H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/15/2011	US8058715 Package in package device for RF transceiver module
11/15/2011	US8058714 Overmolded semiconductor package with an integrated antenna
11/15/2011	US8058713 COF package and tape substrate used in same
11/15/2011	US8058712 Device having wire bond and redistribution layer
11/15/2011	US8058711 Filler for filling a gap and method for manufacturing semiconductor capacitor using the same
11/15/2011	US8058710 Interconnects having sealing structures to enable selective metal capping layers
11/15/2011	US8058708 Through hole interconnection structure for semiconductor wafer
11/15/2011	US8058707 Semiconductor devices having redundant through-die vias and methods of fabricating the same
11/15/2011	US8058701 Antifuse structures, antifuse array structures, methods of manufacturing the same
11/15/2011	US8058677 Stress buffer layer for ferroelectric random access memory
11/15/2011	US8058672 Semiconductor device and display device
11/15/2011	US8058648 Switching device and testing apparatus
11/15/2011	US8058639 Nitride semiconductor element and method for production thereof
11/15/2011	US8058565 Wiring board, semiconductor device, and method for manufacturing wiring board
11/15/2011	US8058185 Method of fabricating semiconductor integrated circuit device
11/15/2011	US8058107 Semiconductor die package using leadframe and clip and method of manufacturing
11/15/2011	US8058106 MEMS device package with vacuum cavity by two-step solder reflow method
11/15/2011	US8058104 Reversible leadless package and methods of making and using same
11/15/2011	US8057964 Photolithographic reticles with electrostatic discharge protection structures
11/15/2011	US8056198 Method of manufacturing electronic device
11/15/2011	CA2712949C A radio frequency circuit board topology
11/10/2011	WO2011140552A2 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint
11/10/2011	WO2011140143A1 Process for minimizing chipping when separating mems dies on a wafer
11/10/2011	WO2011139875A2 Tce compensation for ic package substrates for reduced die warpage assembly
11/10/2011	WO2011139606A1 Method for tracing individual dies
11/10/2011	WO2011139496A2 Techniques for interconnecting stacked dies using connection sites
11/10/2011	WO2011139417A2 Structure and method for manufacturing interconnect structures having self-aligned dielectric caps
11/10/2011	WO2011138949A1 Substrate on which element is to be mounted, and process for production thereof
11/10/2011	WO2011138899A1 Temperature controlling device, cooling device, and method for manufacturing temperature controlling device
11/10/2011	WO2011138877A1 Surface acoustic wave device and manufacturing method of same
11/10/2011	WO2011138818A1 Thin film transistor device, thin film transistor array device, organic el display device, and method for manufacturing thin film transistor device
11/10/2011	WO2011138743A1 Use of pyromellitic diimides in organic electronics and organic photovoltaics
11/10/2011	WO2011138452A1 Rfid seal for container packaging
11/10/2011	WO2011137767A1 Heat conducting device and electronic device applying the same
11/10/2011	WO2011137733A2 Power supply module and packaging and integrating method thereof
11/10/2011	WO2011137701A1 Electrostatic protector and manufacturing method thereof
11/10/2011	WO2011115859A3 Biaxial strained field effect transistor devices
11/10/2011	WO2011113721A3 Optoelectronic component and method for the production thereof
11/10/2011	WO2011113720A3 Optoelectronic component and method for the production thereof
11/10/2011	WO2011108358A3 Dispenser for highly viscous fluid
11/10/2011	WO2011090572A3 A method to form lateral pad on edge of wafer
11/10/2011	WO2011085260A3 Electronic devices and components for high efficiency power circuits
11/10/2011	WO2011082214A3 Leadframe-based premolded package having acoustic air channel for microelectromechanical system (mems) device
11/10/2011	WO2011081428A3 Pop package and manufacturing method thereof
11/10/2011	WO2011071726A3 Curable resin compositions useful as underfill sealants for low-k dielectric-containing semiconductor devices
11/10/2011	WO2011058436A3 Circuit board forming diffusion bonded wall of vapor chamber
11/10/2011	WO2010144823A3 Method for manufacturing tight pitch, flip chip integrated circuit packages
11/10/2011	US20110273941 Techniques for refreshing a semiconductor memory device
11/10/2011	US20110273857 Contact springs for silicon chip packages
