H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/10/2011	DE202011102587U1 Ventilator mit einem verbesserten Schaufelrad Fan with an improved impeller
11/10/2011	DE102011075154A1 Halbleitervorrichtung Semiconductor device
11/10/2011	DE102011017543A1 Elektronische Vorrichtung, Verdrahtungsplatine und Verfahren zur Fertigung der elektrischen Vorrichtung An electronic apparatus wiring board and method for manufacturing the electric device
11/10/2011	DE102010020211A1 Träger für ein optoelektronisches Bauelement, optoelektronische Vorrichtung mit einem Träger und Verfahren zur Herstellung eines Trägers für ein optoelektronisches Bauelement A carrier for an optoelectronic component, opto-electronic device comprising a support and method for producing a support for an optoelectronic component
11/10/2011	DE102010019448A1 Semiconductor product backtracking method for use during semiconductor product manufacturing, involves forwarding identification data to printer, and printing identification data on lead frame by inkjet printing
11/10/2011	DE102009057416B4 Leistungshalbleiter-Modul mit strukturierter Wärmeleitpastenschicht Power semiconductor module with textured thermal paste
11/10/2011	DE102007015817B4 Systemträgerband für elektronische Bauteile System carrier tape for electronic components
11/10/2011	DE102006022067B4 Herstellungsverfahren für ein elektronisches Bauelement und elektronisches Bauelement Manufacturing method for an electronic component and electronic component
11/10/2011	DE102005008772B4 Chip mit einem Bauelement in einem schrägen Bereich mit einer verringerten Stressabhängigkeit Chip with a component in an oblique area with a reduced stress dependence
11/09/2011	EP2385554A2 Image sensor package structure
11/09/2011	EP2385553A2 Image sensor package structure
11/09/2011	EP2385551A1 Silicon substrate wafer and test method
11/09/2011	EP2385550A1 Semiconductor device and its fabrication process
11/09/2011	EP2385549A2 Chip package, package module, and illumination apparatus including chip package module
11/09/2011	EP2385546A2 Passivation layer for a circuit device and method of manufacture
11/09/2011	EP2385534A1 Integrated transformer
11/09/2011	EP2195838B1 Semiconductor device and wire bonding method
11/09/2011	EP2193581B1 Spectrally tunable laser module
11/09/2011	EP2191506B1 Wrap-around overmold for electronic assembly
11/09/2011	EP1637526B1 Curable polycyclic compounds and process for the production thereof
11/09/2011	EP1532683B1 Prevention of tampering in electronic devices
11/09/2011	EP1119048B1 Lead frame having bumps thereon and manufacturing method thereof
11/09/2011	DE202011106311U1 Befestigung eines Kühlelements Attachment of a cooling element
11/09/2011	CN202034980U Super-long infrared receiver module
11/09/2011	CN202034888U Power supply module of integrated inductor
11/09/2011	CN202034372U Electronic triode with glass shell
11/09/2011	CN202034368U Hardware terminal pin smd
11/09/2011	CN202034367U Power module of non-welding terminal
11/09/2011	CN202034366U Thyristor converter valve tower for high-voltage direct-current electricity transmission
11/09/2011	CN202034365U DS square hole type aluminum alloy section bar
11/09/2011	CN202034364U Two-point type clamping device for high-power thyristor
11/09/2011	CN202034363U Novel clamping device for rectifier element
11/09/2011	CN202034362U Composite substrate for high-power element
11/09/2011	CN202034361U Semiconductor packaging structure
11/09/2011	CN202032930U Double-sided channel plate-type pulsating heat pipe
11/09/2011	CN102239579A Enhanced thermally isolated thermoelectrics
11/09/2011	CN102239556A Application of a self-assembled monolayer as an oxide inhibitor
11/09/2011	CN102239555A A semiconductor device including a reduced stress configuration for metal pillars
11/09/2011	CN102238857A Cooling unit, electronic device, and heat sink
11/09/2011	CN102237478A Method of mounting devices in substrate and device-mounting substrate structure thereof and electronic device
11/09/2011	CN102237406A Radio frequency lateral double-diffusion metal oxide semiconductor (LDMOS) device and manufacturing method thereof
11/09/2011	CN102237394A Size variable type semiconductor chip and semiconductor package using the same
11/09/2011	CN102237389A Semiconductor device and method for manufacturing the same
11/09/2011	CN102237385A Semiconductor device and method of manufacturing the same
11/09/2011	CN102237378A Image sensing device
