Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/09/2014US8906740 Integrated circuit packaging system having dual sided connection and method of manufacture thereof
12/09/2014US8906317 Production apparatus of composite silver nanoparticle
12/09/2014US8905808 Devices including, methods using, and compositions of reflowable getters
12/09/2014US8905772 Stretchable and foldable electronic devices
12/09/2014US8905290 Apparatus for mounting semiconductor chips on a circuit board
12/09/2014US8905120 Heat dissipating module
12/09/2014US8904627 Method for sealing package
12/09/2014DE202014103776U1 Kühlstruktur eines tragbaren Geräts The cooling structure of a portable device
12/04/2014US20140357075 Semiconductor device
12/04/2014US20140357045 eFUSE AND METHOD OF FABRICATION
12/04/2014US20140357025 Semiconductor device and method of manufacturing semiconductor device
12/04/2014US20140357024 Recessed and embedded die coreless package
12/04/2014US20140357023 Semiconductor device package with cap element
12/04/2014US20140357022 A qfn with wettable flank
12/04/2014US20140357020 Methods for high precision microelectronic die integration
12/04/2014US20140356993 Light-emitting device and method for manufacturing the same
12/04/2014US20140356986 Precision controlled collapse chip connection mapping
12/04/2014US20140356981 Wafer bonding misalignment reduction
12/04/2014US20140353853 Method for manufacturing a multilayer structure on a substrate
12/04/2014US20140353852 Method for processing a carrier and a carrier
12/04/2014US20140353851 Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
12/04/2014US20140353850 Semiconductor package and fabrication method thereof
12/04/2014US20140353849 System for preventing tampering with integrated circuit
12/04/2014US20140353848 Adhesive film for heat dissipation, semiconductor device including the same, and method of fabricating the semiconductor device
12/04/2014US20140353846 Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant
12/04/2014US20140353845 Semiconductor device and production method therefor
12/04/2014US20140353843 Circuit structures and methods of fabrication with enhanced contact via electrical connection
12/04/2014US20140353842 Wide pin for improved circuit routing
12/04/2014US20140353841 Method for forming an electrical connection between metal layers
12/04/2014US20140353840 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
12/04/2014US20140353839 Manganese oxide hard mask for etching dielectric materials
12/04/2014US20140353838 3D Packages and Methods for Forming the Same
12/04/2014US20140353837 Semiconductor device and manufacturing method thereof
12/04/2014US20140353836 Chip arrangements and a method for manufacturing a chip arrangement
12/04/2014US20140353835 Methods of self-forming barrier integration with pore stuffed ulk material
12/04/2014US20140353834 Semiconductor device
12/04/2014US20140353833 Stress Compensation Layer to Improve Device Uniformity
12/04/2014US20140353831 Methods of forming substrate microvias with anchor structures
12/04/2014US20140353830 Semiconductor devices with multilayer flex interconnect structures
12/04/2014US20140353829 Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganese
12/04/2014US20140353828 Substrate bonding with diffusion barrier structures
12/04/2014US20140353827 Bridge interconnection with layered interconnect structures
12/04/2014US20140353826 Silicidation Blocking Process Using Optically Sensitive HSQ Resist and Organic Planarizing Layer
12/04/2014US20140353825 Silicidation Blocking Process Using Optically Sensitive HSQ Resist and Organic Planarizing Layer
12/04/2014US20140353824 Package-on-package structure
12/04/2014US20140353823 Semiconductor package and method of manufacturing the same
12/04/2014US20140353822 Semiconductor device
12/04/2014US20140353821 Semiconductor devices having solder terminals spaced apart from mold layers and related methods
12/04/2014US20140353820 Semiconductor device and method for fabricating the same
12/04/2014US20140353819 Polymer Layers Embedded with Metal Pads for Heat Dissipation
12/04/2014US20140353818 Power module comprising two substrates and method of manufacturing the same
12/04/2014US20140353817 Heat dissipation device embedded within a microelectronic die
12/04/2014US20140353816 Method of forming a high thermal conducting semiconductor device package
12/04/2014US20140353815 Semiconductor die assemblies and semiconductor devices including same
12/04/2014US20140353814 Semiconductor device and method of manufacturing semiconductor device
12/04/2014US20140353813 Semiconductor package having a system-in-package structure
12/04/2014US20140353812 Semiconductor device
12/04/2014US20140353811 Semiconductor packaging container, Semiconductor device, Electronic device
12/04/2014US20140353810 Semiconductor device and method of manufacturing the same
12/04/2014US20140353809 Semiconductor device and manufacturing method of semiconductor device
12/04/2014US20140353808 Packaged Semiconductor Device
12/04/2014US20140353807 Semiconductor package with integrated interference shielding and method of manufacture thereof
12/04/2014US20140353806 Bypass diode
12/04/2014US20140353805 Methods of semiconductor contaminant removal using supercritical fluid
12/04/2014US20140353803 Semiconductor device structures
12/04/2014US20140353798 Vertically Oriented Semiconductor Device and Shielding Structure Thereof
12/04/2014US20140353797 Fuse/resistor utilizing interconnect and vias and method of making
12/04/2014US20140353791 Miniaturized Implantable Sensor Platform having Multiple Devices and Sub-Chips
12/04/2014US20140353789 Sensor Package With Exposed Sensor Array And Method Of Making Same
12/04/2014US20140353774 Methods for stiction reduction in mems sensors
12/04/2014US20140353766 Small Footprint Semiconductor Package
12/04/2014US20140353758 Semiconductor device
12/04/2014US20140353751 Local interconnects by metal-iii-v alloy wiring in semi-insulating iii-v substrates
12/04/2014US20140353728 Method and apparatus for a reduced capacitance middle-of-the-line (mol) nitride stack
12/04/2014US20140353727 I/o cell esd system
12/04/2014US20140353677 Low-defect semiconductor device and method of manufacturing the same
12/04/2014US20140353664 Semiconductor chip, semiconductor apparatus having the same and method of arranging the same
12/04/2014US20140353387 Smart Card Module and Method for Producing a Smart Card Module
12/04/2014US20140353384 Smart card module, smart card and method for producing a smart card module
12/04/2014US20140353362 Laser Ablation Process for Manufacturing Submounts for Laser Diode and Laser Diode Units
12/04/2014US20140353162 Electroplating baths of silver and tin alloys
12/02/2014US8904315 Circuit arrangements and associated apparatus and methods
12/02/2014US8902660 Semiconductor devices having wiring with contact pads and dummy lines
12/02/2014US8902592 Heat sink and method for fixing heat sink
12/02/2014US8902589 Semiconductor module and cooler
12/02/2014US8902340 Multi-core image processor for portable device
12/02/2014US8902123 Semiconductor device with wireless communication
12/02/2014US8901954 Active shield with electrically configurable interconnections
12/02/2014US8901756 Chip positioning in multi-chip package
12/02/2014US8901755 Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die
12/02/2014US8901754 Semiconductor device and manufacturing method thereof
12/02/2014US8901753 Microelectronic package with self-heating interconnect
12/02/2014US8901752 Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps
12/02/2014US8901751 Semiconductor device, electronic device, and semiconductor device manufacturing method
12/02/2014US8901750 Semiconductor package including multiple chips and separate groups of leads
12/02/2014US8901749 Semiconductor packages and electronic systems including the same
12/02/2014US8901748 Direct external interconnect for embedded interconnect bridge package
12/02/2014US8901747 Semiconductor chip layout
12/02/2014US8901746 Methods of manufacturing NAND flash memory devices
12/02/2014US8901745 Three-dimensional semiconductor devices
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