrate, and cooling device and apparatus using the substrate
11/04/2011	DE202011106685U1 Befestigung einer Kühleinheit Fixing a cooling unit
11/03/2011	WO2011137360A1 Thermal interface materials with good reliability
11/03/2011	WO2011137179A1 Isolated wire bond in integrated electrical components

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