11/09/2011	CN102237362A Standard cell, semiconductor device, and method for laying out and wiring the standard cell
11/09/2011	CN102237355A TFT array substrate and LCD panel
11/09/2011	CN102237354A Circuit board
11/09/2011	CN102237347A Power block and power semiconductor module using same
11/09/2011	CN102237346A Rectification module having good temperature characteristic
11/09/2011	CN102237344A Press-pack module with power overlay interconnection
11/09/2011	CN102237343A Semiconductor package realizing connection by connecting sheets and manufacturing method for semiconductor package
11/09/2011	CN102237342A Wireless communication module product
11/09/2011	CN102237341A Electrostatic discharge protection component and manufacturing method thereof
11/09/2011	CN102237340A Semiconductor device and method for testing a plurality of elements of semiconductor device
11/09/2011	CN102237339A Metal electroplating layer structure on back of chip and preparation method thereof
11/09/2011	CN102237338A Through-substrate vias with improved connections
11/09/2011	CN102237337A Semiconductor device having e-fuse structure and method of fabricating the same
11/09/2011	CN102237336A Integrated transformer
11/09/2011	CN102237335A Semiconductor device and method for manufacturinmg the same
11/09/2011	CN102237334A Chip on film (COF) and COF carrier tape
11/09/2011	CN102237333A Electroconductive element, electroconductive element manufacturing method, wiring element and information input device
11/09/2011	CN102237332A Semiconductor device and method of manufacturing the same
11/09/2011	CN102237331A Stack package and manufacturing method thereof
11/09/2011	CN102237330A Wafer level packaging
11/09/2011	CN102237329A Chip structure, chip bonding structure and manufacturing methods for chip structure and chip bonding structure
11/09/2011	CN102237328A Die structure and die bonding method
11/09/2011	CN102237327A Chip with thickened metal layer of press welding block and manufacturing method for chip
11/09/2011	CN102237326A Semiconductor device
11/09/2011	CN102237325A Filling material and filling method using the same
11/09/2011	CN102237324A Integrated circuit packaging structure and method
11/09/2011	CN102237323A Printed circuit board (PCB) carrier tape for packaging miniature radio frequency module with load capacitor
11/09/2011	CN102237322A Mounting base
11/09/2011	CN102237321A 半导体装置 Semiconductor device
11/09/2011	CN102237320A Electronic component packaging structure and manufacturing method thereof
11/09/2011	CN102237319A Package
11/09/2011	CN102237318A Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body
11/09/2011	CN102237317A Integrated circuit element and packaging component
11/09/2011	CN102237316A Integrated circuit element and forming method of bumping block structure
11/09/2011	CN102237311A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
11/09/2011	CN102237303A Multilevel interconnect structures and methods of fabricating same
11/09/2011	CN102237300A Through-substrate via and fabrication method thereof
11/09/2011	CN102237295A Semiconductor structure and manufacturing method thereof
11/09/2011	CN102237287A Method for manufacturing substrate and substrate structure
11/09/2011	CN102237283A Flip-chip bonding method and flip-chip bonding construction of non-array bumps
11/09/2011	CN102237281A Semiconductor device and manufacturing method thereof
11/09/2011	CN102237272A Semiconductor device and method of manufacturing semiconductor device
11/09/2011	CN102237187A Planar transformer and method for manufacturing same through integration
11/09/2011	CN102234787A Gas barrier film and organic device using the same
11/09/2011	CN102234731A Aluminum alloy sheet and application thereof
11/09/2011	CN101782703B Pixel array
11/09/2011	CN101769458B Light-emitting diode lamp and light engine thereof
11/09/2011	CN101764054B Compound semiconductor epi-wafer and preparation method thereof
11/09/2011	CN101752369B Semiconductor integrated circuit
11/09/2011	CN101752346B Structure and method thereof for testing reliability of gate oxide of high-voltage MOS device
11/09/2011	CN101740569B SOI substrate-based antifuse unit structure and preparation process thereof
11/09/2011	CN101737754B Projector
11/09/2011	CN101699620B 半导体装置 Semiconductor device
11/09/2011	CN101656246B Chip-stacked package structure of substrate with opening and packaging method thereof
11/09/2011	CN101655217B Lamp housing

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