H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/16/2011	CN102244063A Semiconductor package with polygonal chip base and manufacturing method of semiconductor package
11/16/2011	CN102244062A Semiconductor packaging structure and process
11/16/2011	CN102244061A Low-k chip package structure
11/16/2011	CN102244060A Packaging base plate and manufacturing method thereof
11/16/2011	CN102244059A Semiconductor device for preventing crack in pad region and fabricating method thereof
11/16/2011	CN102244058A Quad flat lead-free semiconductor package and manufacturing method thereof and metal plate used in manufacturing method
11/16/2011	CN102244057A Semiconductor package and manufacturing method thereof
11/16/2011	CN102244056A Bonding structure for bonding semiconductor wafer
11/16/2011	CN102244055A Integrated circuit chip and manufacturing method thereof
11/16/2011	CN102244054A Chip package and method for forming the same
11/16/2011	CN102244053A Semiconductor light emitting device and power semiconductor device
11/16/2011	CN102244052A Cooling jacket and electronic device having the same
11/16/2011	CN102244051A High-performance directional heat conduction copper-base diamond composite material and preparation method thereof
11/16/2011	CN102244050A Heat radiator and manufacturing method thereof
11/16/2011	CN102244049A Circuit board assembly and heat radiation structure thereof
11/16/2011	CN102244048A Double-chip simulator and double-chip simulation heat dissipation system
11/16/2011	CN102244047A Chip package and method for forming the same
11/16/2011	CN102244046A Passivated protection diode chip and processing method thereof
11/16/2011	CN102244045A Diode chip and processing technology thereof
11/16/2011	CN102244044A Diode die-pressing discharging base and novel die-pressing discharging process thereof
11/16/2011	CN102244043A Bonding pad structure, wire support plate and integrated circuit chip
11/16/2011	CN102244042A Adhesive composition, circuit connecting material and connecting structure of circuit member
11/16/2011	CN102244041A 半导体器件 Semiconductor devices
11/16/2011	CN102244040A Double-substrate type storage card capsulation method and construction thereof
11/16/2011	CN102244032A Semiconductor device and maufacturing method thereof
11/16/2011	CN102244031A Contact hole and semiconductor device as well as formation method of contact hole and semiconductor device
11/16/2011	CN102244022A Manufacturing method of single intermetallic compound micro-interconnecting structure of flip chip
11/16/2011	CN102244020A Package method and package die structure of composite material lead frame
11/16/2011	CN102244019A 半导体装置及其制造方法 Semiconductor device and manufacturing method
11/16/2011	CN102244016A Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
11/16/2011	CN102244013A Semiconductor device and manufacturing method thereof
11/16/2011	CN102244012A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/16/2011	CN102244011A Manufacturing process of water-cooled liquid cooling plate
11/16/2011	CN102243668A Thermal-expandability three-dimensional parallel cooling integration method, namely, on-chip system key technology for massively parallel computation
11/16/2011	CN102243383A Fan-out signal line structure and display panel
11/16/2011	CN102241870A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
11/16/2011	CN102241807A Epoxy resin composition for optical-semiconductor element encapsulation and optical-semiconductor device using the same
11/16/2011	CN101905859B Method for preparing wafer-level uniform-dimension glass microcavity by positive pressure thermal forming
11/16/2011	CN101852957B Active element array substrate
11/16/2011	CN101834177B SOC (System On a Chip) chip device
11/16/2011	CN101834164B Power distribution system
11/16/2011	CN101826533B Switching component structure of active array-type display
11/16/2011	CN101817498B Method for preparing low-pollution high-yield wafer-level uniform-size glass micro-cavity
11/16/2011	CN101804961B Method for performing hermetic package by using spherical glass micro-cavity
11/16/2011	CN101764136B Interdigital structure capable of regulating channel current of vertical gate SOI CMOS devices
11/16/2011	CN101752327B Semiconductor packaging piece with heat dissipation structure
11/16/2011	CN101738805B 像素结构 Pixel structure
11/16/2011	CN101730443B Electronic device and heat-radiating unit thereof