11/10/2011	US20110273154 Semiconductor Device
11/10/2011	US20110272829 Epoxy resin composition for optical-semiconductor element encapsulation and optical-semiconductor device using the same
11/10/2011	US20110272828 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
11/10/2011	US20110272827 Adhesive Flexible Barrier Film, Method Of Forming Same, And Organic Electronic Device Including Same
11/10/2011	US20110272826 Method for producing an electric functional layer on a surface of a substrate
11/10/2011	US20110272825 Stacked die assembly having reduced stress electrical interconnects
11/10/2011	US20110272824 Semiconductor Device and Method of Forming Channels in Back Surface of FO-WLCSP for Heat Dissipation
11/10/2011	US20110272823 Through substrate vias
11/10/2011	US20110272822 Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors
11/10/2011	US20110272821 Wiring Substrate Manufacturing Method and Wiring Substrate
11/10/2011	US20110272820 Stacked semiconductor package and method for manufacturing the same
11/10/2011	US20110272819 Wafer level package and methods of fabricating the same
11/10/2011	US20110272818 Semiconductor device for preventing crack in pad region and fabricating method thereof
11/10/2011	US20110272817 Semiconductor device and method for fabricating semiconductor device
11/10/2011	US20110272816 Wiring over substrate, semiconductor device, and methods for manufacturing thereof
11/10/2011	US20110272815 Semiconductor device and layout design method for the same
11/10/2011	US20110272814 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint
11/10/2011	US20110272813 Semiconductor device and method of manufacturing semiconductor device
11/10/2011	US20110272812 Structure and method for manufacturing interconnect structures having self-aligned dielectric caps
11/10/2011	US20110272811 Using unstable nitrides to form semiconductor structures
11/10/2011	US20110272810 Structure and method for air gap interconnect integration
11/10/2011	US20110272809 Semiconductor structure and manufacturing method thereof
11/10/2011	US20110272808 Semiconductor process and structure
11/10/2011	US20110272807 Integrated circuit packaging system having a cavity
11/10/2011	US20110272806 Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate
11/10/2011	US20110272805 Semiconductor package, semiconductor device, and semiconductor module
11/10/2011	US20110272804 Selecting chips within a stacked semiconductor package using through-electrodes
11/10/2011	US20110272803 Silicon contactor including plate type powders for testing semiconductor device
11/10/2011	US20110272802 Bump, method for forming the bump, and method for mounting substrate having the bump thereon
11/10/2011	US20110272801 Semiconductor device with connection pads provided with inserts
11/10/2011	US20110272800 Semiconductor package and method of manufacturing same
11/10/2011	US20110272799 Ic chip and ic chip manufacturing method thereof
11/10/2011	US20110272798 Chip unit and stack package having the same
11/10/2011	US20110272797 Semiconductor light emitting device and power semiconductor device
11/10/2011	US20110272796 Nano-structured Gasket for Cold Weld Hermetic MEMS Package and Method of Manufacture
11/10/2011	US20110272795 Semiconductor device packaging structure and packaging method
11/10/2011	US20110272794 Pre-molded clip structure
11/10/2011	US20110272793 Lead frame, semiconductor apparatus using this lead frame, intermediate product thereof and manufacturing method thereof
11/10/2011	US20110272792 Die backside standoff structures for semiconductor devices
11/10/2011	US20110272790 Semiconductor chip and semiconductor wafer
11/10/2011	US20110272781 Semiconductor device
11/10/2011	US20110272779 Efuse containing sige stack
11/10/2011	US20110272778 Semiconductor device
11/10/2011	US20110272768 Lead Frame and Method of Producing Lead Frame
11/10/2011	US20110272764 Semiconductor Device Having e-Fuse Structure And Method Of Fabricating The Same
11/10/2011	US20110272747 Electronic component
11/10/2011	US20110272716 Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
11/10/2011	US20110272692 Size variable type semiconductor chip and semiconductor package using the same
11/10/2011	US20110272367 Device for supporting solar modules
11/10/2011	US20110272191 Potting for electronic components
11/10/2011	US20110271757 Wiring substrate, piezoelectric oscillator, gyrosensor and manufacturing method of wiring substrate

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