11/16/2011	CN101689535B Semiconductor device and its manufacturing method, and display and its manufacturing method
11/16/2011	CN101681894B 集成电路封装件和集成电路装置 An integrated circuit package and the integrated circuit device
11/16/2011	CN101673735B A design structure of mixed polysilicon distance unit under design rule of default polysilicon distance unit and system
11/16/2011	CN101663925B 电子电路装置 Electronic circuit means
11/16/2011	CN101645452B Alternating current light-emitting diode structure
11/16/2011	CN101641776B 半导体器件 Semiconductor devices
11/16/2011	CN101604701B Light emitting diode having a thermal conductive substrate and method of fabricating the same
11/16/2011	CN101600326B Electronic apparatus cooling device
11/16/2011	CN101529566B Method for forming wiring film, transistor, and electronic device
11/16/2011	CN101512685B Integrated circuit providing overvoltage protection for low voltage lines
11/16/2011	CN101483163B Window type ball grid array encapsulation construction and substrate thereof
11/16/2011	CN101471361B Image sensor and method for manufacturing the sensor
11/16/2011	CN101454896B Flexible joint methodology to attach a die on an organic substrate
11/16/2011	CN101414575B Method for processing silicon-based liquid crystal metal routing
11/16/2011	CN101409266B Package structure
11/16/2011	CN101388371B Semiconductor device, display device and manufacture method thereof
11/16/2011	CN101355060B Power semiconductor module with connecting devices
11/16/2011	CN101351815B Manufacturing method and device for making an in-mold circuit comprising a chip
11/16/2011	CN101345230B Integrated circuit structure and its forming method
11/16/2011	CN101330089B Detection device and electronic apparatus
11/16/2011	CN101299431B Display panel and method for producing thin-film transistor substrate
11/16/2011	CN101266984B Semiconductor device and method of manufacturing the same
11/16/2011	CN101252109B Optoelectronic module provided with at least one photoreceptor cell
11/16/2011	CN101221847B Label type polymer base ESD protection device and manufacturing method thereof
11/16/2011	CN101127349B Plastic overmolded packages with mechanically decoupled lid attach attachment
11/16/2011	CN101124857B Package mounting module and package base plate module
11/16/2011	CN101064294B Circuit device and method for manufacturing circuit device
11/15/2011	US8059420 Surface mountable device
11/15/2011	US8059411 Vehicular electronics assembly
11/15/2011	US8059057 Reduced inductance interconnect for enhanced microwave and millimeter-wave systems
11/15/2011	US8058892 Radiofrequency contactor
11/15/2011	US8058737 Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module and method for manufacturing electronic element module, and electronic information device
11/15/2011	US8058736 Semiconductor device having heat spreader with center opening
11/15/2011	US8058735 Wafer-level chip scale package having stud bump and method for fabricating the same
11/15/2011	US8058734 Semiconductor device and method of manufacturing the same
11/15/2011	US8058733 Self-aligned contact set
11/15/2011	US8058732 Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same
11/15/2011	US8058731 Introducing defects into a highly conductive copper; modifying enhanced electromigration behavior and/or electrical performance; advanced semiconductor devices
11/15/2011	US8058729 Titanium nitride films
11/15/2011	US8058728 Diffusion barrier and adhesion layer for an interconnect structure
11/15/2011	US8058727 Standing chip scale package
11/15/2011	US8058726 Semiconductor device having redistribution layer
11/15/2011	US8058725 Package structure and package substrate thereof
11/15/2011	US8058724 Holistic thermal management system for a semiconductor chip
11/15/2011	US8058723 Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof
11/15/2011	US8058722 Power semiconductor module and method of manufacturing the same
11/15/2011	US8058721 Package structure
11/15/2011	US8058720 Semiconductor package
11/15/2011	US8058719 Integrated circuit with flexible planer leads
11/15/2011	US8058718 Package substrate embedded with semiconductor component
11/15/2011	US8058717 Laminated body of semiconductor chips including pads mutually connected to conductive member
11/15/2011	US8058716 Integrated circuit devices with stacked package interposers

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